Patent application number | Description | Published |
20110147025 | Power tool having an impact mechanism - A power tool having an impact mechanism including a rotary shaft defining a tool axis of rotation, an impact member moveable along the tool axis of rotation, a support member fixed in position relative to the tool axis of rotation, a biasing member for urging the impact member away from the support member, and at least one axial stop member positioned between the impact member and the support member. According to the invention, the distance between the axial stop member and the tool axis of rotation is more than the distance between the biasing member and the tool axis of rotation. | 06-23-2011 |
20130112446 | Handheld power tool having a drive motor operable via a manual switch - In a handheld power tool having a drive motor operable via a manual switch for driving a drive body which is associated with a mechanical percussion mechanism and coupled to a percussion member for driving an output shaft provided with a tool receptacle, and an operating mode switchover element which is designed to switch over between a normal operation and a percussion operation of the percussion mechanism and which is coupled to the drive body being associated with the drive body, an operating device is provided for operating the operating mode switchover element which is coupled to the manual switch and which is designed to enable a switchover of the operating mode switchover element between normal operation and the percussion operation of the percussion mechanism by operating the manual switch. | 05-09-2013 |
20130199814 | handheld machine tool having a mechanical striking mechanism - In the case of a handheld machine tool having a mechanical striking mechanism, which includes a striking body provided with at least one actuating cam and an output shaft provided with at least one output cam, the actuating cam being configured for percussively driving the output cam during percussive operation of the mechanical striking mechanism, a damping element, which has an abutment element acted upon by a spring element, is provided at least on one actuating cam and/or on one output cam. | 08-08-2013 |
20140020921 | MECHANICAL IMPACT MECHANISM FOR A HANDHELD POWER TOOL - In a handheld power tool having a mechanical impact mechanism which has an impact member provided with at least one drive cam and an output shaft which is provided with at least one output cam and which is connected to a tool receptacle for accommodating a tool, the drive cam being designed for the percussive drive of the output cam during the impact operation of the mechanical impact mechanism, the impact member having the drive cams is mounted upstream from the output cams in an axial direction of the output shaft pointing away from the tool receptacle. | 01-23-2014 |
20140027140 | HANDHELD MACHINE TOOL COMPRISING A MECHANICAL STRIKING MECHANISM - A handheld machine tool including a mechanical striking mechanism, which has a striking member equipped with at least one drive cam and an output shaft equipped with at least one output cam, which is connected to a tool holder for holding a tool, the drive cam being designed to drive the output cam in a striking manner during the striking operation of the mechanical striking mechanism, the output shaft being drivable by a barrel shaped drive member, which at least partially encloses the output shaft and the striking body and is connected via a threaded connection to a drive member that is drivable by an associated gearbox. | 01-30-2014 |
20140367928 | HANDHELD MACHINE TOOL - A handheld machine tool having an output shaft on which a tool holding fixture is developed, which has a multi-faced inner receptacle and a multi-faced outer receptacle, the multi-faced inner receptacle to connect to a tool insert, which can be locked using a locking device assigned to the tool holding fixture; the locking device having a locking sleeve which is displaceable for unlocking the tool insert against a spring force applied by an associated spring element in an axial direction facing away from the handheld machine tool, from a locking to an unlocking position, the locking sleeve has an operating element and a holding element connected to each other via a threaded connection, the holding element driven by the associated spring element in the direction of the locking position of the locking sleeve and the operating element enables displacement of the locking sleeve from the locking to the unlocking position. | 12-18-2014 |
Patent application number | Description | Published |
20130062752 | RING STRUCTURE FOR CHIP PACKAGING - A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner. | 03-14-2013 |
20150179617 | THERMALLY ENHANCED HEAT SPREADER - A three dimensional integrated circuit (3DIC) includes a first substrate and a heat spreading structure embedded in the first substrate. The 3DIC further includes a die electrically connected to the first substrate, wherein the die is thermally connected to the heat spreading structure. The 3DIC further includes a plurality of memory units on the die, wherein the die is between the plurality of memory units and the first substrate, and the plurality of memory units is thermally connected to the heat spreading structure by the die. The 3DIC further includes an external cooling unit on the plurality of memory units, wherein the plurality of memory units is between the die and the external cooling unit, and the die is thermally connected to the external cooling unit by the plurality of memory units. | 06-25-2015 |
