Patent application number | Description | Published |
20100251772 | MOLTEN GLASS PRODUCING APPARATUS AND MOLTEN GLASS PRODUCING METHOD EMPLOYING THE APPARATUS - The present invention is to provide a molten glass producing apparatus realizing simultaneously the production of a glass article of high quality and save-energy in producing molten glass, a molten glass producing method employing the molten glass producing apparatus and a method for producing a glass article. | 10-07-2010 |
20100319403 | VACUUM DEGASSING APPARATUS AND VACUUM DEGASSING METHOD FOR MOLTEN GLASS - The present invention provides a vacuum degassing apparatus and a vacuum degassing method for molten glass, which can suppress generation of bubbles on an interface between molten glass and a wall face of a conduit for molten glass such as a vacuum degassing vessel, an uprising pipe or a downfalling pipe that constitute a vacuum degassing apparatus, or influence of lowering of vacuum degassing effect due to rise of the level of molten glass in the vacuum degassing vessel, and which can stably exhibit the effect of vacuum degassing. | 12-23-2010 |
20120324957 | VACUUM DEGASSING APPARATUS AND VACUUM DEGASSING METHOD FOR MOLTEN GLASS - A vacuum degassing apparatus for molten glass is comprised of an uprising pipe, a vacuum degassing vessel, a downfalling pipe, an upstream side pit that supplies molten glass to the uprising pipe, and a downstream side pit that receives molten glass from the downfalling pipe. The vacuum degassing apparatus for molten glass is further comprised of a separating mechanism that separates a part of molten glass moving from the downfalling pipe to the downstream side pit, and a returning pipe that returns separated molten glass to the upstream side pit. | 12-27-2012 |
Patent application number | Description | Published |
20100155713 | Metal complex compound and organic electroluminescent device using same - A metal complex compound having a special structure containing metals such as iridium. An organic electroluminescence device which comprises at least one organic thin film layer sandwiched between a pair of electrode consisting of an anode and a cathode, wherein the organic thin film layer comprises the above metal complex compound, which emits light by applying an electric voltage between the pair of electrode. An organic EL device employing the novel metal complex compound emits various phosphorous lights including blue light having an enhanced current efficiency and prolonged lifetime. | 06-24-2010 |
20110017984 | Metal complex compound and organic electroluminescent device using same - A metal complex compound having a special structure containing metals such as iridium. An organic electroluminescence device which comprises at least one organic thin film layer sandwiched between a pair of electrode consisting of an anode and a cathode, wherein the organic thin film layer comprises the above metal complex compound, which emits light by applying an electric voltage between the pair of electrode. An organic EL device employing the novel metal complex compound emits various phosphorous lights including blue light having an enhanced current efficiency and prolonged lifetime. | 01-27-2011 |
20110121277 | ORGANIC ELECTROLUMINESCENT DEVICE - An organic EL device | 05-26-2011 |
20120153267 | ORGANIC ELECTROLUMINESCENT DEVICE - An organic EL device | 06-21-2012 |
20120169219 | METAL COMPLEX COMPOUND AND ORGANIC ELECTROLUMINESCENT DEVICE USING SAME - A metal complex compound having a special structure containing metals such as iridium. An organic electroluminescence device which comprises at least one organic thin film layer sandwiched between a pair of electrode consisting of an anode and a cathode, wherein the organic thin film layer comprises the above metal complex compound, which emits light by applying an electric voltage between the pair of electrode. An organic EL device employing the novel metal complex compound emits various phosphorous lights including blue light having an enhanced current efficiency and prolonged lifetime. | 07-05-2012 |
Patent application number | Description | Published |
20080246992 | INFORMATION PROCESSING APPARATUS, CONTROL METHOD THEREFOR, AND COMPUTER PROGRAM - Print settings for input data for printing are acquired. A function group is created for each group of functions, between which contradiction due to change of an execution sequence does not arise, of functions executable in a printer. For each created function group, an execution sequence of functions belonging to the function group is set. Processes for functions designated by the acquired print settings are applied to the data for printing in accordance with the execution sequence set for each function group. Print data created by applying the processes are output to the printer. | 10-09-2008 |
20090116060 | PRINT CONTROL APPARATUS, PRINT CONTROLLING METHOD AND MEDIUM - A print control apparatus comprising a storage unit configured to store restriction information which restricts print functions, a determination unit configured to refer to the data storage location specified by the restriction information, compare the attributes of the electronic data stored in the data storage location and the attributes of the print data, and determine whether or not a condition specified in the restriction information is met, and a control unit configured to restrict printing of the print data when it is determined that the condition is met, and configured not to restrict printing of the print data when it is determined that the condition is not met. | 05-07-2009 |
20100182627 | PRINTING CONTROL APPARATUS AND CONTROL METHOD THEREOF - This invention is directed at preventing unnecessary processing and CPU load of a PC when always printing via a printer driver, and avoiding the omission of a printer driver function when always performing direct printing. When using a printer having a direct printing function, which of printing via the printer driver and direct printing is to be done is determined in accordance with print settings of each print job, and then printing is executed. A function to be implemented by the driver among set functions is determined (S | 07-22-2010 |
