Patent application number | Description | Published |
20080248296 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROCESSING - The present invention relates to a pressure-sensitive adhesive sheet for processing, which includes a substrate; a pressure-sensitive adhesive layer containing a radiation-polymerizable compound; and an interlayer containing an acrylic polymer having a glass transition temperature of 20° C. or higher as a main component, the interlayer being disposed between the substrate and the pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet of the invention is excellent in pressure-sensitive adhesive properties, releasability, and expansibility. | 10-09-2008 |
20080261038 | ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES - An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer. | 10-23-2008 |
20110097576 | RE-PEELABLE ADHESIVE SHEET - A re-peelable adhesive sheet for grinding a semiconductor wafer comprises: a base film, and an adhesive layer laminated on the base film, the re-peelable adhesive sheet has a modulus of elasticity of at least 10 | 04-28-2011 |
20110151252 | ADHESIVE TAPE OR SHEET - An adhesive tape or sheet comprises an adhesive layer which contains 0.3 to 10 parts by weight of an polyether polyol compound, and 0.005 to 2 parts by weight of at least one alkali metal salt for 100 parts by weight of an acrylic adhesive which is formed with a copolymer of methyl acrylate monomer, ethyl acrylate monomer, or methyl acrylate monomer and ethyl acrylate monomer, acrylate monomer, and 2-ethylhexyl acrylate monomer. | 06-23-2011 |
20120114938 | ADHESIVE SHEET FOR PROCESSING OF SEMICONDUCTOR WAFTER - An adhesive sheet for processing of a semiconductor wafer has an adhesive layer disposed on at least one surface of a base substrate, the adhesive layer includes a base polymer, a plasticizer and a surfactant, an SP value of the plasticizer and the surfactant satisfies the relationship: 0.9≦(the plasticizer SP value)/(the surfactant SP value)≦1.0. The present invention has the object of providing an adhesive sheet for processing of a semiconductor wafer that exhibits superior storage stability under a range of environments, and that prevents contamination of the adherend after use. | 05-10-2012 |
20120196171 | LAMINATE FOR NONAQUEOUS BATTERY - Laminate for nonaqueous battery having moderate adhesion in which a nonaqueous electrolytic solution is sealed capable of improving the suitability of electrodes packed into a battery case without reduction in battery output and preventing a short circuit between the electrodes caused by the penetration of a burr or the like on an electrode plate through a separator and capable of suppressing reduction of adhesion in nonaqueous electrolytic solution and suppressing the deterioration of the nonaqueous electrolytic solution and having such a cohesive strength that when it is used in the form of a tape, a pressure-sensitive adhesive layer does not squeeze out of a base material layer and formed of at least two layers: a base material layer (A) containing a polyolefin-based thermoplastic resin; (B) containing an α-olefin-based thermoplastic resin in the stated order. | 08-02-2012 |
20120222805 | TACKINESS ADHESIVE SHEET FOR THIN-FILM SUBSTRATE FIXING - The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. A thin-film substrate, a tackiness adhesive sheet for thin-film substrate fixing, and a hard substrate are laminated in this order and a porous base material functioning as a core material of the tackiness adhesive sheet for thin-film substrate fixing has bore holes. Therefore, even if preliminary heating and drying is not applied, air bubbles are not generated between the thin-film substrate and the tackiness adhesive sheet for fixing during pattern formation on the thin-film substrate. This makes it possible to stably and efficiently form a pattern. | 09-06-2012 |
20120223455 | METHOD FOR MANUFACTURING THIN-FILM SUBSTRATE - The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. The method for manufacturing the thin-film substrate includes: stacking the thin-film substrate, a tackiness/adhesive agent for temporary fixing and a hard substrate in this order; fixing the thin-film substrate on the hard substrate through the tackiness/adhesive agent; then forming the pattern; and subsequently peeling the thin-film substrate at an interface between the thin-film substrate and the tackiness/adhesive agent. | 09-06-2012 |
20130251985 | LAMINATE - Provided is a laminate including a thermoplastic resin layer and a substrate, which has superior transparency, is resistant to “warping”, and is advantageous for the encapsulation and surface protection of opto-electronic devices. The laminate includes a substrate; a thermoplastic resin layer having a thickness of more than 200 μm and less than or equal to 500 μm; and a pressure-sensitive adhesive layer lying between the substrate and thermoplastic resin layer and bonding them to each other, in which the thermoplastic resin layer has a 180-degree peel strength of 1.0 N/25 mm or more with respect to the pressure-sensitive adhesive layer at 23° C. The laminate preferably has a total luminous transmittance of 80% or more. | 09-26-2013 |
20140154450 | ADHESIVE TAPE OR SHEET - A polyvinyl chloride-based adhesive tape or sheet has a base material layer formed to include 10 to 40 parts by weight of plasticizing agent(s) in relation to 100 parts by weight of a polyvinyl chloride-based resin and an adhesive layer on one surface of the base material layer, the plasticizing agent includes at least one type of plasticizing agent having an SP value of at least 9.0. | 06-05-2014 |