Patent application number | Description | Published |
20130134567 | LEAD FRAME AND SEMICONDUCTOR PACKAGE STRUCTURE THEREOF - The present invention relates to the field of semiconductor package structures, and more specifically to a lead frame and a semiconductor package structure thereof. In one embodiment, a lead frame can include a plurality of parallel-arrayed lead fingers with a plurality of grooves situated on surfaces of the lead fingers, where the depths of the grooves can be smaller than the thickness of the lead fingers. In one embodiment, a flip chip semiconductor package structure can include a chip, a group of bumps, and the above-described lead frame. The first surfaces of the bumps can be coupled to the front surface of the chip, and the second surfaces of the bumps can be coupled to the upper surface of the lead frame. | 05-30-2013 |
20130134568 | LEAD FRAME AND FLIP CHIP PACKAGE DEVICE THEREOF - The present invention relates to the field of semiconductor chip packages, and more specifically to a lead frame and flip chip package device thereof. In one embodiment, a lead frame for electrically connecting a chip to outside leads, can include a plurality of lead fingers, where each of the plurality of lead fingers comprises a plurality of outburst regions extending from an edge thereof. In one embodiment, a flip chip package device can include: a chip and a plurality of solder bumps, where one surface of the chip is connected to a first surface of each of the plurality of solder bumps; and the lead frame, where second surfaces of each of the plurality solder bumps are connected with corresponding outburst regions of the lead frame to connect the chip to the lead frame through the solder bumps. | 05-30-2013 |
20140070385 | FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING POWER SUPPLY - Disclosed are flip-chip package structures and methods for an integrated switching power supply. In one embodiment, a flip-chip package structure can include: (i) a die with an integrated switching power supply, where a first surface of the die includes first bumps with different polarities; (ii) a redistribution layer including redistribution layer units, each having a first surface to connect bumps with a same polarity from the first bumps, the redistribution layer having a second surface including second bumps to redistribute polarities; (iii) a lead frame having pins, where a first surface of the lead frame can connect bumps with a same polarity from the second bumps; and (iv) a flip-chip package configured to package the die, the redistribution layer, the first and second bumps, and the lead frame, where a second surface of the lead frame provides electrical connectivity between the integrated switching power supply and a PCB. | 03-13-2014 |
20140070390 | MULTI-CHIP PACKAGING STRUCTURE AND METHOD - Disclosed are multi-chip packaging structures and methods. In one embodiment, a multi-chip packaging structure can include: (i) N chips, where N is an integer of at least two, and where an upper surface of each chip comprises a plurality of pads; (ii) a lead frame with a chip carrier and a plurality of pins, where the N chips are stacked in layers on the chip carrier, and where a chip in an upper layer partially covers a chip in a lower layer such that the plurality of pads of the lower layer chip are exposed; (iii) a plurality of first bonding leads configured to connect pads on one chip to pads on another chip; and (iv) a plurality of second bonding leads configured to connect pads on at least one chip to the plurality of pins for external connection to the multi-chip packaging structure. | 03-13-2014 |
20140097542 | FLIP PACKAGING DEVICE - Disclosed is a flip chip packaging device and structure of interconnections between a chip and a substrate. In one embodiment, a flip chip packaging device can include: (i) a chip and a substrate; (ii) a plurality of first connecting structures and a plurality of second connecting structures that are aligned and configured to electrically connect the chip and the substrate; and (iii) where each of the plurality of first connecting structures comprises a first metal, and each of the plurality of second connecting structures comprises a second metal, and where a hardness of the first metal is less than a hardness of the second metal. | 04-10-2014 |
20140117520 | LEAD FRAME AND FLIP PACKAGING DEVICE THEREOF - Disclosed are various lead frame and flip chip package structures. In one embodiment, a method can include: (i) a plurality of pins, wherein each of the plurality of pins includes an intermediate portion and an extension portion that are connected to each other; (ii) where the intermediate portion is located at an interior region of the lead frame, the intermediate portion extending to a first side edge of the lead frame; and (iii) where the extension portion is located at a peripheral region of the lead frame, the peripheral region being different than the first side edge. | 05-01-2014 |
