Patent application number | Description | Published |
20110300647 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame. | 12-08-2011 |
20130017649 | PACKAGING FOR CLIP-ASSEMBLED ELECTRONIC COMPONENTSAANM Touzet; DominiqueAACI Savigne Sous le LudeAACO FRAAGP Touzet; Dominique Savigne Sous le Lude FRAANM Coirault; PascalAACI Ballan-MireAACO FRAAGP Coirault; Pascal Ballan-Mire FR - A system for assembling electronic chips in a package, including a first lead frame defining chip reception areas; and a second lead frame defining chip coverage areas, the frames including, at least at their periphery, pairs of mutually-cooperating elements for maintaining the frames together. | 01-17-2013 |
20130178017 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER - A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame. | 07-11-2013 |
Patent application number | Description | Published |
20100137183 | TREATMENT ENABLING THE REMOVAL OF A COATING AND/OR STAIN FROM A CONSTRUCTION MATERIAL - The invention relates to a treatment that can be used to remove a coating and/or stain from a construction material, such as anti-graffiti treatment. The inventive treatment uses a beta-dicarbonyl product. | 06-03-2010 |
20100279911 | ANTI-GRAFFITI TREATMENT - The invention relates to the use, in anti-graffiti treatments, and preferably in graffiti-suppressing treatments, of a particular dicarboxylic acid diester having improved treatment efficiency. | 11-04-2010 |
20110003523 | AGENT FOR THE HYDROPHILISATION OF AN ORGANIC PLASTIC MATERIAL - The invention relates to an agent for the hydrophilisation of an organic plastic material such as a thermoplastic polymer, wherein said hydrophilisation agent is selected from optionally polyalkoxylated ester phosphates in their acid form or salt form. The invention also relates to objects made of thermoplastic polymers having surfaces hydrophilised by the agents of the invention. | 01-06-2011 |
20110040025 | Block Copolymer, Process For Making The Same, And Use In Emulsions - The invention concerns amphiphilic block copolymers, a process for making the same, and its use in emulsions. The block copolymers comprise a hydrophilic block and a hydrophobic block and can be used in emulsion as an emulsifier or as a co-emulsifier, particularly in water-in-oil emulsions. | 02-17-2011 |