Patent application number | Description | Published |
20080299047 | Method for preparation of water-soluble and dispersed iron oxide nanoparticles and application thereof - The present invention relates to a process for preparing water-soluble and dispersed iron oxide (Fe | 12-04-2008 |
20120027861 | Nano-carrier, complex of anticancer drug and nano-carrier, pharmaceutical composition thereof, method for manufacturing the complex, and method for treating cancer by using the pharmaceutical composition - The present invention relates to a nano-carrier for an anticancer drug, which comprises: a metal nanoparticle; and a polynucleotide for connecting with an anticancer drug having a pyrimidine group or a purine group, wherein the polynucleotide connects to a surface of the metal nanoparticle, and the anticancer drug binds to the polynucleotide through the pyrimidine group or the purine group. In addition, the present invention also provides a complex of an anticancer drug and a nano-carrier, a pharmaceutical composition thereof, a method for manufacturing the complex, and a method for treating a cancer by using the pharmaceutical composition. | 02-02-2012 |
20130337071 | RADIOFREQUENCY-INDUCED SYNCHRONIZATION OF IN SITU HYPERTHERMIA AND CHEMOTHERAPY VIA MAGNETIC-NANOCONJUGATES - The present invention relates to a magnetic nanoparticle for tumor therapy, comprising: a magnetic core; a shell encapsulating a surface of the magnetic core, wherein the shell is made of a polymer with carboxylic groups; a poly-nucleotide chain connected to a surface of the shell; an anti-tumor drug connected to the poly-nucleotide chain, wherein the anti-tumor drug comprises at least one functional group, and each of the functional group is independently a pyrimidine group or a purine group; and an antibody connected to the shell, wherein the antibody identifies a target tumor. In addition, the present invention further provides a method for manufacturing the magnetic nanoparticles for tumor therapy and a pharmaceutical composition containing the magnetic nanoparticles. Accordingly, the magnetic nanoparticle for tumor therapy of the present invention can achieve effective treatment of tumor by synergistic effects between hyperthermia and targeted chemotherapy. | 12-19-2013 |
20140116573 | Method for converting metal with relative low reduction potential into metal with relative high reduction potential without changing its shape - A method for converting a metal with a relative low reduction potential into a metal with a relative high reduction potential without changing its shape is disclosed, which comprises the following steps: providing a first metal substrate and a reaction solution comprising a second metal precursor, a cation surfactant, and a weak reducing agent; and placing the first metal substrate into the reaction solution for a predetermined time to convert the first metal substrate into a second metal substrate. Herein, the reduction potential of a first metal of the first metal substrate is lower than that of a second metal of the second metal substrate, and the shapes of the first metal substrate and the second metal substrate are the same. | 05-01-2014 |
20140161891 | COMPOSITION OF PI3K INHIBITOR AND USE THEREOF - The present invention is related to a composition of PI3K inhibitor, comprising: 0.01˜10 mg of PI3K inhibitor; 10˜500 mg of poly(lactic-co-glycolic acid) (PLGA) which is encapsulated onto the surface of the PI3K inhibitor and the surface is non-modified by a modifier; and the composition has a size of 10˜1000 nm. Thereby, an excellent effect on suppressing the growth of tumor cells will be achieved by the encapsulation of PI3K inhibitor into PLGA nanomaterials without any modifier on its surface, the optimization of a ratio of PI3K inhibitor to PLGA, and the accordingly slow release of the composition. | 06-12-2014 |
Patent application number | Description | Published |
20110070702 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device is provided. A high dielectric constant (high-k) layer and a work function metal layer are formed in sequence on a substrate. A hard mask layer is formed on the work function metal layer, where the material of the hard mask layer is lanthanum oxide. The work function metal layer is patterned by using the hard mask layer as a mask. The hard mask layer is then removed. Afterwards, a gate structure is formed on the substrate. | 03-24-2011 |
20110086499 | METHOD FOR REMOVING PHOTORESIST - A method for removing a photoresist is disclosed. First, a substrate including a patterned photoresist is provided. Second, an ion implantation is carried out on the substrate. Then, a non-oxidative pre-treatment is carried out on the substrate. The non-oxidative pre-treatment provides hydrogen, a carrier gas and plasma. Later, a photoresist-stripping step is carried out so that the photoresist can be completely removed. | 04-14-2011 |
