Patent application number | Description | Published |
20130256910 | 3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BACKSIDE METAL REDISTRIBUTION LINES COMBINED WITH THROUGH-SILICON VIAS - A 3D interconnect structure and method of manufacture are described in which metal redistribution layers (RDLs) are integrated with through-silicon vias (TSVs) and using a single damascene type process flow. A silicon nitride or silicon carbide passivation layer may be provided between the thinned device wafer back side and the RDLs to provide a hermetic barrier and polish stop layer during the process flow. | 10-03-2013 |
20130285257 | 3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED WITH FINE PITCH BACKSIDE METAL REDISTRIBUTION LINES FABRICATED USING A DUAL DAMASCENE TYPE APPROACH - A 3D interconnect structure and method of manufacture are described in which a through-silicon vias (TSVs) and metal redistribution layers (RDLs) are formed using a dual damascene type process flow. A silicon nitride or silicon carbide passivation layer may be provided between the thinned device wafer back side and the RDLs to provide a hermetic barrier and etch stop layer during the process flow. | 10-31-2013 |
20140191419 | 3D INTEGRATED CIRCUIT PACKAGE WITH WINDOW INTERPOSER - 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die. | 07-10-2014 |
20150179562 | THICKENED STRESS RELIEF AND POWER DISTRIBUTION LAYER - An embodiment includes a semiconductor structure comprising: a frontend portion including a device layer; a backend portion including a bottom metal layer, a top metal layer, and intermediate metal layers between the bottom and top metal layers; wherein (a) the top metal layer includes a first thickness that is orthogonal to the horizontal plane in which the top metal layer lies, the bottom metal layer includes a second thickness; and the intermediate metal layers includes a third thickness; and (b) the first thickness is greater than or equal to a sum of the second and third thicknesses. Other embodiments are described herein. | 06-25-2015 |
20150332994 | 3D INTEGRATED CIRCUIT PACKAGE WITH WINDOW INTERPOSER - 3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die. | 11-19-2015 |
Patent application number | Description | Published |
20110102615 | Refraction assisted illumination for imaging - An illumination source may be directed towards a surface of an object comprising subsurface features, wherein the illumination from the source is directed at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface, the portion having an index of refraction that is greater than the index of refraction of a surrounding medium that surrounds the object. An imaging device may be placed with an objective lens. The first angle may be larger than an acceptance angle of the objective lens. In some embodiments, multiple illumination beams may be generated by one or more illumination sources. The beams may be rotated relative to one another about the normal of the surface. Also, in some embodiments, multiple images may be taken with the objective of the imaging device at different positions rotated off of the normal. The multiple images may be combined to generate a composite image. | 05-05-2011 |
20110102770 | Refraction assisted illumination for imaging - Various embodiments are directed to systems and methods of imaging subsurface features of objects. An illumination source may be directed towards a surface of an object comprising subsurface features at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface that has an index of refraction that is greater than the index of refraction of a surrounding medium. An imaging device may be placed with an objective lens oriented substantially normal to the surface. The first angle may be larger than an acceptance angle of the objective lens. | 05-05-2011 |
20120019707 | REFRACTION ASSISTED ILLUMINATION FOR IMAGING - Various embodiments are directed to systems and methods for imaging subsurface features of a semiconductor object comprising a first region having a first doping property and a second region having a second doping property. The semiconductor object may comprise subsurface features and material between a surface of the semiconductor object and the subsurface features. The material may have an index of refraction that is greater than an index of refraction of a surrounding medium in contact with the surface of the semiconductor object. For example, a system may comprise an imaging device comprising an objective. The imaging device may be sensitive to a first wavelength. The system may also comprise an illumination source to emit illumination substantially at the first wavelength. The illumination may be directed towards the surface of the semiconductor object at a first angle relative to a normal of the surface. The first angle is greater than an acceptance angle of the objective of the imaging device. Also, the first wavelength may have a photonic energy substantially equal to a bandgap of the first region. | 01-26-2012 |
20120135550 | REFRACTION ASSISTED ILLUMINATION FOR IMAGING - Various embodiments are directed to systems and methods of imaging subsurface features of objects. An illumination source may be directed towards a surface of an object comprising subsurface features at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface that has an index of refraction that is greater than the index of refraction of a surrounding medium. An imaging device may be placed with an objective lens oriented substantially normal to the surface. The first angle may be larger than an acceptance angle of the objective lens. | 05-31-2012 |
20140118561 | OPTIMIZED ILLUMINATION FOR IMAGING - Various embodiments are directed to imaging systems and methods for generating an image of a sub-surface feature of an object through a surface of the object. An illumination array may comprise a plurality of illumination sources positioned around the sub-surface feature of the object. An imaging device may comprise an objective. A computer system may be in communication with the illumination array. The computer system may be programmed to calculate an optimized illumination pattern of the plurality of illumination sources for imaging the sub-surface feature; activate the optimized illumination pattern; and instruct the imaging device to capture an image of the sub-surface feature with the imaging device based on reflected illumination from the optimized illumination pattern. | 05-01-2014 |
Patent application number | Description | Published |
20080260847 | Polymer-Based Sustained Release Device - This invention relates to compositions for the sustained release of biologically active polypeptides, and methods of forming and using said compositions, for the sustained release of biologically active polypeptides. The sustained release compositions of this invention comprise a biocompatible polymer having dispersed therein, a biologically active polypeptide and a sugar. | 10-23-2008 |
20090035253 | Poly(lactide-Co-glycolide) based sustained release microcapsules comprising a polypeptide and a sugar - This invention relates to compositions for the sustained release of biologically active polypeptides, and methods of forming and using said compositions, for the sustained release of biologically active polypeptides. The sustained release compositions of this invention comprise a biocompatible polymer having dispersed therein, a biologically active polypeptide and a sugar. | 02-05-2009 |
20090247463 | POLYMER-BASED SUSTAINED RELEASE DEVICE - This invention relates to compositions for the sustained release of biologically active polypeptides, and methods of forming and using said compositions, for the sustained release of biologically active polypeptides. The sustained release compositions of this invention comprise a biocompatible polymer having dispersed therein, a biologically active polypeptide and a sugar. | 10-01-2009 |
Patent application number | Description | Published |
20100152111 | Polymer-based sustained release device - This invention relates to compositions for the sustained release of biologically active polypeptides, and methods of forming and using said compositions, for the sustained release of biologically active polypeptides. The sustained release compositions of this invention comprise a biocompatible polymer having dispersed therein, a biologically active polypeptide and a sugar. | 06-17-2010 |
20130130977 | POLYMER-BASED SUSTAINED RELEASE DEVICE - This invention relates to compositions for the sustained release of biologically active polypeptides, and methods of forming and using said compositions, for the sustained release of biologically active polypeptides. The sustained release compositions of this invention comprise a biocompatible polymer having dispersed therein, a biologically active polypeptide and a sugar. | 05-23-2013 |
20140031281 | POLYMER-BASED SUSTAINED RELEASE DEVICE - This invention relates to compositions for the sustained release of biologically active polypeptides, and methods of forming and using said compositions, for the sustained release of biologically active polypeptides. The sustained release compositions of this invention comprise a biocompatible polymer having dispersed therein, a biologically active polypeptide and a sugar. | 01-30-2014 |
20140088003 | POLYMER-BASED SUSTAINED RELEASE DEVICE - This invention relates to compositions for the sustained release of biologically active polypeptides, and methods of forming and using said compositions, for the sustained release of biologically active polypeptides. The sustained release compositions of this invention comprise a biocompatible polymer having dispersed therein, a biologically active polypeptide and a sugar. | 03-27-2014 |