20100235846 | INFORMATION PROCESSING APPARATUS AND DATA OUTPUT MANAGING SYSTEM - A setup method of an information processing apparatus in which a module as a control program for expanding a printer driver has been installed. A plurality of modules are detected and the information processing apparatus is set up so that the plurality of detected modules execute processes in predetermined operating order. | 09-16-2010 |
20100322661 | PRINT OUTPUT SYSTEM, PRINT CONTROL APPARATUS, AND METHOD FOR THE SAME - A system, a control apparatus, a control method and a computer program are provided which are configured to control a printing output in response to characteristics of a printing apparatus when a plurality of printing apparatuses has different characteristics. A host computer acquires apparatus information including characteristics information indicating the characteristics of a printer and thereby determines a priority order of printers in relation to the print data based on the characteristics information. The host computer then determines a printer to output the print data based on the determined priority order and outputs the print data to the determined printer. | 12-23-2010 |
20110176826 | PRINTING CONTROL APPARATUS, PRINTING CONTROL METHOD, AND PROGRAM - A printing control apparatus includes a storage unit configured to store information about a plurality of print jobs and a plurality of printing devices in a storage device, a detection unit configured to detect the shift of operating status of the plurality of printing devices, a determination unit configured to determine a print job which a printing device prints from the plurality of print jobs based on the information about the plurality of print jobs and the plurality of printing devices stored in the storage device when the shift of the printing device to a standby state is detected by the detection unit, and a print control unit configured to cause the first printing device to print the print job determined by the determination unit. | 07-21-2011 |
20120057177 | IMAGE PROCESSING APPARATUS AND IMAGE PROCESSING METHOD - An image processing apparatus includes a designation unit configured, in printing each of input first and second data by using a spot color printing material, to designate a spot color effect achieved by using the spot color printing material, a first determination unit configured to determine a paper attribute for implementing the designated spot color effect for the first data, a second determination unit configured, to determine a paper attribute for implementing the designated spot color effect for the second data, a setting unit configured to execute a setting of a print appearance for printing the first and the second data on one sheet, and sheet determination unit configured to determine a sheet having the attribute determined by the first and the second determination unit as a sheet onto which the first and the second data is to be printed according to the set print appearance. | 03-08-2012 |
20120331382 | INFORMATION PROCESSING APPARATUS AND CONTROL METHOD THEREOF, AND STORAGE MEDIUM - When a document processing program constituting a workflow system includes a user interface and a plurality of types of editing processing can be executed by a user's operation, an erroneous operation is executed, so that a mismatch may occur in a workflow. When a selected document is transmitted to a second processing program, a user interface that disables a user to select a predetermined function is displayed. | 12-27-2012 |
20130054515 | INFORMATION PROCESSING APPARATUS, DOCUMENT ACCESS METHOD, AND COMPUTER PROGRAM - Provided is a document management system which allows a document management server to be accessed from a document management client terminal by using a database of the document management server as a backend engine, the document management system configured to determine an appropriate access method for opening a file. In order for the document management client terminal to open a file in the document management server having an exclusive control function, the document management system accesses the document management server according to file attribute information of the file held in the document management client terminal. | 02-28-2013 |
20130235402 | INFORMATION PROCESSING APPARATUS AND INFORMATION PROCESSING METHOD - The print output system obtains, when performing printing from a first application that is operated in a first execution environment, information regarding a printer driver, and determines whether or not settings of print functionality can fully be performed in the first execution environment. If it is determined that the settings of print functionality cannot fully be performed, then the print output system causes a second application that is operated in a second execution environment to display a user interface through which print settings are executed and to execute print output, allowing fully utilizing the print functionality. | 09-12-2013 |
20140002328 | INFORMATION PROCESSING APPARATUS, SCREEN DISPLAY METHOD, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM | 01-02-2014 |
Patent application number | Description | Published |
20120119338 | Semiconductor Device And Method Of Manufacturing Semiconductor Device - A semiconductor chip includes a magnetic storage device and includes an electrode pad on a first face. The semiconductor chip is coated with a magnetic shield layer in a state in which at least the electrode pad is exposed. The semiconductor chip is mounted on an interconnect substrate through a bump. At least one of the semiconductor chip and the interconnect substrate includes a convex portion, and the bump is disposed over the convex portion. | 05-17-2012 |
20140327064 | METHOD FOR FABRICATING A METAL-INSULATOR-METAL (MIM) CAPACITOR HAVING CAPACITOR DIELECTRIC LAYER FORMED BY ATOMIC LAYER DEPOSITION (ALD) - In a thin film transistor, each of an upper electrode and a lower electrode is formed of at least one material selected from the group consisting of a metal and a metal nitride, represented by TiN, Ti, W, WN, Pt, Ir, Ru. A capacitor dielectric film is formed of at least one material selected from the group consisting of ZrO | 11-06-2014 |