20120003835 | METHOD OF ETCHING SACRIFICIAL LAYER - An exemplary method of etching sacrificial layer includes steps of: providing a substrate formed with a sacrificial layer and defined with a first region and a second region, the sacrificial layer disposed in both the first and second regions; forming a hard mask covering the first region while exposing the second region; performing a first etching process on the sacrificial layer to thin the sacrificial layer while forming a byproduct film overlying the thinned sacrificial layer; performing a second etching process on the byproduct film to remove a portion of the byproduct layer for exposing a portion of the thinned sacrificial layer, while another portion of the byproduct film disposed on sidewalls of the thinned sacrificial layer being remained; and performing a third etching process on the thinned sacrificial layer, to remove the portion of the thinned sacrificial layer exposed in the second etching process. | 01-05-2012 |
20120021583 | SEMICONDUCTOR PROCESS - A semiconductor process is disclosed. The semiconductor process includes the steps of: providing a substrate having a specific area defined thereon; and performing an etch process by using an etchant comprising H | 01-26-2012 |
20120058634 | METHOD OF FABRICATING COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) DEVICE - A method of fabricating a CMOS device having high-k dielectric layer and metal gate electrode is provided. First, an isolation structure is formed in a substrate to define a first-type and a second-type MOS regions; an interfacial layer and a high-k dielectric layer are sequentially formed over the substrate; a first and a second cover layers are respectively formed over a portion of the high-k dielectric layer at the first-type MOS region and another portion of the high-k dielectric layer at the second-type MOS region; afterwards, an in-situ etching step is performed to sequentially etch the first and second cover layers using a first etching solution and to etch both the high-k dielectric layer and the interfacial layer using a second etching solution until the substrate is exposed. Wherein, the second etching solution is a mixed etching solution containing the first etching solution. | 03-08-2012 |
20120070995 | METAL GATE TRANSISTOR AND METHOD FOR FABRICATING THE SAME - A method for fabricating a metal gate transistor is disclosed. The method includes the steps of: providing a substrate having a first transistor region and a second transistor region; forming a first metal-oxide semiconductor (MOS) transistor on the first transistor region and a second MOS transistor on the second transistor region, in which the first MOS transistor includes a first dummy gate and the second MOS transistor comprises a second dummy gate; forming a patterned hard mask on the second MOS transistor, in which the hard mask includes at least one metal atom; and using the patterned hard mask to remove the first dummy gate of the first MOS transistor. | 03-22-2012 |
20120074468 | SEMICONDUCTOR STRUCTURE - A semiconductor structure comprises a substrate, a gate structure, at least a source/drain region, a recess and an epitaxial layer. The substrate includes an up surface. A gate structure is located on the upper surface. The source/drain region is located within the substrate beside the gate structure. The recess is located within the source/drain region. The epitaxial layer fills the recess, and the cross-sectional profile of the epitaxial layer is an octagon. | 03-29-2012 |
20120132996 | STRAINED SILICON STRUCTURE - A strained silicon substrate structure includes a first transistor and a second transistor disposed on a substrate. The first transistor includes a first gate structure and two first source/drain regions disposed at two sides of the first gate structure. A first source/drain to gate distance is between each first source/drain region and the first gate structure. The second transistor includes a second gate structure and two source/drain doped regions disposed at two side of the second gate structure. A second source/drain to gate distance is between each second source/drain region and the second gate structure. The first source/drain to gate distance is smaller than the second source/drain to gate distance. | 05-31-2012 |
20120238065 | METHOD OF FABRICATING COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) DEVICE - A method of fabricating a MOS device comprises steps as follows: An interfacial layer, a high-k dielectric layer and a cover layer on a substrate are sequentially formed. Then an in-situ wet etching step is performed by sequentially using a first etching solution to etch the cover layer and using a second etching solution to etch the high-k dielectric layer and the interfacial layer until the substrate is exposed, wherein the second etching solution is a mixed etching solution containing the first etching solution. | 09-20-2012 |
20120244675 | METHOD FOR FORMING METAL GATE - A method for forming a metal gate is provided. First, a dummy material is formed to completely cover a substrate. Second, a dopant is selectively implanted into the dummy material. Then, some of the dummy material is removed to expose part of the substrate and to form a dummy gate including a dopant region disposed between a first region and a second region. Later an interlayer dielectric layer is formed to surround the dummy gate. Next, a selective etching step is carried out to remove the first region to form a recess without substantially removing the dopant region. Afterwards, the recess is filled with a material set to form a metal gate. | 09-27-2012 |
