Xenidou
Maria Xenidou, Flemington, NJ US
Patent application number | Description | Published |
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20120149827 | Low Application Temperature Hot Melt Adhesive - The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles. | 06-14-2012 |
20140171586 | LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE - The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles. | 06-19-2014 |
Maria Xenidou, Dusseldorf DE
Patent application number | Description | Published |
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20130202787 | LOW TEMPERATURE HOT MELT ADHESIVES FOR DISPOSABLE ARTICLES WITH HIGH CREEP RESISTANCE - The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers. | 08-08-2013 |
Maria Xenidou, Duesseldorf DE
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20130197156 | BLOCK-COPOLYMER CONTAINING CROSSLINKABLE PHOTOINITATOR GROUPS - A block-copolymer containing at least two different blocks wherein block A contains (meth)acrylate monomers the copolymer having a glass transition temperature of less than 15° C., block B contains (meth)acrylate monomers the copolymer having a glass transition temperature of more than 25° C. being free of thio-containing substances in the polymer chain, characterized in that one block contains at least one photoinitiator chemically bound to the chain. | 08-01-2013 |
20130202902 | STRETCH FILM LAMINATION ADHESIVE - The invention provides stretch film laminant adhesives, methods of using the adhesives to bond substrates together, and to articles of manufacture comprising the adhesives. It has been discovered that a stretch film lamination adhesive, which comprises a metallocene catalyzed polyolefin copolymer with a density greater or equal to 0.870 g/cm | 08-08-2013 |
20140238603 | HOT MELT ADHESIVE COMPRISING CYANOACRYLATE CURING COMPOUNDS - A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives. | 08-28-2014 |
Maria Xenidou, Shanghai CN
Patent application number | Description | Published |
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20150159060 | LOW TEMPERATURE HOT MELT ADHESIVES FOR DISPOSABLE ARTICLES WITH HIGH CREEP RESISTANCE - The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers. | 06-11-2015 |