Patent application number | Description | Published |
20090129073 | Illumination Assembly Having Multiple Emitters - An exemplary embodiment of an illumination assembly includes a reflector housing having a plurality of cavities formed therein, an a plurality of light emitters mounted in the plurality of cavities. Each of the plurality of cavities contains a single one of the plurality of light emitters. | 05-21-2009 |
20090244903 | Illumination Assembly With Diffusive Reflector Cup - One embodiment of a method for configuring consumption of service includes identifying a service to be consumed by a user, identifying a plurality of bearer technologies across which at least one electronic device can access the service, selecting one of the plurality of bearer technologies for use in configuring the at least one electronic device, and configuring the at least one electronic device for the service using one of a plurality of management frameworks according to the selected bearer technology. | 10-01-2009 |
20110140133 | LIGHT EMITTING DEVICE HAVING INCREASED LIGHT OUTPUT - The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle. | 06-16-2011 |
20130020588 | OPTICAL DEVICE WITH THROUGH-HOLE CAVITY - A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors. | 01-24-2013 |
20140084309 | OPTICAL DEVICE WITH THROUGH-HOLE CAVITY - A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors. | 03-27-2014 |
20140091340 | PLASTIC LEADED CHIP CARRIER WITH DIAGONALLY ORIENTED LIGHT SOURCES FOR FINE-PITCHED DISPLAY - A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package is configured to support a plurality of light sources. The light sources may be mounted on a mounting section of the PLCC package's lead frame and the mounting section of the lead frame may extend diagonally with respect to the housing of the lead frame. | 04-03-2014 |
20140145584 | HEMISPHERICAL REMOTER PHOSPHOR AND METHODS OF FORMING THE SAME - An illumination device is disclosed. The illumination device includes a light source and a remoter phosphor configured to alter the color of light emitted by the light source. The remoter phosphor is provided with a substantially hemispherical shape that substantially corresponds to a radiation pattern of the light source, which helps to reduce or eliminate the occurrence of the yellow ring phenomenon, among other things. Methods of manufacturing an illumination device are also disclosed. | 05-29-2014 |
20140252385 | LIGHT EMITTING DEVICE WITH ENHANCED PRE-DIP AND METHOD OF MANUFACTURING THE SAME - An illumination device is disclosed. The illumination device includes a light source a pre-dip material that at least partially encapsulates the light source. The pre-dip material may include one or both of thermally-conductive particles and a cyclo-aliphatic composition. The pre-dip material may further include a resin and a hardener for the resin. Methods of manufacturing an illumination device are also disclosed. | 09-11-2014 |