Yi-Hsiu
Yi-Hsiu Chen, Hsin-Chu TW
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20150249049 | Through-Substrate via Formation with Improved Topography Control - A device include a substrate and an interconnect structure over the substrate. The interconnect structure comprising an inter-layer dielectric (ILD) and a first inter-metal dielectric (IMD) formed over the ILD. A through-substrate via (TSV) is formed at the IMD extending a first depth through the interconnect structure into the substrate. A metallic pad is formed at the IMD adjoining the TSV and extending a second depth into the interconnect structure, wherein the second depth is less than the first depth. Connections to the TSV are made through the metallic pad. | 09-03-2015 |
Yi-Hsiu Chen, Pingzhen City TW
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20120067506 | FILM PROCESSING EQUIPMENT AND METHOD USING THE SAME - A film processing equipment and a method for processing a film is provided. A feeding roller feeds the film to a swelling bath and the swelling bath immerses the film. A dyeing bath dyes the film transferred from the swelling bath and a stretching bath stretches the film. The stretching bath comprises three sets of rollers dividing a film transferring path into a first interval length and a second interval length. The first interval length is in an upstream with respect to the film transferring path and smaller than the second interval length. A crosslinking bath performs a crosslinking process on the film transferred from the stretching bath and a washing bath washes the film. A film attaching assembly performs a film attaching process on the film transferred from the washing bath and a winding device winds the film transferred from the film attaching assembly. | 03-22-2012 |
Yi-Hsiu Chen, Hsinchu City TW
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20130093098 | THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME - The embodiments of forming a through substrate via (TSV) structure described enable reducing risk of damaging gate structures due to over polishing of an inter-level dielectric layer (ILD) layer. The TSV structure with a wider opening near one end also enables better gapfill. | 04-18-2013 |
20140131884 | Through-Substrate via Formation with Improved Topography Control - A device include a substrate and an interconnect structure over the substrate. The interconnect structure comprising an inter-layer dielectric (ILD) and a first inter-metal dielectric (IMD) formed over the ILD. A through-substrate via (TSV) is formed at the IMD extending a first depth through the interconnect structure into the substrate. A metallic pad is formed at the IMD adjoining the TSV and extending a second depth into the interconnect structure, wherein the second depth is less than the first depth. Connections to the TSV are made through the metallic pad. | 05-15-2014 |
20140327151 | THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME - A structure includes a substrate, and an interconnect structure over the substrate. The structure further includes a through-substrate-via (TSV) extending through the interconnect structure and into the substrate, the TSV comprising a conductive material layer. The structure further includes a dielectric layer having a first portion over the interconnect structure and a second portion within the TSV, wherein the first portion and the second portion comprise a same material. The conductive material layer includes a first section separated from substrate by the second portion of the dielectric layer. The conductive material layer further includes a second section over a top surface of the second portion of the dielectric layer. The conductive material layer further includes a third section over the second section, wherein the third section has a width greater than a width of the second section. | 11-06-2014 |
20150235922 | Through Via Structure Extending to Metallization Layer - The integrated circuit device disclosed herein includes a substrate, an interlevel dielectric layer disposed over the substrate, an intermetal dielectric layer disposed over the interlevel dielectric layer, an interconnect structure extending through the intermetal dielectric layer, and a through via (TV) extending through the intermetal dielectric layer and at least a portion of the substrate, the through via having a top surface co-planar with a top surface of the interconnect structure. In some embodiments, the through via is formed before the interconnect structure. In other embodiments, the interconnect structure is formed before the through via. In an embodiment, a fin field effect transistor (FinFET) is formed over the substrate. | 08-20-2015 |
Yi-Hsiu Cheng, Taipei City TW
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20140108970 | SYSTEM AND METHOD FOR RENDERING WIDGET - A method and a system for rendering a widget are provided. The method is used in an electronic device and includes: receiving a display size of a display unit; comparing the display size of the display unit with a lookup table and obtaining the display size of the widget and a user interface; determining whether the display size of the display unit needs to be adjusted to the display size of the widget; re-adjusting the display size of the display to the display size of the widget according to the obtained display size of the widget when determining that the display size of the display unit needs to be adjusted to the display size of the widget; and rendering the widget. | 04-17-2014 |
Yi-Hsiu Cheng, Taipei TW
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20080306832 | Broadcasting data purchasing system and method thereof - A broadcasting data purchasing system includes an internet radio station, a media receiver and an online shopping server. The internet radio station provides broadcasting data. The media receiver receives, plays the broadcasting data and judges whether the broadcasting data includes metadata, which includes first audio information relevant to the broadcasting data. The media receiver responds with an operation event to output the first audio information when the broadcasting data includes the metadata. The online shopping server includes a goods database. The online shopping server receives the first audio information, searches for goods data from the goods database according to the first audio information, and stores the goods data. | 12-11-2008 |
