Patent application number | Description | Published |
20080236190 | Apparatus including freezing unit and projector including freezing unit - There is disclosed an apparatus including a freezing unit in which the freezing unit can be operated without any trouble even when a main body rotates. A liquid crystal display projector (an apparatus) including a freezing unit having a refrigerant circuit constituted of a compressor, a radiator, a capillary tube (a pressure reducing unit), an evaporator and the like includes a rotator as a posture adjustment unit for adjusting the main body to a basic posture to maintain at least a lubricating performance of the compressor in accordance with a posture change of the main body. The rotator rotates to adjust the basic posture of the whole freezing unit, and a rotary shaft of this rotator is arranged in parallel with an optical axis of a light source on the same plane. | 10-02-2008 |
20080236191 | Apparatus including freezing unit and projector including freezing unit - There are disclosed an apparatus including a freezing unit capable of securely discharging drainage from an evaporator regardless of a posture change of a main body, and a projector including the freezing unit. A liquid crystal display projector (an apparatus) including a main body provided with a freezing unit having a refrigerant circuit constituted of at least a compressor, a radiator, a capillary tube (a pressure reducing unit) and an evaporator includes a tapered shape of a sealed path of a duct which surrounds the evaporator constituted in the whole region under the evaporator in a prospective posture change of the main body, a groove (a liquid receiving portion) formed in the center of the shape, and a wick (a discharge member) which discharges drainage received in this groove by use of a capillary force. | 10-02-2008 |
20090178425 | COOLING DEVICE - Provided is a cooling apparatus, which has its cooling ability improved by liberating the thermal energy of a coolant from expansion means to the outside. The cooling apparatus includes a compressor, a condenser, an evaporator, a capillary tube and a blower fan. Moreover, a portion of the capillary tube corresponding to that expansion means is arranged to abut against the casing of the blower fan. Here, the portion of the capillary tube is arranged so helically or spirally as to abut against the upper face of the casing of the blower fan. Thus, the heat can be dissipated from the capillary tube to the casing of the blower fan. | 07-16-2009 |
20100066980 | PROJECTOR - There is disclosed a projector capable of efficiently cooling an optical element while decreasing the generation of noise as much as possible. A projector P includes a main body | 03-18-2010 |
Patent application number | Description | Published |
20080242101 | Process Control Method in Spin Etching and Spin Etching Apparatus - The present invention provides a process control method in spin etching capable of realizing uniformity in etching amount in etching treatment for even wafers each having various conditions, and achieving uniformity of thickness values among etched wafers. In the present invention, weight of a wafer before etching is measured in units of 1/1000 g, followed by predetermined etching treatment in a spin etching section. Thereafter, weight of the wafer is again measured in units of 1/1000 g after rinsing and drying treatment of the wafer, and then an actual etching amount is calculated from a difference between weight before and after etching of the wafer, confirming an etching rate each time etching to thereby control an etching time. | 10-02-2008 |
20090032188 | SINGLE-WAFER PROCESSOR - The present invention provides a single wafer processor structured such that similar immersion treatment to the conventional immersion treatment can be performed in the spin treatment, that a consumption of the chemical solutions can be reduced in the chemical solution treatment per wafer, that energy saving can be realized by using reaction heat of the chemical solutions to eliminate a necessity of a heating heater, that a problem of deterioration of the chemical solutions can be eliminated since the blending of the chemical solutions is implemented on the rotary disk part and the chemical solutions are used immediately thereafter, and that the maximum effective point of the chemical solutions can be utilized. The processor of the present invention includes: a rotary disk ( | 02-05-2009 |
20090032498 | Spin Processing Method And Apparatus - There are provided a spin processing method and a spin processing apparatus with which the improvement of a processing speed in spin processing can be compatible with the saving of a processing solution. The spin processing method comprises holding and fixing the wafer on the upper surface of the spin table, and supplying the processing solution to the surface of the wafer by the predetermined amount while rotating the spin table, to process the surface of the wafer, wherein the processing solution is supplied while the wafer is heated and maintained at the predetermined temperature, to process the wafer. The predetermined temperature for heating the wafer is equal to or higher than 25° C. | 02-05-2009 |
20090266414 | PROCESS FOR PRODUCING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE FOR SOLAR APPLICATION AND ETCHING SOLUTION - Provided are: a process for producing safely at low cost a semiconductor substrate excellent in photoelectric conversion efficiency, and stable in an etching rate and a pyramid shape, which is capable of uniformly forming a fine uneven structure with desired size suitable for a solar cell on the surface thereof; a semiconductor substrate for solar application having a uniform and fine pyramid-shaped uneven structure in a plane; and an etching solution for forming a semiconductor substrate having a uniform and fine uneven structure, which has a high stability at initial use. The process comprises etching a semiconductor substrate with the use of an alkaline etching solution containing at least one kind selected from the group consisting of carboxylic acids having a carbon number of 1 to 12 and having at least one carboxyl group in a molecule, salts thereof, and silicon, to thereby form an uneven structure on the surface of the semiconductor substrate. | 10-29-2009 |
20100269903 | PROCESS FOR PRODUCING POLYCRYSTALLINE SILICON SUBSTRATE AND POLYCRYSTALLINE SILICON SUBSTRATE - Provided are: a safe, low-cost method of producing a polycrystalline silicon substrate excellent in photoelectric conversion efficiency by which a uniform, fine uneven structure suited to a solar cell can be simply formed on the surface of the polycrystalline silicon substrate; and a polycrystalline silicon substrate having a uniform, fine, pyramid-shaped uneven structure so that its reflectance can be significantly reduced. The uneven structure is formed on the surface of the polycrystalline silicon substrate by etching the polycrystalline silicon substrate with an alkaline etching solution containing at least one kind selected from the group consisting of a carboxylic acid having 1 or more and 12 or less carbon atoms and each having at least one carboxyl group in one molecule, and salts of the acids. | 10-28-2010 |