Patent application number | Description | Published |
20080285914 | Optical Module - An optical module includes an optical element mount substrate having a laser diode and a photo detector mounted thereon on a straight line in a horizontal direction of the surface of the substrate, a first optical function integrate substrates, provided in its one surface with surfaces tilted at an angle to the parallel surface of the substrate for refracting light propagated in a substrate thickness direction, the two tilted surfaces being arranged to face each other. The photo detector and the first and second optical function integrate substrates are laminated in the substrate thickness direction, a first optical wavelength filter and a reflecting film having different wavelength transmissivities to the propagation light are provided in an optical path between the first and second tilted surfaces. | 11-20-2008 |
20080285974 | Optical Multiplexer/Demultiplexer - An optical multiplexer/demultiplexer comprising a member, of which first and second opposite planar surfaces are parallel to each other. The member includes therein a void, of which third and fourth opposite planar surfaces are in parallel to each other. An extension of a first line lying on the first planar surface and an extension of a third line lying on the third planar surface intersect each other in a cross section including the void of the member, a smaller one of intersection angles thereof being φ | 11-20-2008 |
20090003761 | Optoelectronic Integrated Circuit Device and Communications Equipment Using Same - A photoelectric integrated circuit device, in which photonic devices provided on the same substrate as the LSI are densely arranged along the four sides of the LSI, and characteristic degradation of the laser diode or photo detector due to heat generation can be prevented, furthermore optical wiring is easily performed on the board. A quadrilateral package substrate | 01-01-2009 |
20090080830 | OPTOELECTRONIC INTEGRATED CIRCUIT BOARD AND COMMUNICATIONS DEVICE USING THE SAME - In the optical connection between multi-layered optical waveguides and photoelectric converting elements or optical waveguide array connectors formed on a substrate, the optical coupling efficiency is to be prevented from degrading due to deviation of the optical axis positions between optical elements and the optical waveguide layers that is caused by a radiation due to a beam expansion or by a deviation of positioning layers in producing the optical waveguides. There are stacked, on a substrate, optical waveguide layers, each of which comprises a clad layer and a core having a higher refractive index than the clad layer, and optical elements formed on the uppermost optical waveguide layer. The optical elements are positioned such that they correspond to the optical path conversion mirrors of the cores of the underlaying optical waveguide layer. The light transmission/reception between the optical elements and the optical path conversion mirrors of the cores of the underlaying optical waveguide layer is performed via the cores of overlying optical waveguide layer. | 03-26-2009 |
20090263078 | Optical device - Plural p-n junctions are formed in a waveguide such that they have junction interfaces in a normal direction to a surface of a substrate (to an extending direction of the substrate). Accordingly, a doping concentration changes in only a horizontal direction in the substrate, and it is possible to fabricate using the same processes as those for silicon electronic devices and to perform device fabricating at a low cost. Moreover, two or more junction interfaces are formed in the waveguide and thus an occupied area of the waveguide in a refractive index modulation region expands. Therefore, the efficiency of the refractive index modulation can be improved and a low-voltage operation is possible. | 10-22-2009 |
20090297095 | PLANAR OPTICAL WAVEGUIDE ARRAY MODULE AND METHOD OF FABRICATING THE SAME - The optical element array and an optical waveguide array are optically connected on the substrate. The optical waveguide array includes optical waveguide channels which are the outermost optical waveguide channels on both sides of optical waveguide array channels and each of which is provided with a mirror structure for light redirection. With the optical element array driven by a bias applied thereto, the optical waveguide array is brought near the optical element array. The optical axes of the optical waveguide array channels and the optical element array are aligned while monitoring optical signals outputted from the outermost optical waveguide channels on both sides of the optical waveguide array channels via the mirror structures for light redirection. The optical waveguide array is fixed to the substrate in such a position that the optical signals have a desired output value. | 12-03-2009 |
20100054671 | STRUCTURE COMPRISING OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC PACKAGE - A structure which is able to stably achieve electrical coupling, and which is capable of efficient optical coupling is provided. Optical coupling is achieved with the lower surface of an opto-electric package and the upper surface of an opto-electric hybrid board. On the other hand, electrical connection is achieved by means of contact between electrodes on the side surfaces of the opto-electric package and electrodes on the inner-wall side surfaces of a socket mounted on the opto-electric hybrid board. The electrodes are in electrical contact with electrical wiring. | 03-04-2010 |
