Wen-Shiang
Wen-Shiang Chen, Taipei City TW
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20090248151 | ARTIFICIAL SPHINCTER SYSTEM - The present invention relates to a kind of artificial sphincter system, which takes shape memory alloy (SMA) as its motion device, and then cooperates with controlled circuit to imitate the motion of human sphincter, especially in imitating iris. The present invention can be used in a human body, a robot or a machine. | 10-01-2009 |
Wen-Shiang Chen, Taipei TW
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20090264755 | High-Intensity Ultrasonic Vessel Ablator Using Blood Flow Signal for Precise Positioning - The present invention relates to a precise blood vessel positioning and high-intensity focused ultrasound ablator by use of one ultrasound transducer. | 10-22-2009 |
20100005795 | Precision method and apparatus for controlling the shape memory alloy - The invention discloses a method and apparatus to control the shaping change of Shape-Memory-Alloy (SMA). The piece-wised current drain control device is designed to independently deliver current to stimulate sectional SMA but not the entire one. The invention is also successfully implemented on an automatic light sensitive aperture control device to simulate the light response of a pupil. The control technique can extend the application potential of SMA toward precise actuation, aeronautical applications, surgical tools, or biomedical applications such as artificial organ or muscles. | 01-14-2010 |
20100092395 | ACOUSTICALLY DELIVERING METHODS AND COMPOSITONS FOR REMOTE TREATMENT OF A TUMOR - Disclosed herein is a method of acoustically delivering a therapeutic composition to a subject pre-diagnosed with a tumor. The method comprises the steps of: parenterally administering the composition from a site remote from a tumor location; and exposing the parenterally administering site to ultrasound waves to target the delivery of the composition. The therapeutic composition comprises an effective amount of a polypeptide or a plasmid nucleic acid encoding the polypeptide, the polypeptide or the nucleic acid is suspended in a dispersed medium; and an effective amount of an microbubble contrast agent; wherein the polypeptide is an angiogenesis inhibitor, and the therapeutic composition is capable of reducing the size of the tumor without the risk of inducing viral vector-induced immunogenicity in the subject. | 04-15-2010 |
20100283355 | Method for changing ultrasound wave frequency by using the acoustic matching layer - The method of changing ultrasound wave frequency by using the acoustic matching layer presents a replaceable acoustic matching layer to offer an effective means of filtering the original broadband frequency of an ultrasonic transducer into certain composite discontinuous frequencies. The filtering effect could be improved by connecting the electrodes of the acoustic matching layer when it is made of a poled piezoelectric material. This method may provide novel applications for commercial ultrasonic transducers. | 11-11-2010 |
20130116560 | ULTRASOUND TEMPERATURE MAPPING SYSTEM AND METHOD - The present application relates to an ultrasound temperature mapping system and method. The ultrasound temperature mapping system for measuring a temperature of an object comprises an ultrasound transducer and a processing module. The ultrasound transducer is configured to acquire a first image and a second image with respect to the object. The processing module implements a zero-crossing algorithm to process the first image to yield a plurality of first zero-crossing points and implements a cross-correlation algorithm to process the first image and the second images based on the plurality of first zero-crossing points so as to obtain a plurality of displacements. The processing module further calculates the temperature based on the plurality of displacements. | 05-09-2013 |
Wen-Shiang Chen, New Taipei City TW
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20130175008 | THIN HEAT PIPE - A thin heat pipe includes a thin hollow tube and a capillary structure. The capillary structure is formed in at least half of an inner wall of the thin hollow tube by a chemical etching process. | 07-11-2013 |
20130206369 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a chamber body, a heat sink, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat sink is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe is installed within the heat sink, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure. | 08-15-2013 |
Wen-Shiang Liao, Toufen Township TW
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20140264344 | Wafers, Panels, Semiconductor Devices, and Glass Treatment Methods - Glass treatment methods, wafer, panels, and semiconductor devices are disclosed. In some embodiments, a method of treating a glass substrate includes forming a first film on the glass substrate, the first film having a first porosity. The method includes forming a second film on the first film, the second film comprising an electrically insulating material and having a second porosity. The first porosity is lower than the second porosity. | 09-18-2014 |
