Patent application number | Description | Published |
20090111222 | SEMICONDUCTOR CHIP MOUNTING METHOD, SEMICONDUCTOR MOUNTING WIRING BOARD PRODUCING METHOD AND SEMICONDUCTOR MOUNTING WIRING BOARD - A method of producing a wiring board on which a semiconductor chip is to be mounted, includes: adhering an aluminum foil to one surface of a resin substrate; providing a heat-hardening resin layer having a predetermined shape on the aluminum foil; removing a part of the aluminum foil which is exposed from the heat-hardening resin layer to form a wiring circuit; and providing a thermoplastic resin layer on the wiring circuit. The heat-hardening resin layer has strength that enables the wiring board to prevent short between the semiconductor chip and the wiring circuit and has a crosslinking degree that is so reduced as to enable the bump to remove the heat-hardening resin layer to reach the wiring circuit, when the heat is applied to the wiring board and the bump to which the ultrasonic wave is applied is pressed to the wiring board. | 04-30-2009 |
20130175074 | METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED THEREON - A method for surface mounting an electronic component includes providing a conductive circuit on a substrate member, forming a thermoplastic resin layer on a front surface of the conductive circuit, providing a surface of an electrode of an electronic component with a metal layer, and bonding the metal layer of the electronic component and the conductive circuit to each other by melting and partially removing a thermoplastic resin by applying a load generated by ultrasonic vibration that vibrates in a direction substantially parallel to a surface of the metal layer, while pressing the metal layer to the thermoplastic resin layer, and then stopping applying the load generated by the ultrasonic vibration, and hardening the thermoplastic resin thus melted by cooling. The metal layer is configured by a thin layer made of a material having a shear strength lower than that of a material constituting the conductive circuit. | 07-11-2013 |
20140129045 | CONTROL DEVICE, HEATING DEVICE CONTROL SYSTEM, CONTROL METHOD, PROGRAM, AND RECORDING MEDIUM - A control device that controls a heating device having a plurality of heating zones, has a monitoring unit configured to monitor a temperature of at least a first heating zone in the plurality of heating zones, and a control unit configured to perform heat-up starting control, in which heat-up of at least a second heating zone is started in the plurality of heating zones, based on the temperature of the first heating zone. | 05-08-2014 |
20140316602 | CONTROL DEVICE, CONTROL METHOD, AND RECORDING MEDIUM - A control device has a monitoring section that monitors an amount of electric energy of a first machine, and a power supply controller that controls power supply of a second machine in accordance with an amount of electric energy of the first machine and schedule information indicative of an operation schedule of each of the first machine and the second machine. | 10-23-2014 |