Patent application number | Description | Published |
20080230591 | DEVICE AND METHOD FOR PRETREATING ELECTRONIC COMPONENTS PRIOR TO SOLDERING - A device and method are provided for reflow soldering workpieces wherein a plasma device for an atmospheric plasma treatment of the workpiece is upstream of a solder application and/or upstream of a soldering zone, and wherein the method subjects the workpiece to an atmospheric plasma treatment with the aid of a plasma device prior to the application of the solder and/or prior to the soldering process. | 09-25-2008 |
20080277457 | Device and method for wave soldering - The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located above the solder reservoir so as to exclude oxygen and with means for introducing the protective and/or active gas as well as an enclosure being provided, with the enclosure being configured in such a manner that it encloses at least the essential parts of a solder zone. | 11-13-2008 |
20090140029 | METHOD AND DEVICE FOR WIRE BONDING - The invention provides a device for wire bonding with a copper-containing bonding wire for connecting a component to a support, wherein provision is made on the component as well as on the support for at least one bond pad, encompassing a guide for the bonding wire and a device for melting a part of a bonding wire, which is provided for a connection to one of the bond pads, wherein the guide for the bonding wire is embodied in such a manner that the melted part of the bonding wire is brought into contact in each case with at least one bond pad in a bonding chamber, characterized in that provision is made for at least one plasma nozzle, with part of the bonding wire provided for the connection to the bond pad can be acted upon by a plasma and/or the bond pad can be acted upon by a plasma and/or the bonding chamber can be acted upon by a plasma. The invention also relates to a method for wire bonding. | 06-04-2009 |
20100059575 | DEVICE AND METHOD FOR SELECTIVE SOLDERING - The invention relates to a device and method for selective soldering, including at least one nozzle and a soldering channel surrounded by a vertically moveable hood, which immerses in a soldering bath or which is sealed against a surface of the soldering bath. The hood includes a passage for each nozzle, at least one gas feeding device for providing protective and/or active gas underneath the hood, and flow plates which are attached to the hood to extend substantially downward in the direction of the soldering bath from the hood. | 03-11-2010 |