20140120661 | FLIP CHIP PACKAGING METHOD - Disclosed are various flip chip packaging methods. In one embodiment, a method can include: (i) arranging a plurality of pads on a chip; (ii) arranging a plurality of first connecting structures on the plurality of pads, where each of the first connecting structures comprises a first metal; (iii) arranging a plurality of second connecting structures on the plurality of first connecting structures, where each second connecting structure comprises a second metal, and where a hardness of the first metal is less than a hardness of the second metal; and (iv) flipping the chip with the first and second connecting structures and arranging corresponding of the second connecting structures on pads of a substrate to form electrical connection between the chip and the substrate via the first and second connecting structures. | 05-01-2014 |
20140159218 | CHIP PACKAGING STRUCTURE OF A PLURALITY OF ASSEMBLIES - Disclosed herein are chip packaging structures for packaging multiple assemblies therein. In one embodiment, a chip packaging structure can include: (i) a first assembly located at a bottom layer of the chip packaging structure; (ii) at least one second assembly located above the first assembly, where the second assembly is electrically connected to the first assembly by a plurality of first protruding structures located under the second assembly; (iii) at least one third assembly located above the second assembly, where the third assembly is electrically connected to the first assembly by a plurality of second protruding structures located outside of the second assembly; and (iv) where a first portion of the third assembly and the plurality of second protruding structures form a bent structure substantially perpendicular to a second portion of the third assembly. | 06-12-2014 |
20140159219 | MULTI-COMPONENT CHIP PACKAGING STRUCTURE - Disclosed herein are various chip packaging structures and arrangements. In one embodiment, a multiple-component chip packaging structure can include: (i) a first component arranged on a bottom layer; (ii) at least one second component arranged on the first component, where the at least one the second component is electrically connected to the first component by a plurality of protruding structures; (iii) at least one third component on the at least one second component; (iv) at least one extension structure arranged on at least one side of the at least one third component, where the at least one extension structure is configured to lead out electric polarities of the at least one third component; and (v) a plurality of bonding wires that electrically connect the at least one extension structure to the first component. | 06-12-2014 |
20140167256 | FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF - Disclosed herein are various chip packaging structures and methods of fabrication. In one embodiment, a flip chip package structure can include: (i) a pad on a chip; (ii) an isolation layer on the chip and the pad, where the isolation layer includes a through hole that exposes a portion of an upper surface of the pad; (iii) a metal layer on the pad, where the metal layer fully covers the exposed upper surface portion of the pad; and (iv) a bump on the metal layer, where side edges of the bump do not make contact with the isolation layer. | 06-19-2014 |
20150115425 | MULTI-CHIP STACKED PACKAGE AND METHOD FOR FORMING THE SAME - The present disclosure relates to a multi-chip stacked package and a method for forming the same. The package comprises a chip carrier and multiple levels of chips, with one or more chips being arranged in each level, wherein one or more levels of chips, except for the topmost chips, have conductive vias, a patterned conductor layer is arranged on a back surface of a lower one of two chips in two adjacent levels, conductive bumps are provided between two adjacent levels of chips, and the conductive vias of a lower chip are electrically coupled to an upper chip by means of the patterned conductor layer and the conductive bumps. In the present disclosure, electrical connections are redistributed by means of the patterned conductor layer, and are further used for coupling multiple levels of chips by means of the conductive bumps. The resultant chip has a reduced chip size and can be used for electrically coupling various levels of chips, which achieves flexible electrical connections. | 04-30-2015 |
20150115439 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - The present disclosure relates to a chip package and a method for forming the same. The chip package comprises a carrier pad, a chip, and a plurality of second conductive bumps, and a molding compound. The carrier pad has a first surface with a plurality of first conductive bumps formed thereon. The chip has an active surface. One end of each of the plurality of second conductive bumps is electrically coupled to the active surface, and the other end of each of the plurality of second conductive bumps is electrically coupled to the first conductive bumps. The molding compound encapsulates the chip and completely fills space between the carrier pad and the chip. In the chip package and the method for forming the same according to the present disclosure, the first conductive bumps are formed on the first surface of the carrier pad by etching, which provides an electrical connection between the first conductive bumps and the active surface of the chip, and broadens a flow channel of the molding compound between the chip and the carrier pad so that the molding compound can completely fill the space between the chip and the carrier pad. Underfill before encapsulation is not needed and the package cost is thus lowered. | 04-30-2015 |