20120289009 | MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE - A manufacturing method for a semiconductor structure includes providing a substrate having at least a gate structure formed thereon, performing a first wet etching process to etch the substrate at two sides of the gate structure, performing a second wet etching process to etch the substrate to form a recess respectively at two sides of the gate structure, and performing a selective epitaxial growth method to form an epitaxial layer having a diamond shape with a flat bottom respectively in the recess. | 11-15-2012 |
20120306028 | SEMICONDUCTOR PROCESS AND STRUCTURE THEREOF - A semiconductor process is provided, including: a substrate is provided, a buffer layer is formed, and a dielectric layer having a high dielectric constant is formed, wherein the methods of forming the buffer layer include: (1) an oxidation process is performed; and a baking process is performed; Alternatively, (2) an oxidation process is performed; a thermal nitridation process is performed; and a plasma nitridation process is performed; Or, (3) a decoupled plasma oxidation process is performed. Furthermore, a semiconductor structure fabricated by the last process is also provided. | 12-06-2012 |
20130012012 | SEMICONDUCTOR PROCESS - A semiconductor process includes the following steps. A substrate having an oxide layer thereon is provided. A high temperature process higher than 1000° C. is performed to form a melting layer between the substrate and the oxide layer. A removing process is performed to remove the oxide layer and the melting layer. | 01-10-2013 |
20130045594 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE HAVING METAL GATE - A manufacturing method for a semiconductor device having a metal gate includes providing a substrate having at least a first semiconductor device formed thereon, forming a first gate trench in the first semiconductor device, forming a first work function metal layer in the first gate trench, and performing a decoupled plasma oxidation to the first work function metal layer. | 02-21-2013 |
20130049168 | RESISTOR AND MANUFACTURING METHOD THEREOF - A method for forming a resistor integrated with a transistor having metal gate includes providing a substrate having a transistor region and a resistor region defined thereon, forming a transistor having a polysilicon dummy gate in the transistor region and a polysilicon main portion with two doped regions positioned at two opposite ends in the resistor region, performing an etching process to remove the polysilicon dummy gate to form a first trench and remove portions of the doped regions to form two second trenches, and forming a metal gate in the first trench to form a transistor having the metal gate and metal structures respectively in the second trenches to form a resistor. | 02-28-2013 |
20130075874 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF - A semiconductor structure includes a substrate, an oxide layer, a metallic oxynitride layer and a metallic oxide layer. The oxide layer is located on the substrate. The metallic oxynitride layer is located on the oxide layer. The metallic oxide layer is located on the metallic oxynitride layer. In addition, the present invention also provides a semiconductor process for forming the semiconductor structure. | 03-28-2013 |
20130203230 | SEMICONDUCTOR PROCESS - A semiconductor process includes the following steps. A substrate is provided. An ozone saturated deionized water process is performed to form an oxide layer on the substrate. A dielectric layer is formed on the oxide layer. A post dielectric annealing (PDA) process is performed on the dielectric layer and the oxide layer. | 08-08-2013 |
20130292775 | STRAINED SILICON STRUCTURE - A strained silicon substrate structure includes a first transistor and a second transistor disposed on a substrate. The first transistor includes a first gate structure and two first source/drain regions disposed at two sides of the first gate structure. A first source/drain to gate distance is between each first source/drain region and the first gate structure. The second transistor includes a second gate structure and two source/drain doped regions disposed at two side of the second gate structure. A second source/drain to gate distance is between each second source/drain region and the second gate structure. The first source/drain to gate distance is smaller than the second source/drain to gate distance. | 11-07-2013 |
