Yong, Singapore
Anthony Yong, Singapore SG
Patent application number | Description | Published |
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20090014543 | INTEGRATED CIRCUIT SYSTEM WITH ANTENNA - A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna. | 01-15-2009 |
Chang Beom Yong, Singapore SG
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20130147055 | Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV through Semiconductor Wafer - A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. An insulating lining is formed around the conductive vias and a conductive layer is formed over the insulating lining. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer. A first insulating layer is formed over the surface of the semiconductor wafer and conductive vias. A first portion of the first insulating layer is removed and a second portion of the first insulating layer remains as guard rings around the conductive vias. A conductive layer is formed over the conductive vias. A second insulating layer is formed over the surface of the semiconductor wafer, guard rings, and conductive vias. A portion of the second insulating layer is removed to expose the conductive vias and a portion of the guard rings. | 06-13-2013 |
20130299998 | Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV Through Semiconductor Wafer - A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. An insulating lining is formed around the conductive vias and a conductive layer is formed over the insulating lining. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer. A first insulating layer is formed over the surface of the semiconductor wafer and conductive vias. A first portion of the first insulating layer is removed and a second portion of the first insulating layer remains as guard rings around the conductive vias. A conductive layer is formed over the conductive vias. A second insulating layer is formed over the surface of the semiconductor wafer, guard rings, and conductive vias. A portion of the second insulating layer is removed to expose the conductive vias and a portion of the guard rings. | 11-14-2013 |
20140199838 | Semiconductor Device and Method of Forming Through-Silicon-Via with Sacrificial Layer - A semiconductor device can be formed by first providing a semiconductor wafer, and forming a conductive via into the semiconductor wafer. A portion of the semiconductor wafer can be removed so that the conductive via extends above a surface of the semiconductor wafer. A first insulating layer can be formed over the surface of the semiconductor wafer and the conductive via, followed by a second insulating layer, the second insulating layer having a different material composition than the first insulating layer. Portions of the insulating layers can be removed to expose the conductive via. | 07-17-2014 |
20140264851 | Semiconductor Device and Method of Forming UBM Structure on Back Surface of TSV Semiconductor Wafer - A semiconductor device has a plurality of conductive vias formed through the semiconductor die with a first insulating layer around the conductive vias. A recess is formed in the first insulating layer around the conductive vias by LDA. A portion of the semiconductor wafer is removed by LDA after forming the recess in the first insulating layer so that the conductive vias extend above a surface of the semiconductor wafer. The first insulating layer extends to the surface of the semiconductor wafer or above the surface of the semiconductor wafer. A second insulating layer is formed over the surface of the semiconductor wafer and conductive vias. A first portion of the second insulating layer is removed by LDA, while leaving a second portion of the second insulating layer over the surface of the semiconductor wafer around the conductive vias. An electroless plated bump is formed over the conductive vias. | 09-18-2014 |
20140300002 | Semiconductor Device and Method of Forming Conductive Vias Using Backside Via Reveal and Selective Passivation - A semiconductor device includes a plurality of semiconductor die and a plurality of conductive vias formed in the semiconductor die. An insulating layer is formed over the semiconductor die while leaving the conductive vias exposed. An interconnect structure is formed over the insulating layer and conductive vias. The insulating layer is formed using electrografting or oxidation. An under bump metallization is formed over the conductive vias. A portion of the semiconductor die is removed to expose the conductive vias. The interconnect structure is formed over two or more of the conductive vias. A portion of the semiconductor die is removed to leave the conductive vias with a height greater than a height of the semiconductor die. A second insulating layer is formed over the first insulating layer. A portion of the second insulating layer is removed to expose the conductive via. | 10-09-2014 |
Chang Bum Yong, Singapore SG