20140347025 | Integrated Voltage Regulator Substrate System and Methods Having a Coupled-Magnetic-Core Inductor - An integrated voltage regulator substrate or interposer system includes a control system and coupled-magnetic-core inductors. The control system is integrated within a package. The coupled-magnetic-core inductors are integrated in the package. The control system is configured to utilize the coupled-magnetic-core inductors to generate a selected regulated voltage for drastically electrical power consumption saving, especially advantageous for portable, mobile or cloud computing device packages relatively smaller form factor, shorter interconnect path, faster operation speed and broader frequency bandwidth. | 11-27-2014 |
20150016068 | 3DIC Package Integration for High-Frequency RF System - A three-Dimensional Integrated Circuit (3DIC) Chip on Wafer on Substrate (CoWoS) packaging structure or system includes a silicon oxide interposer with no metal ingredients, and with electrically conductive TVs and RDLs. The silicon oxide interposer has a first surface and a second surface opposite to the first surface. The electrically conductive TVs penetrate through the silicon oxide interposer. The electrically interconnected RDLs are disposed over the first surface of the silicon oxide interposer, and are electrically coupled or connected to a number of the conductive TVs. | 01-15-2015 |
Wen-Shiang Liao, Miao- Li Hsien TW
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20100012974 | PIN PHOTODIODE STRUCTURE AND METHOD FOR MAKING THE SAME - A PIN photodiode structure includes a substrate, a P-doped region disposed in the substrate, an N-doped region disposed in the substrate, and a first semiconductor material disposed in the substrate and between the P-doped region and the N-doped region. | 01-21-2010 |
Wen-Shiang Liao, Miaoli County TW
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20090294903 | ANTI-FUSSE STRUCTURE AND METHOD OF FABRICATING THE SAME - An anti-fuse structure and a method of fabricating the same are described. The anti-fuse structure is disposed over a substrate having at least one device and a copper layer therein. The anti-fuse structure includes a bottom conductive layer, an insulating layer and a top conductive layer. The bottom conductive layer is disposed over and electrically connected with the copper layer. The insulating layer is conformally disposed over the bottom conductive layer covering a corner or a downward turning portion of the bottom conductive layer to form a turning portion of the insulating layer. The top conductive layer is conformally disposed over the insulting layer covering the turning portion of the insulating layer. | 12-03-2009 |
20140159047 | MANUFACTURING PROCESS OF OXIDE INSULATING LAYER AND FLEXIBLE STRUCTURE OF LTPS-TFT (LOW-TEMPERATURE POLYCRYSTALLINE SILICON THIN FILM TRANSISTOR) DISPLAY - The present invention provides a manufacturing process of oxide insulating layer and flexible structure of LTPS-TFT display. The manufacturing process firstly provides a substrate, which is a soft material sheet; and then an a-Si layer is formed on the substrate, and oxygen ion implantation process of a certain depth is conducted onto the a-Si layer; finally, ELA process is conducted to transform a-Si layer into a Poly-Si layer and an oxide insulating layer; of which the oxide insulating layer is a silica insulating layer and located within the Poly-Si layer for subsequently producing LTPS-TFT; the structure comprises of a substrate, Poly-Si layer and oxide insulating layer within the Poly-Si layer. | 06-12-2014 |
Wen-Shiang Liu, Taipei City TW
Wen-Shiang Tang, Kaohsiung City TW
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20130162041 | LOAD CONTROL SYSTEM AND LOAD CONTROL METHOD - An exemplary embodiment provides a load management system, including a detecting module and a determining module. The detecting module creates at least one activated one of a plurality of loads located in a predetermined space as an activation set, and creates a group set including a plurality of sub-groups according to locations and activation times of the activated ones of the plurality of loads. The detecting module creates the activated ones of the plurality of loads which have been activated within a predetermined time period as one of the sub-groups. The determining module determines whether each of the activated ones of the plurality of loads is an essential load or a non-essential load according to the group set and the activation set to produce a determining result. | 06-27-2013 |
Wen-Shiang Tsai, Tucheng City TW
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20120134868 | ROTARY SLIDING-VANE COMPRESSOR - A rotary sliding-vane compressor includes an air cylinder, a shaft eccentrically mounted in the air cylinder and rotatable by a motor, sliding vanes coupled to and movable back and forth along radially extending sliding grooves of the shaft, and an oil-gas separating device mounted in the air output port of the air cylinder. The shaft has an axial hole located on one end thereof and coupled to the output shaft of the motor, and two axle bushes respectively mounted on the two opposite ends. Each sliding vane comprises a metal substrate having evenly distributed through holes, and a covering material molded on the surface of the metal substrate and filled up the through holes and having a plurality of discharge grooves. | 05-31-2012 |