20150079777 | Method of Manufacturing Semiconductor Device Having Metal Gate - A method of manufacturing a semiconductor device having a metal gate is provided. A substrate having a first conductive type transistor and a second conductive type transistor formed thereon is provided. The first conductive type transistor has a first trench and the second conductive type transistor has a second trench. A first work function layer is formed in the first trench. A hardening process is performed for the first work function layer. A softening process is performed for a portion of the first work function layer. A pull back step is performed to remove the portion of the first work function layer. A second work function layer is formed in the second trench. A low resistive metal layer is formed in the first trench and the second trench. | 03-19-2015 |
Patent application number | Description | Published |
20100315808 | Structure for Securing Conductive Strip of Flashlight - A structure for securing a conductive strip of a flashlight includes a flashlight main body formed therein with a receiving space for receiving batteries. The receiving space has a lateral surface formed with a groove whose cross-section tapers toward the center of the receiving space and is configured for receiving the conductive strip coupled to a switch assembly, along with an insulating element corresponding in width to the conductive strip and having a predetermined length. Once installed in the flashlight main body, the conductive strip is separated from the batteries in the receiving space, thereby preventing the batteries from overheating, which might otherwise result from direct contact with the conductive strip. The main body further has a rear end coupled with a pressing portion formed of a pliable material such that a switch of the switch assembly is switched on or off by pressing the pressing portion. | 12-16-2010 |
20120312666 | Structure for preventing misoperation of flashlight - A structure for preventing misoperation of a flashlight is provided configured to prevent a flashlight from unintentionally turned on. The structure includes a safety pin, and a slide power switch being slidably provided on the flashlight. The slide power switch has a recess for removably receiving the safety pin. An embrasure-like channel is provided at a lower part of the safety pin for matching a T-shaped base in an accommodating area of the flashlight. A retaining portion is provided at the T-shaped base for retaining a bulge formed inside the channel of the safety pin when the structure is not in use, wherein when the safety pin is pushed toward the slide power switch, the bulge climbs over the retainer and is then engaged with the recess of the slide power switch. Thereby, the flashlight not in use is secured from misoperation, namely being unintentionally turned on. | 12-13-2012 |
20120314182 | Eyeglass frame assembly adaptable to lenses of different curvatures - An eyeglass frame assembly adaptable to lenses of different curvatures for holding replaceable optical or sunglass lenses includes an inner frame and an eyeglass frame. The inner frame has a rear periphery and laterals thereof formed as an abutting surface corresponding to a forward receiving area and two lateral linking rooms formed on the eyeglass frame, so that the inner frame preinstalled with the optical lenses or the sunglass lenses is easily assembled to the eyeglass frame by inserting two laterals of the inner frame into the lateral linking rooms of the eyeglass frame and buckling a middle portion of the inner frame to a corresponding portion of the eyeglass frame, so as to allow the abutting surface of the inner frame to abut against the matching receiving area of the eyeglass frame. With this design, the inner frame attached to the eyeglass frame can be easily replaced as needed. | 12-13-2012 |
20130121003 | Illumination Device for Providing Synchronous Forward and Backward Lighting - An illumination device for providing synchronous forward and backward lighting is disclosed. The illumination device includes a light housing of a predetermined shape and an illumination light source provided in the light housing. Also provided in the light housing is a reflector having a front section and a rear section, each of which sections forms a flared reflective area. Light emitted by the illumination light source in the light housing is reflected by the reflective areas of the front and rear sections of the reflector and hence directed both forward and backward, so as for the illumination device to provide wide-range lighting when in use. | 05-16-2013 |
20130141214 | Illumination Alert Apparatus Structure Having Cap for Use in Switch Control - The present invention provides an illumination alert apparatus structure having a cap for use in switch control. The illumination alert apparatus which is illumination-oriented comprises a body, a power unit, and a lightbulb having an illumination unit coupled thereto. The power unit is coupled to an end of the body. The lightbulb is screwed to an external thread formed on an outward side of the body and coupled to the power unit, so as to assemble the illumination alert apparatus. The illumination alert apparatus structure dispenses with other switch-related components which might otherwise compromise the overall esthetical appearance of the illumination alert apparatus, such that the illumination alert apparatus manifests simplicity, beauty, and novelty. | 06-06-2013 |