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20130147036 | Semiconductor Device and Method of Forming UBM Structure on Back Surface of TSV Semiconductor Wafer - A semiconductor device has a plurality of conductive vias formed through the semiconductor die with a first insulating layer around the conductive vias. A recess is formed in the first insulating layer around the conductive vias by LDA. A portion of the semiconductor wafer is removed by LDA after forming the recess in the first insulating layer so that the conductive vias extend above a surface of the semiconductor wafer. The first insulating layer extends to the surface of the semiconductor wafer or above the surface of the semiconductor wafer. A second insulating layer is formed over the surface of the semiconductor wafer and conductive vias. A first portion of the second insulating layer is removed by LDA, while leaving a second portion of the second insulating layer over the surface of the semiconductor wafer around the conductive vias. An electroless plated bump is formed over the conductive vias. | 06-13-2013 |
20130161824 | Semiconductor Device and Method of Forming Insulating Layer in Notches Around Conductive TSV for Stress Relief - A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer. A notch is formed in the semiconductor wafer around each of the conductive vias. The notch around the conductive vias can be formed by wet etching, dry etching, or LDA. A first insulating layer is formed over a surface of the semiconductor wafer and conductive vias and into the notch to provide stress relief between the conductive vias and semiconductor wafer. A portion of the first insulating layer is removed to expose the conductive vias. A first conductive layer and second insulating layer can be formed around the conductive vias. A second conductive layer can be formed over the conductive vias. The notch can extend into the second insulating layer. | 06-27-2013 |
20150179544 | Semiconductor Device and Method of Wafer Thinning Involving Edge Trimming and CMP - A semiconductor device has a substrate including a plurality of conductive vias formed vertically and partially through the substrate. An encapsulant is deposited over a first surface of the substrate and around a peripheral region of the substrate. A portion of the encapsulant around the peripheral region is removed by a cutting or laser operation to form a notch extending laterally through the encapsulant to a second surface of the substrate opposite the first surface of the substrate. A first portion of the substrate outside the notch is removed by chemical mechanical polishing to expose the conductive vias. A second portion of the substrate is removed by backgrinding prior to or after forming the notch. The encapsulant is coplanar with the substrate after revealing the conductive vias. The absence of an encapsulant/base material interface and coplanarity of the molded substrate results in less over-etching or under-etching and fewer defects. | 06-25-2015 |
Chern Han Yong, Singapore SG
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20110023692 | APPARATUS AND METHOD FOR TRANSFORMING AN INPUT SOUND SIGNAL - An apparatus for transforming an input sound signal comprises a synthesiser which manipulates, in accordance with a manipulation parameter, a pitch deviation envelope to derive a manipulated pitch deviation envelope. A filter transforms the input sound signal from a resampling of the input sound signal with respect to the manipulated pitch deviation envelope. The manipulation parameter may be a user-defined peak pitch deviation of an output sound signal. Another apparatus for transforming an input sound signal comprises a synthesiser which manipulates, in accordance with a manipulation parameter, a pitch deviation envelope selected with reference to the manipulation parameter to derive a manipulated pitch deviation envelope. | 02-03-2011 |
Ching-Tung Yong, Singapore SG
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20140118734 | Atomizing Furnace - An atomizing furnace, in particular for atomic absorption spectroscopy, includes a tube furnace apparatus and a sample carrier. The sample carrier is disposed within the tube furnace apparatus, and includes at least three supporting protrusions by which the sample carrier is punctually supported on an interior wall of the tube furnace apparatus. The supporting protrusions are disposed in a common plane running through a longitudinal axis of the sample material, wherein at least two supporting protrusions are formed on respectively opposite ends of the sample carrier. | 05-01-2014 |
Donovan Yong, Singapore SG
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20150066753 | BILL PAY SYSTEM USING BILL PAY CODE - Systems and methods for facilitating bill payment and presentment are provided using bill pay codes generated by a biller and validated by a bill presentment and payment system. A mobile service provider enables consumers having pre-paid mobile telephone accounts to employ embodiments of the systems and methods. | 03-05-2015 |
Eu Leong Yong, Singapore SG
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20090053338 | Method for the preparation of phytoprogestogenic extracts from rhizoma ligusticum chuanxiong and uses thereof - A method of extracting phytoprogestogenic compounds from herbs and their use in preparing a medicament for treating humans requiring progesterone replacement or supplement. Assay systems to quantify progesterone and progestogenic receptor activity and a method for assembling a kit for the assays are also provided. | 02-26-2009 |
