Wojtek Sudol, Andover US
Wojtek Sudol, Andover, MA US
Patent application number | Description | Published |
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20090105596 | TRANSDUCER ARRAYS FOR MEDICAL ULTRASOUND AND METHOD OF MAKING THE SAME - An ultrasound transducer ( | 04-23-2009 |
20090294991 | FLIP-CHIP INTERCONNECTION WITH FORMED COUPLINGS - A flip-chip electrical coupling between first and second electrical components ( | 12-03-2009 |
20090309217 | FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING - A flip-chip electrical coupling ( | 12-17-2009 |
20100156243 | ULTRASOUND TRANSDUCER FEATURING A PITCH INDEPENDENT INTERPOSER AND METHOD OF MAKING THE SAME - An ultrasound transducer | 06-24-2010 |
20100241002 | 2D Ultrasound Transducer for Radial Application and Method - The present invention relates to an apparatus and a method for obtaining a 3D image in radial applications, typically endorectal imaging. | 09-23-2010 |
20110125021 | ACOUSTIC IMAGING APPARATUS WITH HANDS-FREE CONTROL - An acoustic imaging apparatus ( | 05-26-2011 |
20140139072 | ULTRASOUND TRANSDUCER ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - The present invention relates to an ultrasound transducer assembly ( | 05-22-2014 |
20150338511 | ACOUSTIC PROBE WITH COMPONENTS OF ACOUSTIC ELEMENTS HAVING DIFFERENT PITCHES THAN EACH OTHER - An acoustic probe includes a plurality of acoustic array components separated and spaced apart from each other. Each of the acoustic array components includes: an array of acoustic element circuits disposed contiguous to each other at a first pitch; a plurality of pads each corresponding to one of the acoustic element circuits and formed within a circuitry area of the corresponding acoustic element circuit, the pads being disposed at a second pitch; a plurality of interconnection bumps each corresponding to one of the pads and being disposed in electrical connection with the corresponding pad, wherein the interconnection bumps are disposed at a third pitch; and a plurality of acoustic transducer elements on the interconnection bumps. The acoustic transducer elements are disposed at a fourth pitch. At least two of the first, second, third, and fourth pitches are different than each other. | 11-26-2015 |