Patent application number | Description | Published |
20140190260 | MEMS APPARATUS - Disclosed herein is a MEMS apparatus comprising a substrate with an etched area, a proof mass disposed at the center of the etched area, and beams supporting the proof mass. The beams are disposed between peripheries of the substrate and the proof mass. The substrate comprises first and second electrodes that are parallel to an axis and extend respectively from opposite regions on the substrate. The proof mass comprises third and fourth electrodes that are parallel to the axis and extend respectively from opposite edges of the proof mass. The first and third electrodes are opposite to and interlaid with each other. The second and fourth electrodes are opposite to and interlaid with each other. With the proof mass constructed as an oxide layer optionally enclosing a connecting layer or as a silicon substrate optionally with a covering layer, the MEMS apparatus is not susceptible to the variation of temperature. | 07-10-2014 |
20150210532 | MEMS GAS SENSING DEVICE - A microelectromechanical system (MEMS) gas sensing device includes a substrate, an oxide layer, a heating unit, a thermal-conductive metal layer, a passivation layer, and a sensor layer. The substrate includes a first cavity. The oxide layer has a first surface and a second surface opposite to the first surface, is on the substrate, and covers on the first cavity. The first surface contacts the substrate. The heating unit is in the oxide layer and adjacent to the first surface of the oxide layer. The thermal-conductive metal layer is between the heating unit and the second surface of the oxide layer. The passivation layer is on the second surface of the oxide layer and includes at least one via. The sensor layer is on the passivation layer and electrically connected to the thermal-conductive metal layer through the at least one via. | 07-30-2015 |
20150212029 | TUNABLE CHEMICAL SENSING DEVICE - A tunable chemical sensing device includes a sensing unit, a plurality of first pads, a value reading circuit and a plurality of second pads. The sensing unit has a first impedance component and a plurality of second impedance components. The first impedance component and the second impedance components respectively have a first terminal and a second terminal. The second impedance components respectively have a different impedance value. The first pads are respectively coupled to the corresponding first and second terminals. The value reading circuit has a first input terminal, a second input terminal and an output terminal. The second pads are respectively coupled to the corresponding first input terminal, second input terminal and output terminal. A coupling relationship between the first pads and the second pads is adjusted to tune an impedance value of the sensing unit. | 07-30-2015 |
Patent application number | Description | Published |
20090104769 | Semiconductor chip with coil element over passivation layer - A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer. | 04-23-2009 |
20110029708 | Serial Advanced Technology Attachment Interface Storage Device - A serial advanced technology attachment (SATA) interface storage device. The SATA interface storage device can be used in cooperation with an electrical apparatus and comprises a substrate, a chip set, a SATA interface and a shell. The substrate has a first surface, a second surface corresponding to the first surface and a plurality of connectors between the first surface and the second surface. The chip set is disposed on the first surface. The SATA interface is disposed on the second surface and is electrically connected to the chip set via a part of the connectors so that the electrical apparatus may be electrically connected to the chip set via the SATA interface to access the chip set. The shell has a width and a thickness and defines a receiving space for receiving the substrate, the chip set and the SATA interface, where the width and the thickness conform to a micro-memory card standard. | 02-03-2011 |
20110233776 | SEMICONDUCTOR CHIP WITH COIL ELEMENT OVER PASSIVATION LAYER - A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer. | 09-29-2011 |
Patent application number | Description | Published |
20140238180 | ADJUSTABLE BUTTON APPARATUS OF LOCK - An adjustable button apparatus of a lock includes an adjusting sleeve, a transmission rod, a driving plate and a positioning pin, the adjusting sleeve is movable between a positioning position and an adjusting position. When the adjusting sleeve is located at the positioning position, the adjusting sleeve presses the positioning pin and makes the positioning pin engaged with the transmission rod and the driving plate, when the adjusting sleeve is located at the adjusting position, the positioning pin separates apart from the driving plate to make the driving plate transversely movable in the transmission rod. Via the positioning pin inserted at various positions of the driving plate for adjusting a joint length formed by jointing the transmission rod and the driving plate, the lock is applicable for installation in doors of various door thicknesses. | 08-28-2014 |