Fui-Fong Yong, Singapore SG
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20080260894 | USE OF A MULTI-PROTEASE SYSTEM TO IMPROVE THE PROTEIN DIGESTIBILITY OF ANIMAL FEEDS CONTAINING VEGETABLE MEALS - Disclosed is a method for improving the digestibility and amino acid profile of proteinaceous animal feed products by the use of a combination of acidic, alkaline and/or neutral proteases. The selection and amounts of the proteases is based on the particular animal feed product and on the conditions of the gastrointestinal tract of the animal to be fed the treated animal feed. Use of the treated animal feed will reduce the amount of amino acid supplementation required, reduce the amount of nitrogen in animal feces, and improve the economical performance of the animal. | 10-23-2008 |
20080299098 | Broad-Spectrum Antibacterial and Antifungal Activity of Lactobacillus Johnsonii D115 - The present invention demonstrated the potential use of | 12-04-2008 |
Han Keong Yong, Singapore SG
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20150052816 | ROTATABLE SLIDING WINDOW - The present invention relates to a window and more particularly, to a window incorporating means for effecting pivotal movement of the window panel out of the plane in which the panel is slidable so as to facilitate cleaning of both sides of the window panel. The window includes a top rail guide member | 02-26-2015 |
Inn Nam Yong, Singapore SG
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20080244075 | High performance real-time data multiplexer - A method and system for enabling peer computers to communicate with each other is described. Data of varying data types from a plurality of data sources are multiplexed for delivery through at least one common peer connection. | 10-02-2008 |
20090049162 | BUFFER MANIPULATION - A method and system for increasing throughput of incoming data and outgoing data through buffer manipulation is described. A channel connection is provided for determining which buffers are used for reading incoming data. Buffer manipulation includes enabling the reading of a subset of the incoming data directly into an application buffer associated with an application when a first set of criteria is met and enabling the reading of existing data from an intermediate buffer and storing the subset of the incoming data in the intermediate buffer when a second set of criteria is met. | 02-19-2009 |
Jean Ai Pearly Yong, Singapore SG
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20140336074 | METHOD FOR PREPARING IMPROVED CARDIOMYCOCYTE-LIKE CELLS - The present invention relates to the field of cell differentiation. In particular, the present invention relates to a method for preparing improved cardiomyocyte-like cells differentiated from at least one multipotent or pluripotent cell, comprising a step of contacting the cardiomyocyte-like cell(s) with at least one agent to promote and/or induce integrin subunit alpha-V (integrin α | 11-13-2014 |
John Ming Shyan Yong, Singapore SG
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20100137810 | SAFETY GUARDS FOR SYRINGE NEEDLE - A safety guard ( | 06-03-2010 |
Joon Keng Yong, Singapore SG
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20130038448 | Access Control System - An access control system is disclosed comprising a credential reader arranged to gather at least one credential from a person desiring to pass through an access point associated with the access control system, the system being arranged to use the at least one credential to provide an indication about the identity of the person. The system also comprises at least one access control device controlling access through a respective access point such that a person is allowed or denied access dependent on whether the person is positively identified, and a data storage device that stores data indicative of a current security level applicable for each access point associated with the system, the security level defining the criteria required to provide a positive identification of the person. Stored security level data can be modified to change the criteria required for positively identifying a person. | 02-14-2013 |
Kar Ming Yong, Singapore SG
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20100124894 | Phase-Lock Loop - A phase-lock loop having a reduced lock time in comparison with the conventional art. The phase-lock loop compares an output signal thereof with a reference signal, and alters a control signal in response thereto such that the output signal may have a desired frequency. | 05-20-2010 |
20110210798 | Ring Oscillator for Providing Constant Oscillation Frequency - Some embodiments disclosed herein relate to techniques for providing a relatively constant oscillation frequency. In some instances, these techniques can make use of a ring oscillator that is powered by an adaptive voltage supply. The adaptive voltage supply provides a temperature-dependent supply voltage to respective delay elements in the ring oscillator, such that the oscillation frequency of the ring oscillator is approximately constant over a predetermined temperature range. For example, if temperature increases, the supply voltage can be increased proportionally, thereby tending to limit variation in the oscillation frequency delivered by the ring oscillator. | 09-01-2011 |