20130155666 | Flashlight Zooming Structure - A flashlight zooming structure includes a main body and a zooming assembly screwed on one end of a neck of the main body. In the zooming assembly, a transparent lamp cup centrally formed with a convex lens is received in a cup seat, the cup seat is screwed into a cap, and the lugs on the outer periphery of the cup seat are received in the corresponding peripheral notches of a receiving section extending from one end of a middle annular element. To illuminate a distant or nearby target, the zooming assembly mounted around the neck of the main body is rotated in the desired direction so that the light emitted by a lighting unit at one end of the neck of the main body is projected outward through the transparent lamp cup in the zooming assembly as a convergent or divergent light beam. | 06-20-2013 |
20130155667 | Flashlight Zooming Structure - A flashlight zooming structure includes a main body and a zooming assembly screwed on one end of a neck of the main body and configured as follows. A transparent lamp cup is received in a cup seat. The cup seat has outwardly extending lugs respectively received in channels formed on the inner periphery of the cap. A ring has oblique notches respectively connected with the lugs of the cup seat. A middle annular element has projections respectively fitted in recesses of the ring and has hooks respectively engaged with engaging grooves of the cap. To illuminate a distant or nearby target, the zooming assembly is rotated in the desired direction so that the light emitted by a lighting unit at one end of the neck of the main body is projected outward through the transparent lamp cup as a convergent or divergent light beam. | 06-20-2013 |
20130155700 | Flashlight Switching Structure - A flashlight switching structure is provided. To turn on or off a flashlight, an annular element mounted around a neck of the flashlight is manually rotated, thereby driving a magnet connected to the annular element to a position where a reed switch connected to a positioning element in the flashlight is subjected to magnetic attraction of the magnet. Once the annular element is released, the restoring force of a resilient element pushes the magnet back in place. Hence, by rotating and releasing the annular element, the flashlight can be switched between predetermined lighting modes, such as a strong light, weak light, flashing, and turned off mode. When a protruding block connected to the outer periphery of the annular element is pushed downward and partially into a corresponding recess on the flashlight, the annular element is prevented from rotation, and the flashlight from being inadvertently triggered. | 06-20-2013 |
20130235565 | Flashing Screwing Structure - A flashlight screwing structure, applicable to a flashlight having a non-cylindrical gripping segment and a screwing unit for changing a battery quickly and conveniently, includes: a thread disposed on an inner surface at a rear end of the flashlight; a connecting unit inserted into the rear end of the flashlight and having a hole centrally formed in the connecting unit; and a thread segment extending inward from an outer cover capable of screwing so as to mesh with the internal thread at the rear end of the flashlight. Therefore, changing the battery of the non-cylindrical flashlight entails rotating and withdrawing the outer cover and the connecting unit, changing the battery, restoring the connecting unit to a position thereof, and rotating the outer cover to fix the outer cover to the rear end of the flashlight. | 09-12-2013 |
20130242547 | Flashlight Lamp Rotation Structure - A flashlight lamp rotation structure capable of rotating the direction of a lamp to meet the need for a flashlight illumination direction includes the lamp equipped with an illumination light source and movably pivotally coupled to the upper end of a flashlight body. The illumination light source in the lamp coupled to the upper end of the flashlight body can undergo a preset change of the color of lamp light, or the lamp can rotate in a preset direction, so as to provide illumination flexibly. | 09-19-2013 |
20140049952 | ANTI-PRESSING APPARATUS FOR FLASHLIGHT - The present invention provides an anti-pressing apparatus for flashlight, comprising a space provided on one end of the flashlight, a dialing piece inserted into a slot adjacent to the space, a pressing piece provided on a perforation having the dialing piece inserted therein, a restraining piece corresponding to an outer end of the pressing piece on the central perforation of the flashlight in order to restrain the pressing piece to move upward and downward only; whereby during use of the anti-pressing assembly of the flashlight, only the push portion of the dialing pieces is required to be dialed to another side to drive the blocker of the dialing piece to rotate to a lower position underneath the protruding section of the pressing piece in order to restrain the downward movement of the pressing piece and accidental pressing down on the power of the flashing can be prevented. | 02-20-2014 |
Patent application number | Description | Published |