20100158067 | OPTICAL MODULE - An optical module comprising a laser device adapted to emit a laser beam from a convex surface and including a horizontal resonator surface-emitting structure provided with a first lens through which an optical axis of the laser beam passes, and a second lens through which the laser beam having passed through the first lens passes, a surface opposed to the second lens-provided surface and the surface provided with the first lens being bonded together through a first adhesive transparent to the laser beam. | 06-24-2010 |
20100166363 | OPTICAL WAVEGUIDE SUBSTRATE AND SUBSTRATE MOUNTING PHOTOELECTRIC HYBRID CIRCUIT - There are provided a substrate mounted with a photoelectric hybrid circuit having an optical path conversion mirror structure and optical waveguide wiring by reducing the number of parts and the number of fabrication steps, as well as most effectively implement high-density wiring for an optical connection between the optical waveguide and the photoelectric conversion element or optical waveguide array connector that are formed on the substrate, and a device. An optical waveguide layer | 07-01-2010 |
20100209041 | PHOTOELECTRIC COMPOSITE WIRING MODULE AND METHOD FOR MANUFACTURING THE SAME - A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer. | 08-19-2010 |
20100215313 | OPTICAL INTERCONNECTION ASSEMBLED CIRCUIT - An optical interconnection assembled circuit capable of reducing the number of parts and components, as well as the number of manufacturing processes and capable of mounting those parts and components at a high density in an optical module, thereby realizing a low price. The optical interconnection assembled circuit includes a substrate including plural optical waveguides having partial tapered surfaces respectively, as well as an optical element array facing each of the tapered surfaces. In the optical interconnection assembled circuit, the tapered surfaces and the optical element array are fastened so that they face each other and the optical elements of the optical element array are staggered in disposition. | 08-26-2010 |
20100247043 | OPTICAL MODULE AND WAVELENGTH DIVISION MULTIPLEXING OPTICAL MODULE - An optical module is formed by sticking the optical element mounting substrate and the sealing substrate together, then by sealing the stuck body. The optical mounting substrate includes an optical element on its top surface and it is used to guide electrical signals to its back side through a through-via hole provided in itself. The sealing substrate includes a lens at its back side and a recessed part used to hold an optical fiber at its front side. | 09-30-2010 |
20100265983 | SURFACE EMITTING LASER MODULE AND VERTICAL ILLUMINATED PHOTODIODE MODULE - In order to provide a compact optical module permitting highly efficient optical coupling and having components thereof highly densely packaged, a light emitting diode that is included in the optical module and emits light in a vertical direction with respect to a principal surface of a semiconductor substrate is provided with a lens integrated into a light emitting region, and a retaining section integrated to surround the light emitting region. Accordingly, readiness in alignment of the light emitting diode and an optical fiber, which guides light emitted from the light emitting diode, with each other is upgraded. Eventually, the compact optical module permitting highly efficient optical coupling and having components thereof highly densely packaged can be provided. | 10-21-2010 |
20110026878 | Optical I/O Array Module and Its Fabrication Method - In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated. | 02-03-2011 |
20110052118 | Fabrication Method of Optical Wiring Board and Optical Printed Circuit Board - The fabrication of an optical wiring board is performed in the following manner: A core member | 03-03-2011 |
20110299808 | Optical Waveguide and Optical Waveguide Module - An optical waveguide module which satisfies highly-accurate and stable optical connection between optical elements and optical waveguides and can be easily fabricated is provided. As means for it, in an optical waveguide module having: an optical waveguide surrounded by a cladding layer and provided with a mirror part formed of a tapered surface on a first end side; an optical element having a concave part in a first surface of a semiconductor substrate; and a convex member provided on the cladding layer so as to be planarly overlapped with the mirror part, the convex member is mated with the concave part of the optical element. | 12-08-2011 |
20120128292 | Photoelectric Composite Wiring Module and Method for Manufacturing Same - A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided. | 05-24-2012 |
