Patent application number | Description | Published |
20090010797 | COPPER ALLOY PLATE FOR ELECTRIC AND ELECTRONIC PARTS HAVING BENDING WORKABILITY - A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet. | 01-08-2009 |
20090053099 | ALUMINUM ALLOY SHEET WITH EXCELLENT HIGH-TEMPERATURE PROPERTY FOR BOTTLE CAN - An aluminum alloy sheet for bottle cans superior in high-temperature properties and capable of preventing thermal deformation thereof in coating and heat treatment and securing can strength after the heat treatment. The aluminum alloy sheet has the following composition: Mn 0.7-1.5%, Mg 0.8-1.7%, Fe 0.1-0.7%, Si 0.05-0.5%, Cu 0.1-0.6%, with the remainder being Al and inevitable impurities, and has a crystal structure elongated in a rolling direction and with an aspect ratio of crystal grains of 3 or more as determined through an examination from above of a part located at the center in the through-thickness direction. In the sheet, the amount of solute Cu is 0.05-0.3%, which means the amount of Cu in a solution separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol, and the amount of solute Mg is 0.75-1.6%, which means the amount of solute Mg separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol. The aluminum alloy sheet can have improved high-temperature properties without impairing its formability. | 02-26-2009 |
20090084473 | COPPER ALLOY WITH HIGH STRENGTH AND EXCELLENT PROCESSABILITY IN BENDING AND PROCESS FOR PRODUCING COPPER ALLOY SHEET - The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability. | 04-02-2009 |
20090101243 | Copper Alloy Having High Strength, High Electric Conductivity and Excellent Bending Workability - The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability. | 04-23-2009 |
20090116996 | COPPER ALLOY, COPPER ALLOY PLATE, AND PROCESS FOR PRODUCING THE SAME - A copper alloy with an excellent stress relaxation resistance including Ni: 0.1 through 3.0 mass %, Sn: 0.01 through 3.0 mass %, P: 0.01 through 0.3 mass % and remainder copper and inevitable impurities, and the Ni content in extracted residues separated and left on a filter having filter mesh size of 0.1 μm by using an extracted residues method accounting for 40 mass % or less of the Ni content in the copper alloy, wherein the extracted residues method requires that 10 g of the copper alloy is immersed in 300 ml of a methanol solution which contains 10 mass % of ammonium acetate, and using the copper alloy as the anode and platinum as the cathode, constant-current electrolysis is performed at the current density of 10 mA/cm | 05-07-2009 |
20090311128 | COPPER ALLOY SHEETS FOR ELECTRICAL/ELECTRONIC PART - A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. | 12-17-2009 |
20100072584 | COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PARTS - A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601. | 03-25-2010 |
20100284851 | COPPER ALLOY SHEET EXCELLENT IN RESISTANCE PROPERTY OF STRESS RELAXATION - The invention provides a Cu—Ni—Sn—P alloy sheet satisfying the resistance property of stress relaxation in the direction perpendicular to the rolling direction and excellent in the other necessary properties as terminals and connectors. The invention relates to a Cu—Ni—Sn—P alloy sheet having a specific composition, which is made to contain specific atomic clusters containing at least any of an Ni atom or a P atom, as detected with a three-dimensional atom probe field ion microscope, in a specific density, by increasing the reduction ratio in the final cold rolling and by intentionally shortening the time for the rolling and the time to be taken before the final annealing at low temperature, and of which the necessary properties as a terminal or connector | 11-11-2010 |
20110223056 | COPPER ALLOY SHEET - The present invention relates to a Cu—Ni—Sn—P-based copper alloy sheet having a specific composition, where (1) the copper alloy sheet is set to have an electrical conductivity of 32% IACS or more, a stress relaxation ratio in the direction parallel to the rolling direction of 15% or less, a 0.2%-proof stress of 500 MPa or more and an elongation of 10% or more; (2) the X-ray diffraction intensity ratio I(200)/I(220) in the sheet surface is set to be a given value or less and at the same time, anisotropy in the stress relaxation resistance characteristic is reduced by fining the grain size; (3) the texture of the copper alloy sheet is set to a texture such that the distribution density of B orientation and the sum of distribution densities of B orientation, S orientation and Cu orientation each is set to fall in a specific range and bendability is thereby enhanced; or (4) the dislocation density measured using the value obtained by dividing the half-value breadth of the X-ray diffraction intensity peak from {200} plane in the copper alloy sheet surface by the peak height is set to a given value or more and press punchability is thereby enhanced. The Cu—Ni—Sn—P-based copper alloy sheet of the present invention is excellent in the properties required for a terminal or connector and further (1) has excellent strength-ductility balance, (2) satisfies the stress relaxation resistance characteristic in the direction orthogonal to the rolling direction, (3) has excellent bendability, or (4) has excellent press punchability. | 09-15-2011 |