20140329476 | ELECTRONIC DEVICE - A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device). | 11-06-2014 |
20140361410 | SEMICONDUCTOR DEVICE - This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m>n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction. | 12-11-2014 |
20140361411 | SEMICONDUCTOR DEVICE - This invention can reduce heat that is generated in a first semiconductor chip and transfers, to a second semiconductor chip through through-silicon vias. The first semiconductor chip has the first through-silicon vias. Each of the first through-silicon vias is arranged on any of grid points arranged in m rows and n columns (m>n). The first semiconductor chip also has a first circuit formation area. A first circuit is formed in the first circuit formation area. The first circuit performs signal processing while communicating with the second semiconductor chip. In plan view, the first circuit formation area does not overlap with a through-silicon via area that is defined by coupling the outermost grid points arranged in m rows and n columns. In plan view, some of connection terminals are located between the first circuit formation area and the through-silicon via area. | 12-11-2014 |
Patent application number | Description | Published |
20090283895 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame. | 11-19-2009 |
20090294951 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device that can be readily manufactured, can include a large number of pads, and can be thin, and a method for manufacturing the same are provided. The semiconductor device is characterized in that the semiconductor device includes an LSI chip, an insulating layer provided on the LSI chip and made of a nonphotosensitive resin, the insulating layer including a via hole in the position corresponding to an externally connected pad, and a wiring layer extending along the insulating layer through the via hole to the externally connected pad, and at least part of the via hole is formed by irradiating the insulating layer with laser light. | 12-03-2009 |
20100044845 | CIRCUIT SUBSTRATE, AN ELECTRONIC DEVICE ARRANGEMENT AND A MANUFACTURING PROCESS FOR THE CIRCUIT SUBSTRATE - [Problem to be Solved] There are provided a circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrate which enable to directly implement the surface mounting and so on of electronic components on the conductive wiring without forming solder resist, and also which enable to enhance high speed transmission characteristics and to enlarge wiring rule for the electrode terminal of the function element to be contained therein, and to implement with excellent workability and reliability when connecting the electronic device. | 02-25-2010 |
20110215478 | SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE - In a wiring substrate containing a semiconductor element, the wiring substrate includes a supporting substrate; a semiconductor element provided on the supporting substrate; a peripheral insulating layer covering at least an outer circumferential side surface of the semiconductor element; and upper surface-side wiring provided on the upper surface side of the wiring substrate. The semiconductor element includes a semiconductor substrate; a first wiring-structure layer including first wiring and a first insulating layer alternately formed on the semiconductor substrate; and a second wiring-structure layer including second wiring and a second insulating layer alternately formed on the first wiring-structure layer. The upper surface-side wiring includes fan-out wiring led out from immediately above the semiconductor element to a peripheral region external to an outer edge of the semiconductor element. The fan-out wiring is electrically connected to the first wiring through the second wiring. The second wiring is thicker than the first wiring but thinner than the upper surface-side wiring. The second insulating layer is formed of a resin material and is thicker than the first insulating layer. | 09-08-2011 |
20120300425 | FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE - An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer. | 11-29-2012 |
20130009325 | SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE SUBSTRATE - A semiconductor element-embedded substrate includes a semiconductor element; a chip component; a peripheral insulating layer covering at least the outer circumferential side surfaces thereof; an upper surface-side wiring line provided on the upper surface side of the substrate; and a lower surface-side wiring line provided on the lower surface side of the substrate. The built-in semiconductor element includes a terminal on the upper surface side thereof, and this terminal is electrically connected to the upper surface-side wiring line. The built-in chip component includes an upper surface-side terminal electrically connected to the upper surface-side wiring line; a lower surface-side terminal electrically connected to the lower surface-side wiring line; | 01-10-2013 |
20130026632 | SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE - A wiring substrate in which a semiconductor element is built includes a semiconductor element; a peripheral insulating layer covering at least an outer circumferential side surface of this semiconductor element; and an upper surface-side wiring line provided on the upper surface side of the wiring substrate. The semiconductor element includes an internal terminal electrically connected to the upper surface-side wiring line on the upper surface side of the semiconductor element. This internal terminal includes a first conductive part exposed out of an insulating surface layer of the semiconductor element; an adhesion layer on this first conductive part; and a second conductive part on this adhesion layer. The adhesion layer covers an exposed surface of the first conductive part, and is formed on a portion of the insulating surface layer around the exposed surface of the first conductive part, and the adhesion layer extends around the outer side of an outer edge of this second conductive part so as to surround the second conductive part. | 01-31-2013 |
20150053474 | FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE - An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer. | 02-26-2015 |