20150194389 | Semiconductor Device Package With Warpage Control Structure - Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package. | 07-09-2015 |
Patent application number | Description | Published |
20120306070 | Electrical Connection for Chip Scale Packaging - A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion. | 12-06-2012 |
20130082372 | Package on Packaging Structure and Methods of Making Same - A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer. | 04-04-2013 |
20130087892 | Electrical Connection for Chip Scale Packaging - A system and method for providing a post-passivation opening and undercontact metallization is provided. An embodiment comprises an opening through the post-passivation which has a first dimension longer than a second dimension, wherein the first dimension is aligned perpendicular to a chip's direction of coefficient of thermal expansion mismatch. By shaping and aligning the opening through the post-passivation layer in this fashion, the post-passivation layer helps to shield the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion. | 04-11-2013 |
20140021594 | Packaging Structures and Methods for Semiconductor Devices - Packaging structures and methods for semiconductor devices are disclosed. In one embodiment, a substrate for packaging a semiconductor device includes a core substrate, an insulating material disposed over the core substrate, and conductive lines disposed in the insulating material. Contact pads are disposed over the insulating material and the conductive lines. The contact pads are disposed in an integrated circuit mounting region of the core substrate. A solder mask define (SMD) material is disposed over the insulating material. Portions of the contact pads are exposed through openings in the SMD material. A stress-relief structure (SRS) is disposed in the SMD material proximate the contact pads. The SRS is disposed entirely in the integrated circuit mounting region of the core substrate. | 01-23-2014 |
20140113447 | Electrical Connection for Chip Scale Packaging - A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion. | 04-24-2014 |
20140264813 | Semiconductor Device Package and Method - Various packages and methods of forming packages are disclosed. In an embodiment, a package includes a hybrid encapsulant encapsulating a chip attached to a substrate. The hybrid encapsulant comprises a first molding compound and a second molding compound that has a different composition than the first molding compound. In another embodiment, a package includes an encapsulant encapsulating a chip attached to a substrate. A surface of the chip is exposed through the encapsulant. The encapsulant comprises a recess in a surface of a first molding compound proximate the surface of the chip. A thermal interface material is on the surface of the chip and in the recess, and a lid is attached to the thermal interface material. | 09-18-2014 |
20140264815 | Semiconductor Device Package and Method - Various packages and methods are disclosed. A package according to an embodiment includes a substrate, a chip attached to a surface of the substrate with electrical connectors, a molding compound on the surface of the substrate and around the chip, an adhesive on a surface of the chip that is distal from the surface of the substrate, and a lid on the adhesive. In an embodiment, a region between the molding compound and the lid at a corner of the lid is free from the adhesive. In another embodiment, the lid has a recess in a surface of the lid facing the surface of the molding compound. | 09-18-2014 |
20150041987 | 3D Packages and Methods for Forming the Same - Embodiments of the present disclosure include a semiconductor device, a package and methods of forming a semiconductor device and a package. An embodiment is a semiconductor device including a molding material over a first substrate with a first opening having a first width in the molding material. The semiconductor device further includes a second opening having a second width in the molding material with the second width being greater than the first width. A first connector is in the first opening and a second connector is in the second opening. | 02-12-2015 |
20150070865 | Package-on-Package Structure with Through Molding Via - Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors. | 03-12-2015 |
20150123257 | Semiconductor Device Package and Method - Various packages and methods of forming packages are disclosed. In an embodiment, a package includes a hybrid encapsulant encapsulating a chip attached to a substrate. The hybrid encapsulant comprises a first molding compound and a second molding compound that has a different composition than the first molding compound. In another embodiment, a package includes an encapsulant encapsulating a chip attached to a substrate. A surface of the chip is exposed through the encapsulant. The encapsulant comprises a recess in a surface of a first molding compound proximate the surface of the chip. A thermal interface material is on the surface of the chip and in the recess, and a lid is attached to the thermal interface material. | 05-07-2015 |
20150200190 | Package on Packaging Structure and Methods of Making Same - A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer. | 07-16-2015 |
20150235976 | Electrical Connection for Chip Scale Packaging - A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion. | 08-20-2015 |