Patent application number | Description | Published |
20090101323 | COPPER ALLOY TUBE FOR HEAT EXCHANGER EXCELLENT IN FRACTURE STRENGTH - The present invention provides a copper alloy tube for heat exchangers which is tolerable to a high operating pressure of new cooling media such as carbon dioxide and HFC-based fluorocarbons, and is excellent in fracture strength, even if the tube is thinned, and a copper alloy tube for a heat exchanger which has a composition having specified amounts of Sn and P, has an average crystal grain size of 30 μm or less and has a high strength of 250 MPa or more of a tensile strength in the longitudinal direction of the tube improves the fracture strength as a texture in which the orientation distribution density in the Goss orientation is 4% or less. | 04-23-2009 |
20110182767 | COPPER ALLOY, COPPER ALLOY PLATE, AND PROCESS FOR PRODUCING THE SAME - A copper alloy with an excellent stress relaxation resistance including Ni: 0.1 through 3.0 mass %, Sn: 0.01 through 3.0 mass %, P: 0.01 through 0.3 mass % and remainder copper and inevitable impurities, and the Ni content in extracted residues separated and left on a filter having filter mesh size of 0.1 μm by using an extracted residues method accounting for 40 mass % or less of the Ni content in the copper alloy, wherein the extracted residues method requires that 10 g of the copper alloy is immersed in 300 ml of a methanol solution which contains 10 mass % of ammonium acetate, and using the copper alloy as the anode and platinum as the cathode, constant-current electrolysis is performed at the current density of 10 mA/cm | 07-28-2011 |
20120039741 | COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PARTS - A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601. | 02-16-2012 |
20120039742 | COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PARTS - A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601. | 02-16-2012 |
20120039743 | COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PARTS - A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601. | 02-16-2012 |
20120148439 | COPPER ALLOY - A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 μm; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%. | 06-14-2012 |
20120227870 | ALUMINUM-ALLOY SHEET AND METHOD FOR PRODUCING THE SAME - An aluminum-alloy sheet includes 0.10 to 0.40 mass % of Si, 0.35 to 0.80 mass % of Fe, 0.10 to 0.35 mass % of Cu, 0.20 to 0.80 mass % of Mn, and 1.5 to 2.5 mass % of Mg, the balance being Al and unavoidable impurities, wherein a content ratio (Si/Fe) of the Si to the Fe is 0.75 or less, the solute Mn content is 0.12 to 0.20 mass %, and the aluminum-alloy sheet has a proof stress of 225 N/mm | 09-13-2012 |
20120227871 | ALUMINUM-ALLOY SHEET AND METHOD FOR PRODUCING THE SAME - An aluminum-alloy sheet includes 0.10 to 0.40 mass % of Si, 0.35 to 0.80 mass % of Fe, 0.10 to 0.35 mass % of Cu, 0.20 to 0.80 mass % of Mn, and 1.5 to 2.5 mass % of Mg, the balance being Al and unavoidable impurities, wherein a content ratio (Si/Fe) of the Si to the Fe is 0.75 or less, the area fraction of Mg | 09-13-2012 |
20120288402 | COPPER ALLOY HAVING HIGH STRENGTH, HIGH ELECTRIC CONDUCTIVITY AND EXCELLENT BENDING WORKABILITY - A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability. | 11-15-2012 |
20120308429 | COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PART - A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less. | 12-06-2012 |
20130045130 | COPPER ALLOY HAVING HIGH STRENGTH, HIGH ELECTRIC CONDUCTIVITY AND EXCELLENT BENDING WORKABILITY - The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. | 02-21-2013 |
20140003993 | ALUMINUM ALLOY SHEET EXCELLENT IN BAKING FINISH HARDENABILITY | 01-02-2014 |
20140193293 | COPPER ALLOY - Disclosed is a copper alloy containing 1.0% to 3.6% of Ni, 0.2% to 1.0% of Si, 0.05% to 3.0% of Sn, 0.05% to 3.0% of Zn, with the remainder including copper and inevitable impurities. The copper alloy has an average grain size of 25 pm or less and has a texture having an average area percentage of cube orientation of 20% to 60% and an average total area percentage of brass orientation, S orientation and copper orientation of 20% to 50%. The copper alloy has a KAM value of 0.8 to 3.0 and does not suffer from cracking even when subjected to U-bending. The copper alloy has excellent balance between strengths (particularly yield strength in a direction perpendicular to the rolling direction) and bending workability. | 07-10-2014 |