20120088397 | LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING - The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force. | 04-12-2012 |
20120201007 | SYSTEMS AND METHODS PROVIDING THERMAL SPREADING FOR AN LED MODULE - A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad. | 08-09-2012 |
20120287635 | Light Emitting Diode Light Bar Module with Electrical Connectors Formed by Injection Molding - The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force. | 11-15-2012 |
20120292655 | LIGHT EMITTING DIODE CARRIER - A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB. | 11-22-2012 |
20120293978 | LED LAMP WITH IMPROVED LIGHT OUTPUT - The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure. | 11-22-2012 |
20120299019 | Systems and Methods Providing Semiconductor Light Emitters - A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board. | 11-29-2012 |
20120306341 | LIGHT-EMITTING-DIODE-BASED LIGHT BULB - The embodiments of a light-emitting-diode-based (LED-based) light bulb and an LED assembly described provide mechanisms of reflecting generated by LED emitters toward the back of the LED-based light bulb. An upper substrate and a lower substrate are used to support upper and lower LED emitters. A slanted and reflective surface between the upper substrate and the lower substrate reflects light generated by the lower LED emitters toward the backside of the LED-based light bulb. | 12-06-2012 |
20120313518 | LED LAMP AND METHOD OF MAKING THE SAME - A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module. | 12-13-2012 |
20130027946 | WIDE ANGLE BASED INDOOR LIGHTING LAMP - The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination. | 01-31-2013 |
20130038222 | COLOR TEMPERATURE ADJUSTMENT FOR LED LAMPS USING SWITCHES - A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time. | 02-14-2013 |
20130039041 | LIGHTING DEVICE FOR DIRECT AND INDIRECT LIGHTING - A lighting device includes at least one heat sink. At least two light emitting diode (LED) modules are mounted on the at least one heat sink. The at least two LED modules are mounted at different directions on the at least one heat sink so that a first LED module of the at least two LED modules generally radiates lights in a first direction for a direct lighting and a second LED module of the at least two LED modules generally radiates light in a second direction for an indirect lighting by reflecting on a surface. | 02-14-2013 |
20130094180 | COATED DIFFUSER CAP FOR LED ILLUMINATION DEVICE - The present disclosure provides an illumination device. The illumination device includes a light emitting device (LED) on a substrate. A heat sink is thermally connected to the LED device. A cap is secured over the substrate and covers the LED device. The cap includes a coating material that comprises both diffusion and reflection characteristics. | 04-18-2013 |
20130106297 | THERMAL PROTECTION STRUCTURE FOR MULTI-JUNCTION LED MODULE | 05-02-2013 |
20130107549 | LED MODULE AND METHOD OF BONDING THEREOF | 05-02-2013 |
20130120982 | LIGHTING APPARATUS HAVING IMPROVED LIGHT OUTPUT UNIFORMITY AND THERMAL DISSIPATION - The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup. | 05-16-2013 |
20130148346 | ENERGY STAR COMPLIANT LED LAMP - The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments. | 06-13-2013 |
20130187571 | LED THERMAL PROTECTION STRUCTURES - The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. A light-emitting device disposed on a first region of the substrate. The apparatus includes a thermistor disposed on a second region of the substrate. The second region is substantially spaced apart from the first region. The thermistor is thermally and electrically coupled to the light-emitting device. The present disclosure also discloses a method of thermally protecting an LED device. The method includes providing a substrate having a light-emitting diode (LED) die disposed thereon. The method includes detecting a temperature of the LED die using a negative temperature coefficient (NTC) thermistor. The NTC thermistor is positioned on a region of the substrate substantially away from the LED die. The method includes adjusting an electrical current of the LED die in response to the detecting. | 07-25-2013 |
20130201669 | LED ILLUMINATION APPARATUS WITH IMPROVED OUTPUT UNIFORMITY - The present disclosure involves an LED illumination apparatus. The illumination apparatus includes a substrate and a plurality of LED modules disposed over the substrate according to a predefined layout pattern. The layout pattern includes a row having a vertically-aligned LED module located laterally adjacent to a first horizontally-aligned LED module and a second horizontally-aligned LED module. The layout pattern also includes a column having a horizontally-aligned LED module located laterally adjacent to a first vertically-aligned LED module and a second vertically-aligned LED module. The layout pattern further includes a row of horizontally-aligned LED modules located laterally adjacent to one another. The illumination apparatus also includes a diffuser disposed over the plurality of LED modules. Each LED module also includes a secondary optical component providing an asymmetric light pattern. The plurality of LED modules provides a linear light distribution or a planar light distribution on the diffuser. | 08-08-2013 |