Patent application number | Description | Published |
20100220185 | Object Inspection System - Early techniques for object inspection relied on human inspectors to visually examine objects for defects. However, automated object inspection techniques were subsequently developed due to the labour intensive and subjective nature of human operated inspections. Additionally, object characteristics such as object power and object thickness need to be determined after the objects have been examined for defects. Conventionally, corresponding inspection stations are along the manufacturing lines for determining each of the object characteristics. However, the need for human intervention and time spent to move the objects from one inspection station to another adversely affect the efficiency of the object manufacturing process. An embodiment of the invention disclosed describes a high-resolution object inspection system for performing object inspection. | 09-02-2010 |
20110128368 | Hole Inspection Method and Apparatus - An inspection apparatus initially involves an illuminator for directing an illuminating light beam towards a hole having two extremities and an internal surface extending between the two extremities. The inspection apparatus also involves a lens assembly for imaging the internal surface of the hole into the flat image. The lens assembly has a cylindrical field of view as well as a cylindrical depth of view. The cylindrical depth of field extends at least between the two extremities of the hole. The inspection apparatus further involves an image capturing device for capturing the flat image, and an image processing unit for performing inspection of the flat image to thereby inspect the internal surface of the hole. More specifically, the internal surface of the hole between the two extremities thereof is substantially in-focus along the flat image. | 06-02-2011 |
20130162984 | METHOD AND APPARATUS FOR INSPECTING OPHTHALMIC LENS - An embodiment of a system and a method for inspecting a contact lens is provided. The illumination system illuminates the center zone and the peripheral zone of the contact lens when it is inside a cavity between a male mold and a female mold. The imaging optical system has two channels to capture two images or a composite single image to inspect the entire contact lens. The imaging optical system of the first channel has its entrance pupil far away from the mold tool. The camera of the first channel is used to capture the image of the center zone of the contact lens. The image optical system of the second channel is located outside the mold tool but its entrance pupil is located inside the mold tool or outside but substantially close to it. This enables the camera of the second channel to capture the image of the peripheral zone of the contact lens. | 06-27-2013 |
20130169955 | INSPECTION OF DEFECTS IN A CONTACT LENS - An embodiment of a method and system for inspecting clear and printed contact lenses is provided. A contact lens is inspected by illuminating the contact lens using bright-field illumination and low-angle dark-field illumination simultaneously, when the contact lens is disposed in a cavity between a male mold and a female mold. Further, the light emerging from the contact lens is received by an imaging optical system, and a camera uses the light received by the imaging optical system to capture an image of the contact lens. Further, a data processing system is configured to identify dark defects in the image that are in a first portion of a dynamic range of brightness, and to identify bright defects in the image that are in a second portion of the dynamic range of brightness. | 07-04-2013 |
Patent application number | Description | Published |
20110144471 | FLEXIBLE PROBE STRUCTURE AND METHOD FOR FABRICATING THE SAME - The present invention discloses a flexible probe structure comprises at least one electrode using a CNT layer as the electrode interface. The CNT layer disposed on the electrode surface is processed with an UV-ozone treatment to form a great number of carbon-oxygen functional groups on the surface of CNT. The carbon-oxygen functional groups can greatly reduce the interface impedance of the electrode and the biological tissue fluid. Thereby, the measurement can achieve better quality. The present invention also discloses a method for fabricating a flexible probe structure, which comprises steps: preparing a flexible substrate; forming a conductive layer on the flexible substrate, and defining an electrode, a wire and a metal pad on the conductive layer; forming a CNT layer on the electrode; forming an insulating layer on the conductive layer to insulate the wire from the environment; and processing the CNT layer with an UV-ozone treatment. | 06-16-2011 |
20110233526 | PERYLENE DIIMIDE DERIVATIVE AND ORGANIC SEMICONDUCTOR ELEMENT USING THE SAME MATERIAL - The present invention discloses a soluble and air-stable perylene diimide (PDI) derivative to function as an N-type organic semiconductor material. In the PDI derivative of the present invention, the core thereof is substituted by electron withdrawing groups, and the side chains thereof are substituted by benzene functional groups, whereby are promoted the solubility and air-stability of the molecule. The PDI derivative of the present invention can be used to fabricate an organic semiconductor element via a soluble process at a low temperature and under an atmospheric environment. | 09-29-2011 |