20120183009 | HORIZONTAL CAVITY SURFACE EMITTING LASER DIODES, VERTICAL ILLUMINATED PHOTODIODES, AND METHODS OF THEIR FABRICATION - The horizontal cavity surface emitting laser includes a cavity structure portion including a stacked structure of a first conduction type clad layer, an active layer and a second conduction type clad layer stacked over a semiconductor substrate and causing light generated by the active layer to be reflected or resonated, an optical waveguide layer provided at part of the semiconductor substrate and guiding the light, a reflector provided in the optical waveguide layer, for reflecting the light and emitting the light from the back surface of the semiconductor substrate, and a condensing lens provided at the back surface thereof and focusing the reflected light. The back surface thereof has a groove provided with the condensing lens and a terrace-like portion disposed below the cavity structure portion and has a terrace shape with the cleavage direction along a longitudinal direction thereof provided along a cleavage direction of the semiconductor substrate. | 07-19-2012 |
20120213470 | OPTICAL WAVEGUIDE SUBSTRATE HAVING POSITIONING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING OPTO-ELECTRIC HYBRID SUBSTRATE - In the optical waveguide board, simultaneously with pattern formation of mirror members at arbitrary positions on a clad layer | 08-23-2012 |
20120230361 | SURFACE EMISSION LASER - Specifically, provided is a horizontal-cavity surface-emitting laser including, on a semiconductor substrate: a cavity structure; a waveguide layer; and a reflecting part, wherein a first electrode provided on the semiconductor substrate along side regions of the cavity structure and the reflecting part and a second electrode provided on the main surface of the cavity structure are provided, the first electrode includes an electrode (1) that is provided around one side region of the reflecting part located in the direction intersecting with the traveling direction of light guided through the waveguide layer and an electrode (2) provided around one side region of the cavity structure and the other side region of the reflecting part that are located in the direction parallel with the traveling direction of light guided through the waveguide layer, and the shape of the electrode (2) has different widths at at least two positions. | 09-13-2012 |
20120250711 | Optical Module - An optical module providing higher reliability during high-speed light modulation and a lower bit error rate when built into a transmitter (transceiver). An optical module contains a taper mirror for surface emission of output light, an optical modulator device, and an optical modulation drive circuit, and the optical modulator device and the optical modulation drive circuit are mounted at positions so as to enclose the taper mirror. | 10-04-2012 |
20120251033 | OPTICAL INTERCONNECTION MODULE AND OPTICAL-ELECTRICAL HYBRID BOARD - There are provided an optical interconnection module and an optical-electrical hybrid board using the same to process optical and electric signals on a board at a low transmission loss at high speed in transmitting high-speed optical signals sent and received between chips or between boards in a data processing apparatus. An optical interconnection module has a structure in which an optical signal is emitted from a laser optical source device, propagates the inside of a modulator device, and is deflected by a beam turning structure in the vertical direction of a substrate, an optical signal is incident from the outside of a semiconductor substrate, and transmitted and received at a photo diode provided on the semiconductor substrate, and the optical signals are optically connected to each other through the inside of the semiconductor substrate in the vertical direction of the substrate with the outside of the semiconductor substrate. | 10-04-2012 |
20120328229 | Optical Module - There is provided an optical module including photonic devices set in array, prepared by integrating a plurality of photonic devices with each other in such a state as arranged in such a array as to enable light beams to output in the common direction. The plural photonic devices each include a first electrode, and a second electrode, arranged in the same direction as the plural photonic devices are arranged, and the first and second electrodes of the photonic devices adjacent to each other are disposed such that respective electrode layouts are a mirror image of each other. | 12-27-2012 |
20130101251 | Optical Module and Multilayer Substrate - In first and second electrode pads adjacent to each other formed over a multilayer substrate, the first electrode pad is connected with a first conductive via and a first internal layer conductive line successively. The second electrode pad is connected with a surface layer conductive line, third electrode pad, second conductive via, and second internal layer conductive line of the multilayer substrate. A ground conductive via or a power source conductive via is disposed between the first internal layer conductive line and the surface layer conductive line. A ground conductive line layer or power source conductive line layer is disposed between a first formation layer where the first internal layer conductive line is formed and a second formation layer where the second internal layer conductive line is formed. The first and second electrode pads are connected with the electrode pads formed on the surface of first and second optical devices. | 04-25-2013 |