Wyland, CA
Chris Wyland, Livermore, CA US
Patent application number | Description | Published |
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20080211112 | Carbon Nanotube Bond Pad Structure and Method Therefor - A bond pad structure ( | 09-04-2008 |
20080266028 | Enhanced Substrate Using Metamaterials - In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate ( | 10-30-2008 |
20090009973 | Nanotube-Based Fluid Interface Material and Approach - A thermal interface material ( | 01-08-2009 |
20090102067 | ELECTRICALLY ENHANCED WIREBOND PACKAGE - Consistent with an example embodiment, there is an integrated circuit (IC) device in a packaging having electrically insulated connections. The IC device comprises a semiconductor device ( | 04-23-2009 |
20090127712 | NANOTUBE-BASED DIRECTIONALLY-CONDUCTIVE ADHESIVE - A tape adhesive type material is directionally conductive. According to an example embodiment of the present invention, carbon nanotubes ( | 05-21-2009 |
20090213551 | INTEGRATED CIRCUIT NANOTUBE-BASED STRUCTURE - Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement ( | 08-27-2009 |
20090301757 | METHOD AND SYSTEM FOR COMPOSITE BOND WIRES - Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture. The mixture is used to create the composite bond wire. A composite wire having an inner core and an outer layer having a higher conductivity than the inner core is also provided. The outer layer is designed to be thicker than the skin depth at the operating frequency for carrying AC signals. | 12-10-2009 |
20110156255 | CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS - A variety of characteristics of an integrated circuit chip arrangement with a chip and package-type substrate are facilitated. In various example embodiments, a carbon nanotube-filled material ( | 06-30-2011 |
Christopher Wyland, San Jose, CA US
Patent application number | Description | Published |
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20100131906 | Design Method for Transmission Lines Using Meta-Materials - High frequency circuits for wireless, digital and microwave applications place requirements upon the impedance of their signal lines, interconnects and packaging. In designing and implementing the substrates for these signal lines it is beneficial to employ meta-materials to provide the desired impedance. Such meta-materials providing a means to provide modified permittivity and permeability for the substrate, these being different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate is configured as a meta-material. It is desirable therefore to have a means to model these meta-material aspects of the signal lines rapidly and accurately allowing the circuits, interconnects and packages to be designed and implemented without expensive and exhaustive iterative experimental characterization. Within the cited invention design parameters for the meta-material structure are determined in dependence upon input parameters characterising the conductive medium, dielectric medium enveloping the conductive material, and the pre-determined shapes of the conductive medium. | 05-27-2010 |
20120038054 | IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATERIALS - A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation. | 02-16-2012 |
Christopher Wyland, Livermore, CA US
Patent application number | Description | Published |
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20090212430 | CARBON NANOTUBE-BASED CONDUCTIVE CONNECTIONS FOR INTEGRATED CIRCUIT DEVICES - Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material ( | 08-27-2009 |
Christopher P. Wyland, Livermore, CA US
Patent application number | Description | Published |
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20110095851 | HIGH IMPEDANCE ELECTRICAL CONNECTION VIA - Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via. | 04-28-2011 |
20120139083 | POWER DISTRIBUTION NETWORK - In one embodiment, an integrated circuit (IC) is presented. The IC includes first and second sets of power distribution lines formed in the IC. The IC includes first and second capacitors formed in one or more layers of the IC. A first plurality of vias couple a first input of the first and second capacitors to the first set of power distribution lines, and a second plurality of vias couple a second input of the first and second capacitors to the second set of power distribution lines. The first capacitor and the first plurality of vias and the second plurality of vias coupled thereto having an equivalent series resistance greater than an equivalent series resistance of the second capacitor and the first plurality of vias and the second plurality of vias coupled thereto. | 06-07-2012 |