20120118386 | P-TYPE TRANSPARENT CONDUCTIVE OXIDES AND SOLAR CELLS WITH P-TYPE TRANSPARENT CONDUCTIVE OXIDES - A p-type transparent conductive oxide and a solar cell containing the p-type transparent conducting oxide, wherein the p-type transparent conductive oxide includes a molybdenum trioxide doped with an element having less than six valence electrons, the element is selected from the group consisting of alkali metals, alkaline earth metals, group III elements, group IV, group V, transition elements and their combinations. Doping an element having less than six valence electron results in hole number increase, and thus increasing the hole drift velocity, and making Fermi level closer to the range of p-type materials. Hence, a p-type transparent conductive material is generated. This p-type transparent conducting oxide not only has high electron hole drift velocity, low resistivity, but also reaches a transmittance of 88% in the visible wavelength range, and therefore it is very suitable to be used in solar cells. | 05-17-2012 |
20120135598 | METHOD FOR FABRICATING INTERCONNECTIONS WITH CARBON NANOTUBES - A method for fabricating interconnections with carbon nanotubes of the present invention comprises the following steps: forming a dual-layer that contains a catalytic layer and an upper covering layer on the periphery of a hole connecting with a substrate; and growing carbon nanotubes on the catalytic layer with the upper covering layer covering the carbon nanotubes. The present invention grows the carbon nanotubes between the catalytic layer and the upper covering layer. The upper covering layer protects the catalytic layer from being oxidized and thus enhances the growth of the carbon nanotubes. The carbon nanotubes are respectively connected with the lower substrate and an upper conductive wire via the catalytic layer and the upper covering layer, which results in a lower contact resistance. Moreover, the upper covering layer also functions as a metal-diffusion barrier layer to prevent metal from spreading to other materials via diffusion or other approaches. | 05-31-2012 |
20120148449 | ELECTRIC CONDUCTIVITY-BASED BIOSENSOR - An electric conductivity-based biosensor electrochemically detects the concentration of tested objects via measuring impedance or capacitance variation of the tested objects. The biosensor comprises a substrate, two electric-conduction electrodes arranged on the substrate, an antibody adhesion layer arranged on a region of the substrate and a plurality of antibodies arranged on the antibody adhesion layer. The antibody adhesion layer is between the two electric-conduction electrodes. The antibodies are connected with a plurality of tested objects. The tested objects connected with the antibodies form an electric-conduction group contacting the two electric-conduction electrodes. The concentration of the tested objects can be provided via measuring impedance or capacitance between the two electric-conduction electrodes. | 06-14-2012 |
20120152335 | FULL-SPECTRUM ABSORPTION SOLAR CELL - A full-spectrum absorption solar cell adopts cobalt-doped tin dioxide as an N-type material. Thereby, a solar cell of the present invention can be fabricated by a spray method in a hot pressing fabrication process. The present invention does not need to fabricate a solar cell in a vacuum or furnace system and thus can solve the high cost problem of the conventional technology. The N-type cobalt-doped layer can absorb full spectrum of sunlight. The N-type cobalt-doped layer can be used to fabricate a solar cell with a low-temperature fabrication process. Thus, the present invention does not need to adopt a high-temperature resistant substrate (such as silicon chip or glass) used in the conventional high-temperature fabrication process but can adopt a substrate made of plastic. And, the conversion efficiency of the invention can achieve 1.2%, it is a significant improvement over the oxide-based nanostructures heterojunction solar cells in the world. | 06-21-2012 |
20130284268 | SELF-ASSEMBLY NANO-COMPOSITE SOLAR CELL - A self-assembly nano-composite solar cell comprises a substrate, a first electrode layer, a composite absorption layer and a second electrode layer. The first electrode layer is formed on the substrate. The composite absorption layer is formed over the first electrode layer and includes a plurality of vertical nano-pillars, a plurality of gaps each formed between any two adjacent nano-pillars, and a plurality of bismuth sulfide nano-particles filled into the gaps and attached to the nano-pillars. The second electrode layer is formed over the composite absorption layer. Through etching and soaking in solutions, the composite absorption layer with nano-pillars and bismuth sulfide nano-particles is fabricated to form a self-assembly nano-composite solar cell having high power conversion efficiency. | 10-31-2013 |
20130307520 | MICROELECTRODE ARRAY AND METHOD FOR MODIFYING CARBON NANOTUBE ELECTRODE INTERFACE OF THE SAME ARRAY - The present invention discloses a method for modifying a carbon nanotube electrode interface, which modifies carbon nanotubes used as a neuron-electrode interface by performing three stages of modifications and comprises the steps of: carboxylating carbon nanotubes to provide carboxyl functional groups and improve the hydrophilicity of the carbon nanotubes; acyl-chlorinating the carboxylated carbon nanotubes to replace the hydroxyl functional groups of the carboxyl functional groups with chlorine atoms; and aminating the acyl-chlorinated carbon nanotubes to replace the chlorine atoms with a derivative having amine functional groups at the terminal thereof. The modified carbon nanotubes used as the neuron-electrode interface has lower impedance and higher adherence to nerve cells. Thus is improved the quality of neural signal measurement. The present invention also discloses a microelectrode array, wherein the neuron-electrode interface uses carbon nanotubes modified according to the method of the present invention. | 11-21-2013 |