20120105117 | Phase-Lock Loop - A phase-lock loop having a reduced lock time in comparison with the conventional art. The phase-lock loop compares an output signal thereof with a reference signal, and alters a control signal in response thereto such that the output signal may have a desired frequency. | 05-03-2012 |
Khai Leong Yong, Singapore SG
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20090216898 | WIRELESS TRANSPORTATION PROTOCOL - A data transportation protocol ( | 08-27-2009 |
20100007768 | WIRELESS STORAGE DEVICE - There is provided a storage device including: a wireless communication link to communicate between the storage device and a digital imaging device; a storage medium for storing a digital image from the digital imaging device; where the digital image is wirelessly transferred between digital imaging device and the storage medium in real-time. The storage device enables the real-time storage of a digital image captured from a digital imaging device using a wireless interface. The storage device provides standalone operation without the need for a personal computer. The digital images stored in the storage device can be transmitted to peripheral components either by a wire connection or wireless transmission to such peripheral devices as a printer or directly to a web site for image loading and sharing. There is also provided a method of storing a digital image in a storage device. | 01-14-2010 |
20130227220 | Data Storage Device and Method of Managing a Cache in a Data Storage Device - A data storage device is provided. The data storage device includes a data storage medium having a plurality of data blocks, a cache having a plurality of cache blocks, wherein each cache block is identified by a cache block address, a cache control memory including a memory element for each data block configured to store the cache block address of the cache block in which data of the data block is written. | 08-29-2013 |
20140019680 | DATA STORAGE SYSTEM, METHOD OF WRITING TO STORAGE IN THE DATA STORAGE SYSTEM, HARD DISK AND METHOD OF FORMING THE HARD DISK - In various embodiments, a data storage system may be provided. The data storage system may include a storage. The storage may include a first portion and a second portion. The data storage system may further include a determination circuit configured to determine whether to write data to the first portion or to the second portion. The data storage system may also include a control circuit configured to control writing the data to the first portion in a log structured manner. | 01-16-2014 |
20140115238 | STORAGE CONTROLLERS AND STORAGE CONTROL METHODS - According to various embodiments, a storage controller configured to control storage of data in a pre-determined area of a storage medium may be provided. The storage controller may include a memory configured to store a write pointer, a reclaim pointer, and a wrapped around pointer. The write pointer may indicate a location of the storage medium to write incoming data. The reclaim pointer may indicate a location of the storage medium to perform a space reclamation. The wrapped around pointer may indicate a location of the storage medium where writing is to continue if writing of data reaches an end of the pre-determined area. | 04-24-2014 |
20150146322 | DATA STORAGE DEVICE - According to an embodiment of the present invention, a data storage device comprising a motor having a stator is disclosed. The stator may include a substrate having a first surface and a second surface opposite to the first surface; and a n-phase winding arrangement having n phase windings; wherein each phase winding comprises m flat fractional-pitch coils arranged on the first surface of the substrate such that the coils are spaced apart uniformly along a closed loop and connected in series; wherein each coil together with an angular section of the substrate between the coil and an adjacent coil of the same phase winding defines a stator pole-pair; and wherein m is an integer larger than 1. | 05-28-2015 |
Kian Soon Yong, Singapore SG
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20160124122 | Optical Article Comprising an Acrylic Substrate Coated with a Specific Hard-Coat - This invention is related to an optical article, such as an ophthalmic lens, comprising a an acrylic substrate (1) coated with a specific hard-coat (2) formed from a composition comprising a hydrolyzed alkoxysilane, a colloidal metal oxide and a poly-glyceryl ether. | 05-05-2016 |
Kin Sen Yong, Singapore SG
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20150052816 | ROTATABLE SLIDING WINDOW - The present invention relates to a window and more particularly, to a window incorporating means for effecting pivotal movement of the window panel out of the plane in which the panel is slidable so as to facilitate cleaning of both sides of the window panel. The window includes a top rail guide member | 02-26-2015 |
Kol Jia Yong, Singapore SG
