Patent application number | Description | Published |
20080242054 | Dicing and drilling of wafers - Methods and apparatus to dicing and/or drilling of wafers are described. In one embodiment, an electromagnetic radiation beam (e.g., a relatively high intensity, ultra-short laser beam) may be used to dice and/or drill a wafer. Other embodiments are also described. | 10-02-2008 |
20100065971 | Laser assisted chemical vapor deposition for backside die marking and structures formed thereby - Methods of forming a microelectronic structure are described. Embodiments of those methods include forming an identification mark on a portion of a backside of an individual die of a wafer by utilizing laser assisted CVD, wherein the formation of the identification mark is localized to a focal spot of the laser. | 03-18-2010 |
20100099238 | Laser-assisted chemical singulation of a wafer - The present invention discloses an apparatus including: a laser beam directed at a wafer held by a chuck mounted on a stage inside a process chamber; a focusing mechanism for the laser beam; a steering mechanism for the laser beam; an optical scanning mechanism for the laser beam; a mechanical scanning system for the stage; an etch chemical induced by the laser beam to etch the wafer and form volatile byproducts; a gas feed line to dispense the etch chemical towards the wafer; and a gas exhaust line to remove any excess of the etch chemical and the volatile byproducts. | 04-22-2010 |
20100129984 | WAFER SINGULATION IN HIGH VOLUME MANUFACTURING - The present invention discloses an apparatus including: a laser beam directed at a wafer held by a chuck in a process chamber; a focusing mechanism for the laser beam; a steering mechanism for the laser beam; an optical scanning mechanism for the laser beam; a mechanical scanning system for the chuck; an etch chemical induced by the laser beam to etch the wafer and form volatile byproducts; a gas feed line to dispense the etch chemical towards the wafer; and a gas exhaust line to remove any excess of the etch chemical and the volatile byproducts. | 05-27-2010 |
20100155625 | Methods for concealing surface defects - Methods for removing random or uncontrolled surface defects from a work piece surface are provided, by applying a plurality of induced controlled defects over the random defects to alter the surface texture. | 06-24-2010 |
20110195226 | WORK PIECE WITH CONCEALED SURFACE DEFECTS - Methods for removing random or uncontrolled surface defects from a work piece surface are provided, by applying a plurality of induced controlled defects over the random defects to alter the surface texture. | 08-11-2011 |
20140076976 | SUBSTRATE MARKINGS - Apparatus, systems, and methods are provided to generate markings on the side of a substrate. The markings represent information. In an embodiment, the information provided in the markings may be used to collect information during an assembly process. | 03-20-2014 |
Patent application number | Description | Published |
20100314750 | Integrated circuit package having security feature and method of manufacturingsame - An integrated circuit package comprises a package substrate ( | 12-16-2010 |
20110031590 | Liquid film assisted laser die marking and structures formed thereby - Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a liquid on a region of a die, and then forming an identification mark through the liquid on the die. | 02-10-2011 |
20140175657 | METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBEDDED DIE PACKAGES - Apparatus including a die including a device side with contact points; and a build-up carrier disposed on the device side of the die; and a film disposed on the back side of the die, the film including a markable material including a mark contrast of at least 20 percent. Method including forming a body of a build-up carrier adjacent a device side of a die; and forming a film on a back side of the die, the film including a markable material including a mark contrast of at least 20 percent. Apparatus including a package including a microprocessor disposed in a carrier; a film on the back side of the microprocessor, the film including a markable material including a mark contrast of at least 20 percent; and a printed circuit board coupled to at least a portion of the plurality of conductive posts of the carrier. | 06-26-2014 |
20140264951 | LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING - Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads. | 09-18-2014 |