Patent application number | Description | Published |
20130056031 | Apparatus and Methods for Movable Megasonic Wafer Probe - Methods and apparatus for a movable megasonic wafer probe. A method is disclosed including positioning a movable probe on a wafer surface, the movable probe having an open bottom portion that exposes a portion of the wafer surface; applying a liquid onto the wafer surface through a bottom portion of the movable probe; and moving the movable probe at a predetermined scan speed to traverse the wafer surface, applying the liquid to the wafer surface while moving over the wafer surface. In additional embodiments the method includes providing a transducer for applying megasonic energy to the wafer surface. Apparatus embodiments are disclosed including the movable megasonic wafer probe. | 03-07-2013 |
20130068960 | Apparatus for Monitoring Ion Implantation - An apparatus for monitoring an ion distribution of a wafer comprises a first sensor and a sensor. The first sensor, the second sensor and the wafer are placed in an effective range of a uniform ion implantation current profile. A controller determines the ion dose of each region of the wafer based upon the detected signal from the first sensor and the second sensor. In addition, the controller adjusts the scanning frequency of an ion beam or the movement speed of the wafer to achieve a uniform ion distribution on the wafer. | 03-21-2013 |
20130280823 | Apparatus for Monitoring Ion Implantation - An apparatus for monitoring an ion distribution of a wafer comprises a first sensor and a sensor. The first sensor, the second senor and the wafer are placed in an effective range of a uniform ion implantation current profile. A controller determines the ion dose of each region of the wafer based upon the detected signal from the first sensor and the second senor. In addition, the controller adjusts the scanning frequency of an ion beam or the movement speed of the wafer to achieve a uniform ion distribution on the wafer. | 10-24-2013 |
20140196744 | METHOD AND DEVICE FOR CLEANING A BRUSH SURFACE HAVING A CONTAMINATION - A method for cleaning a brush surface having a contamination is provided. The method includes steps of: providing a mechanical wave; and stripping off the contamination from the brush surface by the mechanical wave. | 07-17-2014 |
Patent application number | Description | Published |
20130229349 | OPTICAL TOUCH INPUT BY GESTURE DETECTION FROM VARYING IMAGES - Optical imaging is used for touch input to implement device and method for gesture detection for better durableness, high resolution, simplifier structure, higher reliability, less power consumption, and faster response. A touch surface is provided for gesture operation thereon, and under light projecting to the touch surface, images are captured by receiving light from the touch surface. The varying images are monitored to detect if any gesture operates on the touch surface, and if a predefined gesture is detected, a gesture signal is generated. | 09-05-2013 |
20130229387 | OPTICAL TOUCH DEVICE, PASSIVE TOUCH CONTROL SYSTEM, AND INPUT DETECTION METHOD - An optical touch device includes a touch surface having a position mapping relationship with entire or a part of a picture displayed on a monitor, detects the object contacting or suspending over the touch surface and the movement of the optical touch device, and generates an absolute position signal according to the position of the detected object to point to the mapped position of the picture, a relative movement signal according to the detected movement of the optical touch device, and a control signal corresponding to the mapped position according to the absolute position signal and the relative movement signal. | 09-05-2013 |
20140049470 | OPTICAL TOUCH CONTROL APPARATUS AND ADJUSTABLE LIGHT GUIDE APPARATUS - An optical touch control apparatus, for detecting displacement between an object and the optical touch control apparatus. The optical touch control apparatus comprises: an object detecting apparatus, for detecting the object to generate an object image, having a first detecting area in a first mode and having a second detecting area in a second mode, wherein the first detecting area is larger than the second detecting area; an image sensor, for capturing at least one frame of the object image; and a control unit, for adjusting an image capturing area of the image sensor, according which one of the first detecting area and the second detecting area the object detecting apparatus utilizes. | 02-20-2014 |
20150189162 | CAMERA DEVICE - A camera device without an image displaying function which is adapted to assemble with a portable electronic device with a vision displaying module is disclosed in the present invention. The camera device is electrically connected to the portable electronic device via wire/wireless connection. The camera device includes a base, a lens module and at least one touch navigation module. The base includes a surrounding component whereinside the lens module is disposed. The lens module includes a lens assembly and a digital processing unit. The touch navigation module is disposed on an outer surface of the surrounding component and electrically connected to the lens module. The touch navigation module detects an input command to trigger the lens assembly to capture an image, or controls parameters of an adjustable mode of the lens assembly via the digital processing unit. | 07-02-2015 |