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20150080315 | SALL4 And Uses Thereof - The invention is directed to methods of treating a solid tumor which expresses SALL4 and Phosphatase and Tensin Homolog (PTEN) in an individual in need thereof, comprising administering to the individual an effective amount of a composition that inhibits SALL4. In addition, the invention is directed methods of method of detecting an aggressive cancer in an individual in need thereof comprising detecting whether one or more cancer cells of the individual expresses SALL4, wherein if SALL4 is detected in the one or more cancer cells, then an aggressive cancer is detected in the individual, and methods of method of detecting a poor prognosis of a patient with cancer in an individual in need thereof, comprising detecting whether one or more cancer cells of the patient expresses SALL4, wherein if SALL4 is detected in the one or more cancer cells of the patient, then a poor prognosis is detected in the patient. | 03-19-2015 |
Kuu Bi Yong, Singapore SG
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20140350881 | ANGLE MEASURING DEVICE AND METHODS FOR CALIBRATION - The invention relates to a method for calibration of 2-axis high precision digital angle measurement device, particularly for initializing a planar angle measuring device and an apparatus to generate simultaneous two-dimensional resultant planar angles of full 360° rotation. The planar angle measurement device is, typically but not exclusively, used in concurrent two-dimensional angles leveling, setting and alignment tasks for precision machine setup in the fields of precision engineering and metrology applications. | 11-27-2014 |
Liu Yong, Singapore SG
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20100054123 | METHOD AND DEVICE FOR HIGN UTILIZATION AND EFFICIENT FLOW CONTROL OVER NETWORKS WITH LONG TRANSMISSION LATENCY - The present invention is to provide a method and device which can determine current available bandwidth for each Transport Control Protocol (TCP) connection and adjust window size dynamically according to the available bandwidth to achieve high network utilization and efficient flow control in the same time without the need to buffer any received TCP packets, which can work with and without support of large window option. The device classifies incoming traffic into several groups (public and private), monitors and allocates the available bandwidth for each group. To enable flow control, the device also records the initial window size value for each connection and compares it with the original window size value for a newly received TCP packet. If the original window size value received from TCP receivers changes, the device varies the modified window size accordingly to enable efficient flow control in the same device as well. | 03-04-2010 |
Mann Weng Yong, Singapore SG
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20090069702 | Method and apparatus for a heart rate indicator fabric - The present invention relates to a method and apparatus for having a fabric that is able to indicate heart rate zones by using colour indicators which comprises of one or a plurality of sensors embedded in the fabric for the detection of heart rate and the signal from the sensor is transmitted to at least a microprocessor whereby the output from the microprocessor will drive at least one or a plurality of light emitting devices and audible signals will be produced. The emitted light is propagated through a medium providing a visual indication to an observer of heart rate zone on the fabric. The audio signal is driven by output signal from the microprocessor to indicate different heart rate zones. Said medium is attached or woven into natural or synthetic yarn to produce light transmitting fabric that reveals different colours. Said sensors, microprocessor and light emitting devices are embedded or attached in the fabric. | 03-12-2009 |
Ming Shyan John Yong, Singapore SG
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20110146364 | METHOD AND APPARATUS FOR FORGING - An apparatus ( | 06-23-2011 |
20150052963 | METHOD AND APPARATUS FOR FORGING - An apparatus ( | 02-26-2015 |
Pow Hing Yong, Singapore SG
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20140268426 | ARM ASSEMBLY WITH LIFT TAB - An arm assembly for a disc drive. The arm assembly has a load arm for supporting a slider and has a lift tab with a ramp-engaging region for parking the load arm when not in use. This ramp-engaging region has an outer surface defined by a first radius and a second radius different than the first radius. | 09-18-2014 |
Say Wan Yong, Singapore SG
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20150315386 | METAL FREE ACID DYES, PROCESS FOR THE PRODUCTION THEREOF AND THEIR USE - The present invention relates to dyes of formula (1) | 11-05-2015 |
Seah Seang Yong, Singapore SG