20140290427 | HANDLE ASSEMBLY OF LOCK - A handle assembly of a lock includes a handle, a sleeve, a stopper and an engaging member, wherein the handle comprises an accommodating slot, a lodge hole and a penetrating hole. The sleeve is disposed at the accommodating slot along the direction of a major axis and comprises a through hole. The stopper is disposed at the sleeve and protrudes to the sleeve via the through hole of the sleeve. Owing to the through hole corresponded to the lodge hole, the stopper is lodged in the lodge hole of the handle. The engaging member is disposed in the accommodating slot and adjustably movable along the direction of a transverse axis so that the handle and the sleeve are steadily engaged from each other. | 10-02-2014 |
20140319858 | LOCK STRUCTURE - A lock structure includes a mounting plate, a positioning member, an escutcheon and a constraining member, wherein the mounting plate comprises a ring wall, guiding slot and a limiting slot, and the escutcheon comprises a limiting protrusion. The positioning member is disposed in the limiting slot and clamped between the escutcheon and the constraining member. The limiting protrusion penetrates the guiding slot of the escutcheon and is constrained inside the limiting slot. The limiting protrusion of the escutcheon is blockable by the constraining member to prevent the rotating escutcheon from separation from the mounting plate. | 10-30-2014 |
Patent application number | Description | Published |
20120314360 | ALL-IN-ONE COMPUTER - An all-in-one computer includes a main body and a display. The main body includes a first locking structure, a first connector, and a second connector. The display includes a second locking structure detachably engaging with the first locking structure, a third connector connecting to the first connector, and a fourth connector connecting to the second connector. The second locking structure engages with the first locking structure to connect the display to the main body. | 12-13-2012 |
20120329313 | PORTABLE ELECTRONIC DEVICE WITH INTERFACE - An interface assembly includes a connector housing and a light emitting element. The connector housing defines a opening. The light emitting element is retained to the connector housing and illuminates the opening. | 12-27-2012 |
20130078838 | FIXING FRAME AND FIXING APPARATUS FOR STORAGE DEVICE - An apparatus for fixing a storage device includes a metal bracket, and a fixing frame slidably received in the bracket. The bracket includes two side plates, and one of the side plates forms a resilient tab. The fixing frame includes two opposite fixing arms each defining a latching hole, two resilient members, and two metal fasteners. Each resilient member includes a pad clinging to an inner surface of a corresponding one of the fixing arms, and a projection engaging in the latching hole of the corresponding fixing arm. Each fastener includes a head, and a pin. The heads are received in the corresponding latching holes and abut against outer sides of the corresponding projections. The pins extend through the corresponding through holes for engaging with the storage device. A protrusion extends outwards from one of the heads to contact the resilient tab and connect the storage device to ground. | 03-28-2013 |
20130114190 | FLAT PANEL DISPLAY - A flat panel display includes a housing, a support base, a support plate, a connecting plate, and a fixing element. The housing defines a sliding groove and a plurality of holes arranged in a line parallel to the extending direction of the sliding groove. The support plate is fixed at the support base. The connecting plate is rotatably connected with the support base. A protruding part is formed on the connecting plate and is sliably received in the sliding groove. The connecting plate further defines a through hole. The fixing element extends through the through hole and is inserted into one of the holes to fix the position of the connecting plate relative to the housing. | 05-09-2013 |
20130248161 | HEAT DISSIPATION MODULE AND METHOD OF USING THE HEAT DISSIPATION MODULE - A heat dissipation module includes a heat sink. A plurality of grooves are defined in a bottom surface of the heat sink, a heat pipe is accommodated in each groove of the heat sink, and a heat conducting pad made of phase change material is adhered to the bottom surface of the heat sink to cover the grooves and the heat pipes. The heat conducting pad is a solid material at an ambient room temperature. When heated to a temperature higher than a transition temperature of the heat conducting pad, the heat conducting pad softens to fill spaces between the heat conducting pad, the heat sink, and the heat pipes. | 09-26-2013 |
20140001940 | ENCLOSURE OF ELECTRONIC DEVICE | 01-02-2014 |
Patent application number | Description | Published |
20100155756 | LIGHT EMITTING DIODE PACKAGE AND PROJECTION APPARATUS - A light emitting diode (LED) package including a carrier, at least one LED chip, and a light guide element is provided. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side. The side connects the light transmissive body and the light incident surface. The reflective film is disposed on the side. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed. | 06-24-2010 |
20120099085 | LIGHT EMITTING DIODE PACKAGE AND PROJECTION APPARATUS - A light emitting diode package including a carrier, at least one LED chip, and a light guide element. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and located above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side surface. The side surface connects the light transmissive body and the light incident surface. The reflective film is disposed on the side surface. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed. | 04-26-2012 |