Yi-Hsiu Huang, Taipei City TW
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20140187860 | GUIDABLE ENDOSCOPE - A guidable endoscope is described, which includes a rigid guiding part, a bending controllable part, a rigid endoscope body and a handle part. The rigid guiding part has a first end and a second end opposite to each other. The bending controllable part has a first end and a second end opposite to each other. The first end of the bending controllable part is directly connected to the second end of the rigid guiding part. The rigid endoscope body has a first end and a second end opposite to each other. The first end of the rigid endoscope body is directly connected to the second end of the bending controllable part, and the bending controllable part can be bent relative to the rigid guiding part or the rigid endoscope body. The handle part is connected to the second end of the rigid endoscope body. | 07-03-2014 |
Yi-Hsiu Lee, Taipei TW
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20090265094 | METHOD AND SYSTEM FOR INFORMATION CORRESPONDING TO GEOGRAPHICAL POSITION - The invention relates to a method and a system for information corresponding to a geographical position. The method includes the following steps. First, a plurality of words are captured from electronic information. Then, position information conforming to a specific address format is searched out in the captured words. Furthermore, the position information is converted to latitude and longitude data. | 10-22-2009 |
20120087148 | Backlight Module and Display Device and Electronic Device Using the Same - A backlight module for a display device is provided. The backlight module mainly includes a light guide plate and a first quantity of light emitting elements. The light guide plate includes a first incident plane with a first length. Each of the light emitting elements emits light to form a specific emitting region and is disposed at a position away from the first incident plane in a first distance, and a first interval is between each adjacent light emitting elements. The first interval equals to the ratio of the first length to the first quantity, and the ratio is between eight and forty. The non-intersection area of the emitting region of each two adjacent light emitting elements is outside the display area of the display device. | 04-12-2012 |
20120274809 | ELECTRONIC DEVICE AND LUMINANCE ADJUSTING METHOD THEREOF - A luminance adjusting method of an electronic device is disclosed. The electronic device includes a light sensor, a control module, a memory and a light source module. The memory stores predetermined ambient luminance-light source luminance corresponding information. The luminance adjusting method includes following steps: obtaining an ambient luminance value by sensing ambient light via the light sensor; receiving an inputted adjusting value; adjusting the predetermined ambient luminance-light source luminance corresponding information according to the inputted adjusting value to generate first personalized ambient luminance-light source luminance corresponding information; generating an optimal luminance adjusting value by referring to the first personalized ambient luminance-light source luminance corresponding information and the ambient luminance value; and adjusting the luminance of the light source module according to the optimal luminance adjusting value. | 11-01-2012 |
Yi-Hsiu Lee, Taipei City TW
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20090248413 | DEVICES AND SYSTEMS FOR REMOTE CONTROL - Remote controllers and systems thereof are disclosed. The remote controller remotely operates a receiving host, in which the receiving host provides voice input and voice recognition functions. The remote controller comprises a first input unit and a second input unit for generating a voice input request and a voice recognition request. The generated voice input and voice recognition requests are then sent to the receiving host, thereby forcing the receiving host to perform the voice input and voice recognition functions. | 10-01-2009 |
Yi-Hsiu Lin, Yangmei City TW
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20150181030 | RINGTONE ASSIGNMENT SYSTEM AND THE METHOD THEREOF - A ringtone assignment system and method are provided. The method includes steps of recording a multimedia ringtone via a first communication device, transmitting a communication linking request to a communication exchange host, transmitting the communication linking request to a second communication device via the communication exchange host to enable the second communication device to feed back ringtone format information supported by the second communication device according to the communication linking request, transmitting the ringtone format information to the first communication device via the communication exchange host to enable the first communication device to code the multimedia ringtone according to the ringtone format information, transmitting the multimedia ringtone from the first communication device to the second communication device, and then decoding and playing the multimedia ringtone by the second communication device. The second communication device is able to recode and assign the multimedia ringtone to the first communication device. | 06-25-2015 |
Yi-Hsiu Liu, Renwu Township TW
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20110278054 | CIRCUIT BOARD WITH NOTCHED CONDUCTOR PADS - Various circuit board conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided. The method includes forming a first conductor pad on a circuit board. The first conductor pad includes a first notch and is adapted to couple to a first solder portion. | 11-17-2011 |
20110299259 | CIRCUIT BOARD WITH CONDUCTOR POST STRUCTURE - Various circuit board interconnect conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is disclosed that includes forming a conductor post on a side of a circuit board. The conductor post includes an end projecting away from the side of the circuit board. A solder mask is applied to the side of the circuit board to cover the conductor post. A thickness of the solder mask is reduced so that a portion of the conductor post projects beyond the solder mask. | 12-08-2011 |