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20110088218 | HINGE MECHANISM FOR A PORTABLE DEVICE - A hinge mechanism for a portable device, the hinge mechanism comprising: a base having a planar surface; a sliding plate having a planar surface; a revolving member located adjacent to a longitudinal edge of the base, the revolving member being capable of revolving and projecting from the base; a dampener located in the base for restraining movement of the revolving member to retain the revolving member in its revolved and projected position; a first joint for coupling the revolving member to the sliding plate, and a plurality of guides arranged longitudinally and transversely in the sliding plate, wherein in a first mode of operation, the sliding plate is slidable over the base in the longitudinal or transverse directions of the base while the planar surface of the sliding plate faces the planar surface of the base, the plurality of guides facilitates the sliding plate to slide over the respective longitudinal and transverse directions of the base by guiding the first joint to run along the longitudinal and transverse arrangements of the plurality of guides when the sliding plate is slid over the base, wherein in a second mode of operation, the sliding plate is substantially slid over the base to a position in the transverse direction of the base, the sliding plate is pivotable about the longitudinal edge of the base to a configuration such that the planar surface of the sliding plate forms an oblique angle relative to the planar surface of the base, the revolving member being adapted to revolve and project from the base when the sliding plate is pivoted into the configuration. | 04-21-2011 |
20110090300 | IMAGE CAPTURE APPARATUS AND METHODS FOR PROVIDING AN IMAGE WITH EYE-TO-EYE CONTACT WITH A RECIPIENT - There is provided an image capturing apparatus able to be draped onto a stand. The apparatus includes an image capture module for capturing at least one image; and a flexible cable originating from the image capture module for connection of the image capture module to a host. The flexible cable may be for supporting the image capture module at a desired position when the image capturing apparatus is draped onto the stand. Advantageously, locating the image capture module at the desired position enables a user to look at a lens of the image capture module in a manner where a recipient of an image of the user views the user looking directly at the recipient during a video conference session. There are also provided methods for enabling a user to appear to be looking directly at a recipient of an image of the user during a video conferencing session. | 04-21-2011 |
20110193944 | DEVICE AND METHOD FOR SCANNING AN OBJECT ON A WORKING SURFACE - A device and method for scanning an object on a working surface, the device comprising: a body located adjacent to the working surface; two or more cameras mounted on the body at a location elevated adjacently above the working surface for capturing images of the object on the working surface, the two or more cameras being angled such that their range of image captures overlap and the common overlapping region of the range of image captures of the two or more cameras corresponds with the size of the working surface, the two or more cameras being spaced apart such that each of the two or more cameras captures a different angle of the common overlapping region; and a processing unit capable of correcting skewed images of the working surface captured by the two or more cameras and capable of converting the images captured by the two or more cameras into a three dimensional image. | 08-11-2011 |
Sim Ying Yong, Singapore SG
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20090073663 | Wrap-around overmold for electronic assembly - An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly. | 03-19-2009 |
20090197478 | Interlocking overmold for electronic assembly - An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector having a thermoplastic body and electrical conducting elements embedded in and extending through the thermoplastic body to define internal and external connectors, and an overmold body that is mechanically interlocked with protuberances integrally formed on the thermoplastic body of the electrical connector. The mechanical interlocking relationship between the overmold body and the thermoplastic body of the electrical connector eliminates or minimizes delamination problems that could otherwise occur during thermal cycling, reduces or eliminates stringent control on cleanliness and texture of surfaces of the thermoplastic body of the electrical connector that interface with the overmold body, and eliminate or reduce costs associated with overcoming problems associated with delamination during thermal cycling. | 08-06-2009 |
20150084150 | BALL GRID ARRAY PACKAGED CAMERA DEVICE SOLDERED TO A SUBSTRATE - An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink. | 03-26-2015 |
20160006908 | MOLDED CAMERA - A molded camera suitable for use on a vehicle to capture an image of a field-of-view about the vehicle includes a circuit board assembly, a pigtail connector, an imager device, a lens assembly, and a polymeric compound. The pigtail connector is attached to the circuit board assembly. The imager device is attached to the circuit board assembly. The lens assembly is configured to focus the image of the field-of-view about the vehicle on the imager device. The polymeric compound is configured to encapsulate the circuit board assembly, seal/protect the molded camera and define an external portion of an exterior surface of the molded camera. | 01-07-2016 |
Tan Chee Yong, Singapore SG