Patent application number | Description | Published |
20120126472 | SHEET FOR MOUNTING A WORKPIECE - The present invention relates to a sheet for mounting a workpiece, which includes a sheet body. The sheet body includes a top surface, a plurality of foamed pores, and a plurality of surface holes or at least one surface groove. The top surface is used for mounting a workpiece. The foamed pores are disposed in the interior of the sheet body. The surface holes or the surface groove have opening on the top surface but does not communicate with the foamed pores. The surface holes or the surface groove is formed by machining, and arranged in at least one pattern. Whereby, the time for taking off the workpiece from the sheet is reduced. | 05-24-2012 |
20140090774 | MOUNTING SHEET, POLISHING APPARATUS, AND METHOD FOR MAKING THE SAME - The present invention relates to a mounting sheet comprising a mounting layer. The mounting layer comprises a mounting surface for mounting the substrate. The mounting surface comprises a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area. The sheet according to the invention has the different mounting areas, so that the substrate is easily unloaded when polishing is completed. Furthermore, the broken of the substrate due to removal and the duration and the difficulty of removal are reduced. | 04-03-2014 |
20150047266 | METHODS FOR MANUFACTURING POLISHING PAD AND POLISHING APPARATUS - The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of (a) providing a releasing carrier; (b) providing a foaming resin composition; (c) coating the foaming resin composition of the step (b) on the carrier of the step (a); and (d) curing the foaming resin composition of the step (c). The invention also provides a process for manufacturing a polishing apparatus. | 02-19-2015 |
20150050866 | POLISHING PAD, POLISHING APPARATUS AND METHOD FOR MANUFACTURING POLISHING PAD - The present invention relates to a polishing pad comprising a foaming resin frame and a plurality of auxiliary fiber filaments, and each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame. The invention also relates to a polishing apparatus and a method for manufacturing the polishing pad. | 02-19-2015 |
20150093979 | COMPOSITE POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised. | 04-02-2015 |
20150099439 | POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%. | 04-09-2015 |
Patent application number | Description | Published |
20130265768 | ILLUMINATING MODULE FOR A MICRO PROJECTING DEVICE - An illuminating module includes a casing, a sleeve forming a positioning device to contact with the casing; and a light source one end of which is extended into the sleeve, wherein the positioning device of the sleeve is non-fixedly contacted with the casing so as to adjust the sleeve to a desired location and direction in the casing. With the positioning device, the assembly process of the illuminating module becomes more easily to be accomplished and ensures the optical quality. | 10-10-2013 |
20140092628 | ILLUMINATION DEVICE - An illumination device including a light guiding element, a light emitting element, and a reflective element is provided. The light guiding element has a light incident surface, a light emitting surface, a first surface and a second surface. The light incident surface surrounds the light guiding element and is connected between the light emitting surface and the first surface. The first surface is connected between the light incident surface and the second surface so that the second surface is substantially opposite to the light incident surface. The second surface constructs a depression structure having a diameter gradually changed from the first surface towards the light emitting surface. The light emitting element surrounds the light guiding element to emit a light towards the light incident surface. The reflective element is disposed at least on the first surface. | 04-03-2014 |
20140135054 | COMMUNICATION DEVICE AND POWER CONTROL METHOD THEREOF - A communication device and a power control method thereof are provided. The power control method, performed by a communication device, includes: determining a power range of a transmit power of an uplink signal; determining a gain switch range based on the power range; when the transmit power of the uplink signal is within the gain switch range, determining a first gain mode for amplifying the uplink signal; and when the transmit power of the uplink signal is out of the gain switch range, determining a second gain mode for amplifying the uplink signal. | 05-15-2014 |
20140160743 | LIGHT TUBE - A light tube includes a tube body, at least one light emitting diode, and a transparent cover. The light emitting diode is assembled with the tube body. The transparent cover is disposed on the tube body to cover the light emitting diode and has a roof portion and two side arm portions. A first microstructure region and a second microstructure region are formed on a surface of the roof portion corresponding to the light emitting diode. The second microstructure region extends from two ends of the first microstructure region. A third microstructure region is formed on a surface of each side arm portion corresponding to the light emitting diode. A microstructure density of the second microstructure region is less than or equal to a microstructure density of the first microstructure region, and is greater than or equal to a microstructure density of the third microstructure region. | 06-12-2014 |
