Patent application number | Description | Published |
20110103745 | REPEATABLE OPTICAL WAVEGUIDE INTERCONNECTION INCLUDING AN INDEX MATCHING ELASTOMERIC SOLID LAYER AND RELATED METHODS - A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The repeatable optical waveguide interconnection may further include a first index matching elastomeric solid layer having a proximal face chemically bound to the first end face and a low-tack distal face opposite the proximal face to be repeatably optically coupled to the second end face. Further, the first index matching elastomeric solid layer may have an index of refraction matching at least the index of refraction of the core. | 05-05-2011 |
20110103746 | REPEATABLE OPTICAL WAVEGUIDE INTERCONNECTION INCLUDING AN INDEX MATCHING ELASTOMERIC SOLID LAYER PROVIDING CORE AND CLADDING INDEX OF REFRACTION MATCHING AND RELATED METHODS - A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The interconnection may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face, and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction profile matching an index of refraction of the core and the cladding. | 05-05-2011 |
20110104388 | METHOD FOR MAKING AN OPTICAL DEVICE INCLUDING A CURABLE INDEX MATCHING ELASTOMERIC SOLID LAYER - A method for making an optical device may include applying at least one precursor for a curable index matching elastomeric solid layer onto an end face of an optical waveguide device. The optical waveguide device may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The method may further include curing the at least one precursor to form the index matching elastomeric solid layer on the end face to have an index of refraction matching the index of refraction of at least the core. | 05-05-2011 |
20120189253 | ELECTRO-OPTICAL DEVICE HAVING AN ELASTOMERIC BODY AND RELATED METHODS - An electro-optical device may include a substrate having opposing first and second surfaces and an opening extending therebetween. The optical device may also include an optical waveguide extending laterally along the first surface and having an end aligned with the opening, and an electro-optical component carried by the second surface and aligned with the opening. The electro-optical device may further include an elastomeric body within the opening and having a first end face adjacent the optical waveguide and having a second end face adjacent the electro-optical component. The elastomeric body and the optical waveguide may have respective gradient refraction indices within ±5% of each other. | 07-26-2012 |
20120251043 | OPTICAL DEVICE HAVING AN ELASTOMERIC WAVEGUIDE SWITCH BODY AND RELATED METHODS - An optical device may include a substrate and an optical waveguide carried by the substrate and having a notch therein defining a feed optical waveguide and a longitudinal optical waveguide section on opposite longitudinal sides of the notch. The optical device may also include a transverse optical waveguide section carried by the substrate and transversely aligned with the feed optical waveguide adjacent the notch. The optical device may further include an elastomeric waveguide switch body configured to be moved between a first position within the notch and operative to switch light from the feed optical waveguide to the longitudinal optical waveguide section, and a second position removed from the notch and operative to switch light from the optical waveguide to the transverse optical waveguide section. | 10-04-2012 |
20130075137 | METHOD TO MAKE A MULTILAYER CIRCUIT BOARD WITH INTERMETALLIC COMPOUND AND RELATED CIRCUIT BOARDS - A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together. | 03-28-2013 |
20130087365 | METHOD FOR MAKING ELECTRICAL STRUCTURE WITH AIR DIELECTRIC AND RELATED ELECTRICAL STRUCTURES - A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric. | 04-11-2013 |
20130120095 | METHOD FOR MAKING AN ELECTRICAL INDUCTOR AND RELATED INDUCTOR DEVICES - A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate. | 05-16-2013 |
20130335183 | METHOD FOR MAKING AN ELECTRICAL INDUCTOR AND RELATED INDUCTOR DEVICES - A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate. | 12-19-2013 |
20140138849 | METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYMER SOLDER MASK LAMINATED TO AN INTERCONNECT LAYER STACK AND RELATED DEVICES - A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder. | 05-22-2014 |
20140217618 | METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND RELATED DEVICES - A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a coverlay layer on the substrate and the electrically conductive pattern, forming a partially cured, tacky adhesive layer on the coverlay layer, and forming openings in the coverlay layer and the partially cured, tacky adhesive layer aligned with the electrically conductive pattern. The method includes positioning an IC on the partially cured, tacky adhesive layer and thereafter curing the partially cured tacky adhesive layer to thereby simultaneously mechanically secure and electrically interconnect the IC to the substrate, the IC having bond pads on a surface thereof. | 08-07-2014 |
20140376197 | METHOD OF TRANSFERRING AND ELECTRICALLY JOINING A HIGH DENSITY MULTILEVEL THIN FILM TO A CIRCUITIZED AND FLEXIBLE ORGANIC SUBSTRATE AND ASSOCIATED DEVICES - A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer. | 12-25-2014 |
20150053468 | METHOD TO MAKE A MULTILAYER CIRCUIT BOARD WITH INTERMETALLIC COMPOUND AND RELATED CIRCUIT BOARDS - A method for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions. | 02-26-2015 |
20150069621 | EMBEDDED ELECTRONIC PACKAGING AND ASSOCIATED METHODS - An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer. | 03-12-2015 |
20160006100 | METHOD FOR MAKING ELECTRICAL STRUCTURE WITH AIR DIELECTRIC AND RELATED ELECTRICAL STRUCTURES - A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric. | 01-07-2016 |
Patent application number | Description | Published |
20090196353 | VIDEO COMPRESSION METHOD AND APPARATUS - A video compression system may have first and second dual-port memory devices, a third memory device, and first and second processors that may provide enhanced processing, including motion estimation. The first processor may be configured to store in the second memory device first and second video frames and to transfer sequential sets of data from the first video frame corresponding to fields of search. A second set of a plurality of adjacent macroblocks of the second video frame may be compared to macroblocks selected from the field of search. Dual-port memory devices may allow for the concurrent use of shared memory by the two processors as well as data transfer during processing. | 08-06-2009 |
20090232201 | VIDEO COMPRESSION METHOD AND APPARATUS - A video compression system may have first and second dual-port memory devices, a third memory device, and first and second processors that may provide enhanced processing, including motion estimation. The first processor may be configured to store in the second memory device first and second video frames and to transfer sequential sets of data from the first video frame corresponding to fields of search. A second set of a plurality of adjacent macroblocks of the second video frame may be compared to macroblocks selected from the field of search. Dual-port memory devices may allow for the concurrent use of shared memory by the two processors as well as data transfer during processing. | 09-17-2009 |
20160028324 | POWER-OVER-ETHERNET POWERED INVERTER - An apparatus may include a data management assembly and a DC to AC inverter assembly. The data management assembly may include a data input, a data output, and a power port. The data management assembly may be configured to receive in combination a data signal and a variable DC input voltage on the data input, separate the received data signal from the input voltage, output the data signal on the data output, and output the input voltage on the power port. The DC to AC inverter assembly may be configured to receive the input voltage from the power port, boost the input voltage to a predetermined DC stepped-up voltage that is constant for different input voltages, convert the stepped-up voltage to an AC voltage, and output the AC voltage on a power output. | 01-28-2016 |