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20080308221 | Method And System For Removing Tape From Substrates - A method for removing tape from a substrate includes the step of detecting an actual distance between a peel head and the tape on the substrate, and a location of an edge of the substrate. The method also includes the steps of moving the peel head in a first direction by an amount equal to the distance to press the peel tape onto the tape on the substrate, moving the peel head in a second direction to the edge of the substrate, and then moving the peel head in an opposite second direction to peel the tape from the substrate. The detecting step can be performed using a sensor such as a capacitance probe sensor or an optical sensor. Alternately, rather than detecting the distance, a pressure sensing system can be used to press the peel head against the tape, and to maintain a predetermined pressure range during the peeling process. A system for performing the method includes sensors configured to detect the distance and the edge of the substrate, and a control system configured to control the movement of the peel head responsive to signals from the sensors. A pressure sensing system includes a compression spring and a load cell for sensing pressure, and a stepper motor configured to control movement of the peel head responsive to pressure signals. | 12-18-2008 |
Tuck Cheong Yong, Singapore SG
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20110016310 | SECURE SERIAL INTERFACE WITH TRUSTED PLATFORM MODULE - A secure system having a Trusted Platform Module coupled between a peripheral device and a host. In operation, the Trusted Platform Module is provided to control communication between the peripheral device and the host. | 01-20-2011 |
Woon Yik Yong, Singapore SG
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20140131844 | System and Method for an Electronic Package with a Fail-Open Mechanism - A semiconductor package including a fail open mechanism is disclosed. An embodiment includes a semiconductor package having a chip carrier, a chip disposed on the chip carrier and an encapsulant encapsulating the chip and the chip carrier. The semiconductor package further including a pin protruding from the encapsulant and a fail open mechanism disposed on the encapsulant and connected to the pin, wherein the fail open mechanism is configured to be disconnected from the pin if a temperature exceeds a pre-determined temperature. | 05-15-2014 |
Yean Kee Yong, Singapore SG
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20090249102 | METHOD AND APPARATUS FOR REDUCING POWER CONSUMPTION IN MULTI-CHANNEL MEMORY CONTROLLER SYSTEMS - Disclosed is a method, apparatus and computer program product for reducing memory power consumption in a server system. The server system includes a memory controller and a plurality of Dual Inline Memory Modules (DIMMs). The method for reducing the memory power consumption includes determining a status of a channel of a plurality of channels of the memory controller. The plurality of channels is associated with the plurality of DIMMs of the server system. The status of the channel represents a presence of at least one scheduled transaction in the channel. The method further includes monitoring the status of the channel by checking whether the status of the channel is in an idle mode for a period of at least equal to a first threshold time. Thereafter, the method includes driving the channel into a power down state based on the monitoring of the status of the channel. | 10-01-2009 |
20100274897 | Random Early Detect and Differential Packet Aging Flow Control in Switch Queues - Flow control is provided for a packet switch. An incoming packet is classified according to its priority based on predefined rules to produce a weight value based on the priority of the packet. A lifetime value associated with the packet is produced based on the weight value and the queue occupancy in a queue to which the packet is assigned. The packet is discarded if its associated lifetime value is less than or equal to a threshold value. Otherwise the packet and associated lifetime value are sent to the queue. The lifetime value is periodically changed and compared to a threshold value. The packet is removed from the queue when its lifetime value reaches the threshold value. | 10-28-2010 |
Zhee Min Jimmy Yong, Singapore SG
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20110024365 | BAFFLE PLATES FOR AN ULTRAVIOLET REACTOR - An ultraviolet reactor for treating a fluid. The reactor includes a vessel having an inlet for receiving fluid and an outlet for discharging fluid. The reactor further includes an ultraviolet light source and baffle plates. The baffle plates include holes arranged in a predetermined pattern for providing plug flow in areas in the reactor near the ultraviolet light source. | 02-03-2011 |
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20120118731 | Flow Distributors for Electrochemical Separation - An electrochemical separation system may be modular and may include at least a first modular unit and a second modular unit. Each modular unit may include a cell stack and a frame. The frame may include a manifold system. A flow distribution system in the frame may enhance current efficiency. Spacers positioned between modular units may also enhance current efficiency of the system. | 05-17-2012 |