Patent application number | Description | Published |
20130207218 | Novel Condition Before TMAH Improved Device Performance - The present disclosure relates to a method of forming a back-side illuminated CMOS image sensor (BSI CIS). In some embodiments, the method comprises forming a plurality of photodetectors within a front-side of a semiconductor substrate. An implant is performed on the back-side of the semiconductor substrate to form an implantation region having a doping concentration that is greater in the center than at the edges of the semiconductor substrate. The back-side of the workpiece is then exposed to an etchant, having an etch rate that is inversely proportional to the doping concentration, which thins the semiconductor substrate to a thickness that allows for light to pass through the back-side of the substrate to the plurality of photodetectors. By implanting the substrate prior to etching, the etching rate is made uniform over the back- side of the substrate improving total thickness variation between the photodetectors and the back-side of the substrate. | 08-15-2013 |
20140264707 | NOVEL CONDITION BEFORE TMAH IMPROVED DEVICE PERFORMANCE - The present disclosure relates to a back-side illuminated CMOS image sensor (BSI CIS). In some embodiments, the BSI CSI has a semiconductor substrate with a front-side and a back-side. A plurality of photodetectors are located within the front-side of the semiconductor substrate. An implantation region is located within the semiconductor substrate at a position separated from the plurality of photodetectors. The implantation region is disposed below the plurality of photodetectors and has a non-uniform doping concentration along a lateral plane parallel to the back-side of the semiconductor substrate. The non-uniform doping concentration allows for the BSI CSI to achieve a small total thickness variation (TTV) between one or more photodetectors and a back-side of a thinned semiconductor substrate that provides for good device performance. | 09-18-2014 |
20150236124 | EPITAXY IN SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure including a semiconductor substrate is provided. The semiconductor substrate includes a surface. A gate structure is provided on the surface. An interface lower than the surface is provided. An epitaxial regrowth region adjacent the gate structure is disposed on the interface. In addition, the epitaxial regrowth region extends over the surface and includes a bottom layer and a cap layer. The activation of the cap layer is lower than that of the bottom layer. Moreover, the bottom layer is lower than the surface and the gate structure. Furthermore, the bottom layer includes a first downwardly-curved edge and a second downwardly-curved edge over the first one. The first downwardly-curved edge is connected with the second downwardly-curved edge at two endpoints. The two endpoints are in contact with the surface of the semiconductor substrate. | 08-20-2015 |
20150255578 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a gate structure located on a substrate and a raised source/drain region adjacent to the gate structure. The raised source/drain region includes: a first epitaxial-grown doped layer of the raised source/drain region in contact with the substrate; a second epitaxial-grown doped layer on the first epitaxial-grown doped layer and including a same dopant species as the first epitaxial-grown doped layer, wherein the second epitaxial-grown doped layer includes a higher dopant concentration than the first epitaxial-grown doped layer and interfacing the gate structure by using a predetermined distance; and a third epitaxial-grown doped layer on the second epitaxial-grown doped layer and including the same dopant species as the first epitaxial-grown doped layer, wherein the third epitaxial-grown doped layer includes a higher dopant concentration than the second epitaxial-grown doped layer. | 09-10-2015 |
Patent application number | Description | Published |
20110316813 | OPTICAL TOUCH DISPLAY - When an object touches a touch panel, a projection light source projects a predetermined image including image information and forms an object image having the image information on a surface of the object. An image sensor captures a reflection image including the object image. Then, an angle is calculated according to an image location of the object in the reflection image and a relative position of predetermined axis, and a distance between the object and the image sensor is calculated by comparing the predetermined image with the location, size and/or phase of the image information of the reflection image so as to determine a coordinate of the object on the touch panel according to the angle and the distance. | 12-29-2011 |
20120044213 | Optical Touch Display System - Optical touch display system includes a light source, a reflector, an image sensor, and a processing device. The light source emits light to at least one object directly and emits light to the at least one object via the reflector at the same time. Then the image sensor receives light reflected from the at least one object directly and light reflected via the reflector simultaneously to form a set of imaging objects which have similar color parameters on an image. Then the processing device produces a set of still image parameters of the image objects such as gravity centers and border boundaries. Based on the still image parameters, the processing device determines the coordinates of the least one object on the optical touch display. | 02-23-2012 |