20130242550 | CHANGING LED LIGHT OUTPUT DISTRIBUTION THROUGH COATING CONFIGURATION - The present disclosure provides a lighting instrument. The lighting instrument includes a recessed light fixture, for example a troffer light or a batten light. The light fixture includes a plurality of light-emitting diode (LED) devices located on a board. The light fixture also includes a diffuser cap located on the board and housing the LED devices therein. The diffuser cap includes a plurality of coating regions. Each coating region is coated by a film containing white particles. The white particles can reflect and diffuse light emitted by the LED devices. The film in each coating region has a different white particle concentration level than other coating regions. | 09-19-2013 |
20130309790 | Systems and Methods Providing Semiconductor Light Emitters - A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board. | 11-21-2013 |
20130314915 | LED LAMP AND METHOD OF MAKING THE SAME - A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module. | 11-28-2013 |
20140112009 | LED Module and Method of Bonding Thereof - The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB). | 04-24-2014 |
20140184081 | Color Temperature Adjustment for LED Lamps Using Switches - A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time. | 07-03-2014 |
20140185301 | Energy Star Compliant LED Lamp - The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments. | 07-03-2014 |
20140240957 | LED Lamp with Improved Light Output - The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure. | 08-28-2014 |
20140254180 | Systems and Methods Providing Thermal Spreading for an LED Module - A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad. | 09-11-2014 |
20140293615 | WIDE ANGLE BASED INDOOR LIGHTING LAMP - The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a substrate. A light-emitting diode (LED) is disposed over the substrate. A first lens is disposed over the LED. A second lens is disposed over the first lens. The first lens and the second lens are configured to refract light that is emitted by the LED backward. | 10-02-2014 |
20140307435 | LIGHT-EMITTING-DIODE-BASED LIGHT BULB - A lighting apparatus includes a first substrate, a plurality of first light-emitting devices disposed on the first substrate, a second substrate disposed over the first substrate, and a plurality of second light-emitting devices disposed on the second substrate. A reflective surface is disposed between the first substrate and the second substrate. The reflective surface is configured to reflect light emitted by at least some of the first light-emitting devices in a direction that is at least partially toward the first substrate. The reflective surface has one of: a saw-patterned side view profile, or a curved side view profile that is free of having an inflection point. | 10-16-2014 |
20150078014 | LED MODULE AND METHOD OF BONDING THEREOF - The present disclosure provides a lighting module. The lighting module includes a heat sink, a board disposed over the heat sink, and a bonding component that bonds the heat sink and the board together. The bonding component contains a combination of a first metal and a second metal. The lighting module also includes a photonic lighting device disposed over the board. | 03-19-2015 |
20150123571 | THERMAL PROTECTION STRUCTURE FOR MULTI-JUNCTION LED MODULE - A system includes a plurality of light-emitting devices electrically coupled together. A temperature of each of the light-emitting devices is correlated with a voltage of said light-emitting device. The system includes a current driver configured to control an amount of current through at least a subset of the light-emitting devices. The system includes electronic circuitry that is electrically coupled to the subset of the light-emitting devices. The electronic circuitry is configured to: measure a voltage of the subset of the light-emitting devices while the light-emitting devices are in operation; determine, based on the measured voltage, whether the subset of the light-emitting devices is hotter than an acceptable temperature threshold; and instruct the current driver to reduce the amount of current through the subset of the light-emitting devices if the subset of the light-emitting devices has been determined to be hotter than the acceptable temperature threshold. | 05-07-2015 |
20150124448 | LIGHTING APPARATUS HAVING IMPROVED LIGHT OUTPUT UNIFORMITY AND THERMAL DISSIPATION - The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup. | 05-07-2015 |
20150308629 | LIGHTING DEVICE - A lamp includes a substrate having a center region and a peripheral region, a first subset of light-emitting devices disposed on the center region, and a second subset of light-emitting devices disposed on the peripheral region. A temperature difference between the center region and the peripheral region is greater than 10 degrees. | 10-29-2015 |