20140192555 | PLANAR LIGHT APPARATUS - A planar light apparatus is disclosed and includes a reflection part, a secondary optic device, and a light-emitting device. The secondary optic device has a light incident surface, a light emitting surface, and a side surface, which is an elliptic surface, between the light incident surface and the light emitting surface. A reflecting surface of the reflection part and the light emitting surface face a void space formed between the secondary optic device and the reflection part. Light beams emitted by the light-emitting device into the secondary optic device through the light incident surface can be reflected by the side surface to emit out of the secondary optic device through the light emitting surface into the void space to be reflected by the reflecting surface. Thereby, the planar light apparatus without a conventional light-guiding plate still can offer a planar light source with certain uniformity and can be structured thinner. | 07-10-2014 |
20140198496 | ILLUMINATION APPARATUS - An illumination apparatus includes a transparent case, an opaque member, a ring-shaped light emitting device, and a ring-shaped transparent cover. The transparent case has a central region. The opaque member is disposed on the central region. The ring-shaped light emitting device is disposed in the transparent case corresponding to the central region. The ring-shaped transparent cover is disposed on the ring-shaped light emitting device and has a first arc-shaped ring portion relatively close to the opaque member and a second arc-shaped ring portion relatively away from the opaque member. A refraction microstructure region is formed on an inner surface of the first arc-shaped ring portion for refracting light emitted by the ring-shaped light emitting device. | 07-17-2014 |
20140306243 | LIGHT EMITTING DEVICE - A light emitting device includes a frame, a plurality of first light emitting units and a plurality of second light emitting units. The frame includes a base, a plurality of first pillars and a plurality of second pillars, wherein the first pillars and the second pillars are extended from a periphery of the base and arranged interlacedly, the first pillars are bent inwardly with respect to the base, and the second pillars are bent outwardly with respect to the base. Each of the first light emitting units is disposed on one of the first pillars. Each of the second light emitting units is disposed on one of the second pillars. | 10-16-2014 |
20140307434 | LIGHT SOURCE MODULE - A light source module includes a base, a plurality of light emitting components and a reflecting member. The light emitting components is disposed on the base, and the adjacent light emitting components form a gap therebetween. The reflecting member is disposed on the base and surrounded by the light emitting components. The reflecting member has a reflecting surface facing the light emitting components so as to avoid the light from being blocked by the opposite light emitting component and to redirect the light project via the gap formed between the adjacent light emitting components. | 10-16-2014 |
20140321128 | OPTICAL LENS AND LIGHT SOURCE DEVICE - An optical lens including a first light exit surface, a total internal reflection (TIR) surface, a second light exit surface and a third light exit surface connected in an order, and correspondingly has a first intersection, a second intersection and a third intersection therebetween. A first line between the first intersection and a reference point on an optical axis of the optical lens intersects with the optical axis to form a first angle between 30 degrees to 60 degrees, and a first direction of the reference point pointing toward a point on the TIR surface intersects with a normal of the first light exit surface at the point to form a reflecting angle larger than a critical angle of TIR. A second line between the second intersection and the reference point intersects with the first line to form a second angle between 10 degrees to 30 degrees. | 10-30-2014 |
20150036352 | LIGHT EMITTING DIODE LAMP AND DIFFUSING CAP THEREOF - A light emitting diode (LED) lamp is provided. The LED lamp includes a circuit board, at least one LED, a diffusing cap and a heat sink structure. The LED is disposed on the circuit board for emitting a light. The diffusing cap covers the LED and the circuit board. The diffusing cap includes an outer emitting portion and a lateral emitting portion. The outer emitting portion has a concave. The lateral emitting portion is connected to the outer emitting portion. The concave is used for reflecting part of the light toward a lateral surface of the lateral emitting portion. The heat sink structure is disposed below the circuit board for dissipating a heat generated from the LED and the circuit board. | 02-05-2015 |
20150153536 | MICRO PROJECTOR AND FIXING STRUCTURE THEREOF - The fixing structure of the micro projector includes a base, a plurality of abutting members and a plurality of fixing components. The base has an assembling plane. The abutting members are respectively disposed on the assembling plane. Each abutting member has an abutting wall, and each optical lens is abutted against each corresponding abutting wall. | 06-04-2015 |