Patent application number | Description | Published |
20100044844 | LEAD FRAME, RESIN PACKAGE, SEMICONDUCTOR DEVICE AND RESIN PACKAGE MANUFACTURING METHOD - A pressure loss section H | 02-25-2010 |
20100072433 | RESIN PACKAGE AND PRODUCTION METHOD THEREOF - The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution. | 03-25-2010 |
20100227175 | METHOD FOR FUSION BONDING MOLDED ARTICLE OF LIQUID CRYSTALLINE POLYMER AND GLASS SUBSTRATE TO EACH OTHER AND COMPOSITE ARTICLE OBTAINED BY THE METHOD - A method for fusion bonding a molded article of a liquid crystalline polymer and a glass substrate to each other, comprising bringing the molded article into contact with the glass substrate; and setting the temperature of a contact portion of the molded article in contact with the glass substrate, at a predetermined temperature, wherein when the predetermined temperature of the contact portion is represented by T | 09-09-2010 |
20110128743 | METHOD FOR PRODUCING LIQUID CRYSTALLINE POLYESTER, LIQUID CRYSTALLINE POLYESTER COMPOSITION, REFLECTOR PLATE AND LIGHT-EMITTING DEVICE - The present invention provides a method for producing a liquid crystalline polyester, the method comprising the steps of reacting monomers to obtain a polycondensate corresponding thereto, granulating the polycondensate to obtain a granule, and subjecting the granule to solid-phase polymerization to obtain a liquid crystalline polyester, wherein the content of iron in the granule to be subjected to the step (C) is 5 ppm by weight or less. According to the present invention, a liquid crystalline polyester having high whiteness and excellent heat resistance can be produced with satisfactory operability. | 06-02-2011 |
20110189454 | LIQUID CRYSTALLINE POLYESTER COMPOSITION, METHOD FOR PRODUCING THE SAME, AND CONNECTOR - The present invention provides a composition comprising a liquid crystalline polyester, a plate-like filler and a carbon black having a number average particle size of more than 20 nm and 45 nm or less. The composition is less likely to cause blister even at a high temperature. | 08-04-2011 |
20110189455 | METHOD FOR PRODUCING LIQUID CRYSTALLINE POLYESTER COMPOSITION, AND CONNECTOR - The present invention provides a method for producing a composition, the method feeding a liquid crystalline polyester and mica into an extruder having a vent section, and melt-kneading them under the conditions where the degree of pressure reduction of the vent section is −0.06 MPa or less in terms of a gauge pressure. The production method can provide a composition containing a liquid crystalline polyester and mica, the composition being less likely to cause blister event at a high temperature. | 08-04-2011 |
20110245432 | METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION - The present invention provides a method for producing a thermoplastic resin composition, the method comprising a step of melt-kneading 5 to 55 parts by weight of an aromatic polycarbonate resin and 95 to 45 parts by weight of an aromatic polysulfone resin while shearing at a sharing speed of 1,000 to 9,000/sec. By the method, a thermoplastic resin composition excellent heat resistance and transparency can be obtained. | 10-06-2011 |
20120025421 | METHOD FOR PRODUCING LIQUID CRYSTAL POLYESTER COMPOSITION - The present invention provides a method for producing a liquid crystal polyester composition, the method comprising feeding a liquid crystal polyester and a polyhydric alcohol fatty acid ester into an extruder having a vent portion, followed by melt-kneading in a state where the degree of decompression of the vent portion is −0.06 MPa or less in terms of a gauge pressure. The composition obtained by the method can provide a molded article having a thin wall portion and complicated shape. | 02-02-2012 |
20120235090 | METHOD OF PRODUCING LIQUID CRYSTAL POLYESTER COMPOSITION - A method of producing a liquid crystal polyester composition, the twin-screw extruder including a cylinder having a supply port for supplying the liquid crystal polyester, a first addition port for adding the filler other than fibrous fillers and a second addition port for adding a fibrous filler which are provided downstream of the supply port, and a screw provided with kneading portions on the upstream side and downstream side of the first addition port, a resin temperature (T | 09-20-2012 |
20120241688 | METHOD FOR PRODUCING LIQUID CRYSTAL POLYESTER COMPOSITION - An object is to provide a method for producing a liquid crystal polyester composition which is excellent in mechanical strength and has semiconductivity. The present invention provides a method for producing a liquid crystal polyester composition, which includes the step of melt-kneading a liquid crystal polyester in the amount of 85 to 99 parts by mass and a nanostructured hollow-carbon material in the amount of 1 to 15 parts by mass, based on 100 parts by mass in total of the liquid crystal polyester and the nanostructured hollow-carbon material, under shear rate of 1,000 to 9,000/second, the nanostructured hollow-carbon material including a carbon part and a hollow part, and having such a structure that a part or all of the hollow part is surrounded by the carbon part. | 09-27-2012 |
20120280375 | SEMICONDUCTOR PACKAGE AND RADIATION LEAD FRAME - In a package wherein a lead part coupled to a semiconductor element by wire bonding, an element retention member to retain the semiconductor element on the top face side and radiate heat on the bottom face side, and an insulative partition part to partition the lead part from the element retention member with an insulative resin appear, a creeping route ranging from the top face to retain the semiconductor element to a package bottom face on a boundary plane between the element retention member and an insulative partition part includes a bent route having a plurality of turns. Consequently, it is possible to inhibit an encapsulation resin to seal a region retaining the semiconductor element from exuding toward the bottom face side of the package. | 11-08-2012 |
20140001678 | METHOD FOR MANUFACTURING LIQUID CRYSTAL POLYESTER MOLDED BODIES | 01-02-2014 |