20150075594 | W18O49-TYPE TUNGSTEN OXIDE NANOMATERIAL AND APPLICATIONS THEREOF IN LIGHT SENSOR, MOSFET AND SOLAR CELL - The invention proposes W | 03-19-2015 |
20150093840 | ENZYME-FREE COLORIMETRIC IMMUNOASSAY - A colorimetric immunoassay of the present invention uses nanostructured material with high absorption and high scattering ability as a label material for biosensors. Subject matters to be measured may be characterized or quantified by determining the changes in optical properties of the nanostructured material. The biosensor of the present invention may be operated in broad light wavelength range and detected by direct observation with naked eye. The biosensor of the present invention may be also provided with advantages such as higher sensitivity and lower cost. | 04-02-2015 |
Patent application number | Description | Published |
20080296538 | Carbon nanotube and method of visualizing carbon nanotube - A carbon nanotube is described, to which quantum dots are attached through non-covalent bonding via linking molecules bonded to the quantum dots. A method of visualizing a carbon nanotube is also described, wherein quantum dots are attached to the carbon nanotube through non-covalent bonding via linking molecules bonded to the quantum dots, and then the quantum dots are made emit light. This invention allows carbon nanotubes, even those in a wet condition, to be visualized by a simple fluorescent optical microscope. Thereby, the difficulties on preparing specimens and the need of sophisticated instruments can be reduced. This invention also exhibits great potential for the application of carbon nanotubes under a wet condition. | 12-04-2008 |
20090191616 | Biosensor structure and fabricating method thereof - A biosensor structure and a method for fabricating the same are described. The biosensor structure for detecting at least a single cell includes a substrate with an insulating surface, a conductive layer and a plurality of capture molecules. The conductive layer is disposed on the substrate, and has a first pattern and a second pattern separated from each other. The first pattern includes a plurality of first finger configurations, and the second pattern includes a plurality of second finger configurations, so as to form interdigitated array. The capture molecules are immobilized on the conductive layer, such that the cell that is bound specifically to the capture molecules on two adjacent first and second finger configurations is detected. The biosensor structure is feasible for real-time (<3 min), specific, and quantitative targeted cell detection down to a single cell. | 07-30-2009 |
20090197113 | Interconnect structure and method of fabricating the same - A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer. | 08-06-2009 |
20090236675 | SELF-ALIGNED FIELD-EFFECT TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A self-aligned field-effect transistor (FET) is provided. The self-aligned FET includes a substrate, a dielectric layer, conductive electrodes, and a carbon nanotube. A patterned back-gated conductive electrode is disposed in the substrate. The dielectric layer is disposed on the substrate. The conductive electrodes are disposed on the dielectric layer and function as a source/drain. The patterned source/drain conductive electrodes contain a metal silicide such as cobalt silicide serve as a catalyst for carbon nanotube synthesis. The carbon nanotube is disposed on the dielectric layer to be electrically connected with the source/drain conductive electrodes. | 09-24-2009 |
20090250731 | Field-effect transistor structure and fabrication method thereof - A field-effect transistor (FET) structure is provided. The FET structure includes a gate substrate, a dielectric layer, conductive electrodes, and a carbon nanotube (CNT). The gate substrate is made of a conductive material. The dielectric layer is disposed on the substrate. The conductive electrodes are disposed on the dielectric layer, and contain nickel and chromium. The CNT is disposed on the dielectric layer and electrically connects two conductive electrodes | 10-08-2009 |
20090325370 | Field-effect transistor structure and fabrication method thereof - A field-effect transistor (FET) structure is provided. The FET structure includes a gate substrate, a dielectric layer, conductive electrodes, and a carbon nanotube (CNT). The gate substrate is made of a conductive material. The dielectric layer is disposed on the substrate. The conductive electrodes are disposed on the dielectric layer, and contain nickel and chromium. The CNT is disposed on the dielectric layer and electrically connects two conductive electrodes | 12-31-2009 |
20110193065 | Organic thin film transistor - An organic thin film transistor includes: a gate electrode, a gate insulating film, a source electrode, a drain electrode, and an organic active layer. The organic active layer includes an organic semiconductor compound represented by the following formula (A) as defined in the specification. | 08-11-2011 |