20150187738 | PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - A package assembly and a method for manufacturing the same are disclosed. The package assembly includes semiconductor chips, encapsulant layers, and a chip carrier. The plurality of semiconductor chips are stacked in a plurality of levels, including a lowermost level and at least one upper level. The plurality of encapsulant layers cover respective levels of semiconductor chips. The chip carrier is used for mounting lowermost-level semiconductor chips. At least one upper-level semiconductor chips are electrically coupled to the chip carrier by conductive traces. The conductive traces include extension conductors on a surface of a lower-level encapsulant layer and conductive vias which penetrate the lower-level encapsulant layer and are exposed at a bottom surface of the package assembly. The package assembly has improved high-frequency performance while having a small size and supporting multifunctionality. | 07-02-2015 |
20150206857 | FLIP-CHIP PACKAGE STRUCTURE AND METHOD FOR AN INTEGRATED SWITCHING POWER SUPPLY - Disclosed are flip-chip package structures and methods for an integrated switching power supply. In one embodiment, a flip-chip package structure can include: (i) a die with an integrated switching power supply, where a first surface of the die includes first bumps with different polarities; (ii) a redistribution layer including redistribution layer units, each having a first surface to connect bumps with a same polarity from the first bumps, the redistribution layer having a second surface including second bumps to redistribute polarities; (iii) a lead frame having pins, where a first surface of the lead frame can connect bumps with a same polarity from the second bumps; and (iv) a flip-chip package configured to package the die, the redistribution layer, the first and second bumps, and the lead frame, where a second surface of the lead frame provides electrical connectivity between the integrated switching power supply and a PCB. | 07-23-2015 |
20150214141 | INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR - In one embodiment, an IC package assembly for a switching regulator, can include: a power switch chip including a control electrode and a first electrode on an obverse side and a second electrode on a reverse side, where the second electrode is configured as a switching terminal of a switching regulator; a control chip including a driving electrode and a plurality of input and output electrodes on the obverse side; and a leadframe including an extension pin, a substrate, and a plurality of discrete pins, where the extension pin is formed integrally with the substrate, and where the reverse side of the power switch chip is arranged on the substrate of the leadframe by a conductive material to electrically connect the second electrode to the substrate. | 07-30-2015 |
20150214200 | PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - A package assembly and a method for manufacturing the same are disclosed. The package assembly includes a leadframe having at least two groups of leads and a plurality of electronic devices arranged in at least two levels. Each group of leads is electrically coupled to a respective level of electronic devices. The package assembly further includes an interconnect for coupling one or more leads of one group of leads to one or more leads of another group of leads. The package assembly results in increased packaging density, less usage of bonding wires in the package assembly, improves reliability, and prevents possible interference. | 07-30-2015 |
20160113144 | PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - A package assembly can include: (i) a plurality of electrical components stacked on at least two layers; (ii) a lead frame connected to the electrical components by solder interconnection; (iii) an encapsulating compound overlapping a portion of the lead frame and the electrical components to expose portions of leads of the lead frame from the encapsulating compound; and (iv) a heat sink having a first portion arranged between at least two of the plurality of electrical components on adjacent of the at least two layers, where the heat sink is configured to provide a common heat dissipation path for the electrical components. | 04-21-2016 |
Patent application number | Description | Published |
20080281134 | PROPANE UTILIZATION IN DIRECT HYDROTREATING OF OILS AND/OR FATS - Methods for producing C10-C30 hydrocarbons from fatty compounds are provided in which at least a portion of the hydrogen required to accomplish the conversion is generated from by-products of the conversion process. Light hydrocarbons, especially propane, produced during the conversion of triglyceride compounds are used to generate hydrogen which is used in the conversion process thereby reducing the need for outside hydrogen sources. | 11-13-2008 |
