Patent application number | Description | Published |
20090231671 | METHOD AND SYSTEM FOR OPTICAL MEMS WITH FLEXIBLE LANDING STRUCTURES - An optical deflection device for a display application includes a semiconductor substrate comprising an upper surface region defining an upper surface plane. The optical deflection device also includes one or more electrode devices provided overlying the upper surface region and a hinge device including a silicon material and coupled to the upper surface region at a predetermined height above the upper surface plane. The optical deflection device further comprises a plurality of landing pads including a silicon material and coupled to the upper surface region at the predetermined height from the upper surface plane and a mirror structure. The mirror structure includes a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion. | 09-17-2009 |
20090233244 | METHOD AND SYSTEM FOR OVERLAY CORRECTION DURING PHOTOLITHOGRAPHY - A method of performing overlay error correction includes forming a photoresist layer over a substrate and exposing a first set of apertures to incident radiation. The method also includes determining an overlay error associated with the first set of apertures and determining an overlay correction as a function of the determined overlay error. The method further includes exposing a data area and a second set of apertures. The data area and the second set of apertures are exposed based, in part, on the determined overlay correction. Moreover, the method includes verifying the determined overlay correction. | 09-17-2009 |
20100194241 | THIN-FILM BULK ACOUSTIC RESONATORS HAVING PERFORATED BODIES THAT PROVIDE REDUCED SUSCEPTIBILITY TO PROCESS-INDUCED LATERAL DIMENSION VARIATIONS - Micro-electromechanical acoustic resonators include a resonator body suspended over a substrate. The resonator body may have a single perforation therein, which may extend substantially or completely therethrough. The resonator body may also be configured to have a center-of-mass within an interior of the perforation and/or a nodal line that overlaps the perforation. A perimeter and depth of the single perforation can be configured to reduce a susceptibility of the acoustic resonator to process-induced variations in resonant frequency relative to an otherwise equivalent resonator that omits the single perforation. In other embodiments, the resonator body may have multiple perforations therein that extend along a nodal line of the resonator. | 08-05-2010 |
20100194246 | Thin-Film Bulk Acoustic Resonators Having Reduced Susceptibility to Process-Induced Material Thickness Variations - Thin-film bulk acoustic resonators include a resonator body (e.g., silicon body), a bottom electrode on the resonator body and a piezoelectric layer on the bottom electrode. At least one top electrode is also provided on the piezoelectric layer. In order to inhibit process-induced variations in material layer thicknesses from significantly affecting a desired resonant frequency of the resonator, the top and bottom electrodes are fabricated to have a combined thickness that is proportional to a target thickness of the piezoelectric layer extending between the top and bottom electrodes. | 08-05-2010 |
20100194499 | Micro-Electromechanical Devices Having Variable Capacitors Therein that Compensate for Temperature-Induced Frequency Drift in Acoustic Resonators - Micro-electromechanical devices include a temperature-compensation capacitor and a thin-film bulk acoustic resonator having a first terminal electrically coupled to an electrode of the temperature-compensation capacitor. The temperature-compensation capacitor includes a bimorph beam having a first electrode thereon and a second electrode extending opposite the first electrode. This bimorph beam is configured to yield an increase in spacing between the first and second electrodes in response to an increase in temperature of the micro-electromechanical device. This increase in spacing between the first and second electrodes leads to a decrease in capacitance of the temperature-compensation capacitor. Advantageously, this decrease in capacitance can be used to counteract a negative temperature coefficient of frequency associated with the thin-film bulk acoustic resonator, and thereby render the resonant frequency of the micro-electromechanical device more stable in response to temperature fluctuations. | 08-05-2010 |
20110059565 | METHOD AND APPARATUS FOR MEMS OSCILLATOR - A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals. | 03-10-2011 |
20110111544 | MEMS MIRROR SYSTEM FOR LASER PRINTING APPLICATIONS - A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes. | 05-12-2011 |
20120034724 | METHOD AND APPARATUS FOR MEMS OSCILLATOR - A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material layer. The resonator structure is coupled to the CMOS substrate and configured to resonate in response to the one or more control signals. | 02-09-2012 |
20140268292 | MULTI-STATE SHUTTER ASSEMBLIES HAVING SEGMENTED DRIVE ELECTRODE SETS - This disclosure provides systems, methods and apparatus incorporating display elements having light modulators that can operate in more than two states. In some implementations, the light modulator assembly includes an electrostatic actuator that includes a load electrode coupled to a shutter and a drive electrode set positioned proximate to the load electrode. The drive electrode set includes a plurality of discrete portions that are configured to drive the light modulator assembly to a plurality of different light modulator states. In some such implementations, the portions of the drive electrode set are positioned opposite to corresponding regions of the load electrode. In some implementations, the portions are arranged such that the portions are configured to electrostatically engage with adjacent regions of the load electrode. | 09-18-2014 |