20120188203 | IMAGE SENSING MODULE AND OPTICAL SENSING SYSTEM - An image sensing module utilizes an image sensor to sense objects and a mirror image of the objects in a mirror through a plurality of first light filtering components with a first transmission spectrum and a plurality of second light filtering components with a second transmission spectrum for generating an image. A light filtering module substantially having the first transmission spectrum is disposed in front of the mirror. The image includes a plurality of pixels. Each pixel includes a first sub data and a second sub data. The image sensing module utilizes an image sensing controller to detect real images corresponding to the objects and virtual images correspond to the mirror image of the objects from the image according to the first sub data and the second sub data of the plurality of pixels. | 07-26-2012 |
20130320191 | OPTICAL DETECTING APPARATUS - An optical detecting apparatus, which comprises: a detecting surface; a first light source, for providing light parallel to the detecting surface; an image sensor, for detecting an object close to the detecting surface, to generate object image data; and an object location determining apparatus, for computing location information of the object according to the object image. | 12-05-2013 |
20140027608 | FILM AND LIGHT GUIDE HAVING POSITION INFORMATION AND POSITION DETECTING SYSTEM UTILIZING THE FILM OR THE LIGHT GUIDE - A position detecting system, which comprises: a position information providing apparatus, comprising a light emitting-out side, having at least one position information region distributed on an outer surface of the light emitting-out side, wherein light has position information from the position information region when the light emits out from at least part of the light emitting-out side; a transceiver, for receiving the light with the position information; and a processor, for determining a relative position between the transceiver and the position information providing apparatus according to the position information received by the transceiver. | 01-30-2014 |
20140044308 | IMAGE DETERMINING METHOD AND OBJECT COORDINATE COMPUTING APPARATUS - An image determining method, for determining which pixels in an image are specific image pixels of a specific image, comprising: (a) determining which pixels in the image have brightness values larger than a threshold value; (b) determining the pixels having brightness values larger than the threshold value as the specific image pixels; and determining pixels in a predetermined range of at least one the specific image pixel as the specific image pixels as well. | 02-13-2014 |
20140105453 | GESTURE IDENTIFICATION WITH NATURAL IMAGES - A method for gesture identification with natural images includes generating a series of variant images by using each two or more successive ones of the natural images, extracting an image feature from each of the variant images, and comparing the varying pattern of the image feature with a gesture definition to identify a gesture. The method is inherently insensitive to indistinctness of images, and supports the motion estimation in axes X, Y, and Z without requiring the detected object to maintain a fixed gesture. | 04-17-2014 |
Patent application number | Description | Published |
20120146215 | BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES - A bonding pad structure positioned on an integrated circuit includes a connecting pad, an insulation layer and a gold bump. The connecting pad is formed on the integrated circuit. The insulation layer is formed on the connecting pad, where the insulation layer has only one opening and a shape of the opening includes at least a bend. The gold bump is formed on the insulation layer, where the gold bump is electrically connected to the connecting pad through the opening of the insulation layer. | 06-14-2012 |
20120292761 | BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES - A bonding pad structure positioned on an integrated circuit includes a connecting pad, an insulation layer and a gold bump. The connecting pad is formed on the integrated circuit. The insulation layer is formed on the connecting pad, where the insulation layer has only one opening and a shape of the opening includes at least a bend. The gold bump is formed on the insulation layer, where the gold bump is electrically connected to the connecting pad through the opening of the insulation layer. | 11-22-2012 |
20120299180 | BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES - A bonding pad structure positioned on an integrated circuit includes a connecting pad, an insulation layer and a gold bump. The connecting pad is formed on the integrated circuit. The insulation layer is formed on the connecting pad, where the insulation layer has only one opening and a shape of the opening includes at least a bend. The gold bump is formed on the insulation layer, where the gold bump is electrically connected to the connecting pad through the opening of the insulation layer. | 11-29-2012 |