20090019763 | HYDROTREATING AND CATALYTIC DEWAXING PROCESS FOR MAKING DIESEL FROM OILS AND/OR FATS - Methods for producing C10-C30 hydrocarbons from fatty materials, such as triglyceride compounds, are provided. Hydrocarbon compounds, particularly those boiling in the temperature range of between about 80° F. to about 1000° F., are produced by contacting a fatty material with at least one catalyst comprising cobalt and molybdenum on a zeolite support under hydrotreating conditions. Additional hydrotreating catalysts may also be used to further improve the properties of the hydrocarbon product. | 01-22-2009 |
20090266743 | THERMAL TREATMENT OF TRIGLYCERIDES - A triglyceride or a triglyceride/hydrocarbon combination can be heated to produce thermally treated feeds. The thermally treated feeds can then be contacted with a hydrotreating catalyst in a reaction zone. | 10-29-2009 |
20110047866 | REMOVAL OF IMPURITIES FROM OILS AND/OR FATS - Disclosed is a process for removing solids, metals, phosphorus compounds and other impurities from low quality triglyceride containing feedstock. The final treated triglyceride containing feedstock may be converted to fuel range hydrocarbons via hydrotreating process. | 03-03-2011 |
20110077436 | PRETREATMENT OF OILS AND/OR FATS - Disclosed are methods for pretreating triglyceride containing material prior to contacting with a hydrotreating catalyst to produce fuel range hydrocarbons without causing reactor fouling or catalyst plugging. | 03-31-2011 |
20110126449 | BLENDED FUEL COMPOSITION HAVING IMPROVED COLD FLOW PROPERTIES - There is provided a fuel composition comprising petroleum based component and a renewable based component, wherein at least 20% of the compounds in said petroleum based component having boiling point range equal or greater than the boiling point of said renewable based component. | 06-02-2011 |
20110237851 | THERMAL CRACKING OF IMPURITIES IN TRIGLYCERIDE FEEDSTOCK - A triglyceride or a triglyceride/hydrocarbon combination can be thermally cracked to remove its impurities in situ prior to be upgraded to fuel range hydrocarbon. This process allows the use of a variety of low cost feedstock and reduce reactor fouling tendency. The process also reduces the use of chemicals required for conventional clean up processes such as degumming. | 09-29-2011 |
20120000820 | HYDROPROCESSING PROCESS FOR THE IMPROVEMENT OF THE CATALYST LIFE - This invention relates to a hydroprocessing process for the improvement of catalyst life. Such inventive process is carried out with intermittent or discontinuous addition of a co-feed stream when hydroprocessing petroleum based feedstock or an oxygen containing feedstock. More specifically, it has been found that intermittent or discontinuous addition of the co-feed stream such as carbon monoxide, carbon dioxide, or their precursors to the hydrogen stream can reduce the long term deactivation, extend the life and increase run length of a cobalt/molybdenum hydrotreating catalyst. | 01-05-2012 |
20120017496 | HYDROPROCESSING PROCESS WITH IMPROVED CATALYST ACTIVITY - This invention relates to a hydroprocessing process with improved catalyst activity when hydroprocessing petroleum based feedstock or an oxygen containing feedstock. This invention also relates to a hydrotreating process with improved hydrodesulfurization (HDS) activity of a hydrotreating catalyst such as Co/Mo by co-feeding carbon monoxide or its precursors. Such inventive process confirms that adding a small amount of CO to H2 in a hydrotreater for a few days leads to an increase in product sulfur due to the inhibition of CO on the hydrotreating catalyst such as Co/Mo. However, it has been unexpectedly found that after the CO was removed from the hydrogen stream, product sulfur levels decreased to values below they were before CO addition which means the activity of the hydrotreating catalyst increased after the CO treatment. | 01-26-2012 |
20120022305 | HYDROCRACKING PROCESS FOR MAKING RENEWABLE DIESEL FROM OILS AND/OR FATS - Methods for producing C3-C30 hydrocarbons from fatty materials, such as triglyceride compounds, are provided. Hydrocarbon compounds, particularly those boiling in the temperature range of between about 80° F. to about 1000° F., are produced by contacting a fatty material, under hydrocracking conditions, with at least one catalyst comprising a Group VIII metal and a Group VIB metal on a acidic support. | 01-26-2012 |
20120157742 | PRODUCTION OF RENEWABLE FUELS - The present disclosure relates to a process for the conversion of oxygen-containing hydrocarbons into long-chain hydrocarbons suitable for use as a fuel. These hydrocarbons may be derived from biomass, and may optionally be mixed with petroleum-derived hydrocarbons prior to conversion. The process utilizes a catalyst comprising Ni and Mo to convert a mixture comprising oxygenated hydrocarbons into product hydrocarbons containing from ten to thirty carbons. Hydro-conversion can be performed at a significantly lower temperature than is required for when utilizing a hydrotreating catalyst comprising Co and Mo (CoMo), while still effectively removing sulfur compounds (via hydrodesulfurization) to a level of 10 ppm (by weight) or less. | 06-21-2012 |
