Vere
Denis Vere, Argentre Du Plessis FR
Patent application number | Description | Published |
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20110037607 | Microcircuit Card Comprising a Light-Emitting Diode - The light-emitting diode is provided with a lid and is capable of emitting a first predefined color. The card further comprises a near field communications antenna circuit, the circuit and the diode being configured so that the diode emits light when a current of predefined intensity flows in the circuit. More particularly, the lid of the diode is coated with a mass of material forming means for selecting a set of wavelengths from those making up the first color so that the light transmitted through the mass has a second predefined color different from the first color. | 02-17-2011 |
20110303112 | Method for Making an Imprint on an Article - An imprint ( | 12-15-2011 |
20120055999 | Luminous Module for Microcircuit Device - The electronic module ( | 03-08-2012 |
20120061476 | Microcircuit Card Including a Luminous Means - The microcircuit card ( | 03-15-2012 |
Denis Vere, Meudon FR
Patent application number | Description | Published |
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20100295288 | PRINTED IDENTIFICATION DOCUMENT AND PROCESS FOR PRINTING SUCH A DOCUMENT - The invention concerns the personalisation graphics of identification documents. The identification document comprises a body where at least one of the main surfaces forms a print surface, on which artwork ( | 11-25-2010 |
Denis Vere, Meudon Cedex FR
Patent application number | Description | Published |
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20110114732 | SECURED IDENTIFICATION DOCUMENT - A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers. | 05-19-2011 |
Denis Vere, Levallois Perret FR
Patent application number | Description | Published |
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20120138691 | METHOD OF RECEIVING A MODULE IN A SMART CARD BODY - The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer. | 06-07-2012 |