20130172650 | UPGRADING LIGHT OLEFINS - Methods and systems relate to upgrading light olefins, such as ethylene, propylene and butylenes, diluted in a gas mixture, such as refinery fuel gas. The upgrading yields products in a gasoline, distillate, lube oil or wax range without requiring purification or compression of the gas mixture prior to feeding the gas mixture to a reactor. In operation, the mixture contacts a solid oligomerization catalyst, such as silica supported chromium, within the reactor. This contact occurs at a first temperature suitable to produce oligomers that are formed of the olefins and adsorb on the catalyst in liquid or solid phases. Next, heating the catalyst to a second temperature higher the first temperature desorbs the oligomers that are recovered and separated into the products. | 07-04-2013 |
20140213836 | THERMAL CRACKING OF IMPURITIES IN TRIGLYCERIDE MIXTURES - A heated petroleum-derived hydrocarbon is contacted with a triglyceride feed in a thermal cracking zone to decompose and remove impurities prior to hydrotreating the mixture to fuel range hydrocarbon. This process allows the use of a variety of low cost triglyceride feeds while reducing fouling of process equipment and catalyst. The process also reduces the use of chemicals required for conventional degumming of triglyceride feeds. | 07-31-2014 |
Patent application number | Description | Published |
20130263869 | ELECTRONIC CIGARETTE - An electronic cigarette is provided, which comprises a hollow atomizing stem ( | 10-10-2013 |
20150296887 | CERAMIC HEATING ELEMENTS FOR ELECTRONIC CIGARETTES - An electronic cigarette having ceramic heating element with a heating rod has: (a) a hollow atomizing stern, (b) a first conductive ring sleeved at bottom of atomizing stem and airproof with atomizing stem, (c) a second conductive ring placed in and insulated from first conductive ring, (d) a conduit positioned in atomizing stern, with conduit base tightly contacting first conductive ring, (e) a liquid blocker positioned on top of atomizing stern, (f) a cigarette mouthpiece located on top of the atomizing stem and holds liquid blocker, and (g) a heating rod. The inner wall of atomizing stern, outer wall of conduit, top of first conductive ring, and bottom of liquid blocker together form a liquid storage chamber for storing e-liquid. In one embodiment, the heating rod can be a solid ceramic heating rod. In another embodiment, the heating rod can be a hollow ceramic heating rod. | 10-22-2015 |
20150374039 | ELECTRONIC CIGARETTES HAVING SQUEEZABLE E-LIQUID TANK - The present invention relates to an electronic cigarette. The electronic cigarette includes: a first tubular body forming a vaporizer chamber, a removable mouth piece disposed on the first tubular body, a vaporizer assembly disposed inside of vaporizer chamber, having a positive terminal with an e-liquid conduit hole, a negative terminal, 2 sets of e-liquid media, and 2 heating wires wound around e-liquid media, a squeezable e-liquid tank adapted for storing e-liquid with an e-liquid conduit to provide e-liquid to e-liquid media in vaporizer chamber, a second tubular body forming a squeezable e-liquid tank container; and a connecting and sealing assembly for connecting first tubular body and second tubular body. When a user squeezes the squeezable e-liquid tank to soak e-liquid media with e-liquid, user starts e-cigarette smoking by switch on a battery power source to provide electrical power heating wires | 12-31-2015 |
20160000146 | HEATING ELEMENTS FOR ELECTRONIC CIGARETTES - The present invention relates to a heating element assembly for e-cigarette. The heating element assembly includes a cylindrical ceramic e-liquid conduit to store e-liquid, at least one heating wire wound on the inside of ceramic e-liquid conduit, a base, and a cylinder on top of base. The ceramic wall around the ceramic e-liquid conduit forms a vapor path with an air intake at bottom and an air exhaust on top. The cylinder sits on the base to form a main cavity | 01-07-2016 |
20160106153 | HEATING ASSEMBLIES FOR E-CIGARETTE VAPORIZERS - The present invention relates to vaporizer heating assemblies for electronic cigarettes. In certain embodiments, vaporizer heating assemblies include: heating assembly and electric conductor assembly. Heating assembly includes: heating assembly covers, round heating element mounting base, heating elements, and e-liquid media. Heating elements have heating wires formed in a large surface to ensure sufficient vaporization of e-liquid. Heating assembly covers define certain e-liquid conduit openings to allow the e-liquid to flow from outside of the heating assembly covers into the e-liquid media. The heating elements are in direct contact with the e-liquid media to generate large amount of vapor for its user. Electric conductor assembly includes: an electric connector base for a first terminal of heating elements, an electrode for a second terminal of heating elements, and an insulation cover to insulate the electric connector base and the electrode. Electric conductor assembly is positioned in a lower portion of heating assembly. | 04-21-2016 |