Patent application number | Description | Published |
20090007991 | Ferritic Heat-Resistant Steel - Disclosed is a ferritic heat-resistant steel which has the following chemical composition (by weight): C: 0.01-0.10%; Si: 0.30-1.0%; P: 0.02 or less; S: 0.010% or less; Mn: 0.2-1.2%; Ni: 0.3% or less; Cr: 8.0-11.0%; Mo: 0.1-1.2%; W: 1.0-2.5%; V: 0.10-0.30%; Nb: 0.02-0.12%; Co: 0.01-4.0%; N: 0.01-0.08%; B: not less than 0.001% and less than 0.010%; Cu: 0.3% or less; and Al: 0.010% or less, provided that the chemical composition satisfies the following equations: Mo(%)+0.5×W(%)=1.0-1.6, and C(%)+N(%)=0.02-0.15%, and which comprises a tempered martensite single-phase tissue produced by thermal refining. The steel shows an excellent long-term creep rupture strength even when used at a steam temperature around 650˚C and also has excellent steam oxidizability. When the value represented by the equation: Al(%)+0.1×Ni(%) is adjusted to 0.02 or less, the creep strength can be more stabilized. | 01-08-2009 |
20090145466 | ANTIGEN EXPOSURE CHAMBER AND METHOD OF CLEANING AND DRYING THE SAME - An antigen exposure chamber for quickly performing cleaning and drying with high quality is provided. The antigen exposure chamber of the present invention includes: a cleaning water supply device for supplying cleaning water for cleaning the antigen exposure chamber; cleaning nozzles | 06-11-2009 |
20100093907 | Fine Pattern Transfer Material - A transfer material that can favorably form a fine pattern by nanoimprinting. The nanoimprinting transfer material is a fine pattern resin composition that includes an organosilicon compound and a metal compound of a metal from groups 3 through 14 of the periodic table. | 04-15-2010 |
20110017355 | FERRITIC HEAT-RESISTANT STEEL - Disclosed is a ferritic heat-resistant steel which has the following chemical composition (by weight): C: from 0.01% to less than 0.08%; Si: 0.30-1.0%; P: 0.02 or less; S: 0.010% or less; Mn: 0.2-1.2%; Ni: 0.3% or less; Cr: 8.0-11.0%; Mo: 0.1-1.2%; W: 1.0-2.5%; V: 0.10-0.30%; Nb: 0.02-0.12%; Co: 0.01-4.0%; N: 0.01-0.08%; B: not less than 0.001% and less than 0.010%; Cu: 0.3% or less; and Al: 0.010% or less, provided that the chemical composition satisfies the following equations: Mo (%)+0.5×W (%)=1.0-1.6, and C (%)+N (%)=0.02-0.15%, and which comprises a tempered martensite single-phase tissue produced by thermal refining and contains 30% by weight or less of δ ferrite. | 01-27-2011 |
20130294959 | HEAT-RESISTANT STEEL - Disclosed is a ferritic heat-resistant steel which has the following chemical composition (by weight): C: from 0.01% to less than 0.08%; Si: 0.30-1.0%; P: 0.02 or less; S: 0.010% or less; Mn: 0.2-1.2%; Ni: 0.3% or less; Cr: 8.0-11.0%; Mo: 0.1-1.2%; W: 1.0-2.5%; V: 0.10-0.30%; Nb: 0.02-0.12%; Co: 0.01-4.0%; N: 0.01-0.08%; B: not less than 0.001% and less than 0.010%; Cu: 0.3% or less; and Al: 0.010% or less, provided that the chemical composition satisfies the following equations: Mo(%)+0.5×W(%)=1.0-1.6, and C(%)+N(%)=0.02-0.15%, and which comprises a tempered martensite single-phase tissue produced by thermal refining and contains 30% by weight or less of 5 ferrite. | 11-07-2013 |
20130331531 | EPOXY-GROUP-CONTAINING COPOLYMER, EPOXY (METH)ACRYLATE COPOLYMER USING THE SAME, AND THEIR PRODUCTION PROCESSES - According to the present invention, a novel epoxy group-containing copolymer, including a production process thereof, and an epoxy (meth)acrylate copolymer starting from the epoxy group-containing copolymer, including a production process thereof are provided. The epoxy group-containing copolymer of the present invention contains a specific epoxy group-containing repeating unit and an olefin-based repeating unit. A novel epoxy (meth)acrylate copolymer of the present invention is produced by reacting the epoxy group-containing copolymer with (meth)acrylic acid. | 12-12-2013 |
Patent application number | Description | Published |
20100258983 | EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE COMPOSITION - The present invention has an object to provide a curable composition for transfer materials. The curable composition is applicable to a UV nanoimprint process capable of forming micropatterns with high throughput, is applicable to a thermal nanoimprint process in some cases, and is capable of forming a micropattern having high selectivity on etching rates regarding a fluorine-based gas and an oxygen gas. A curable composition for transfer materials of the present invention contains a curable silicon compound produced by subjecting a silicon compound (A) having a Si—H group and a compound (B) having a curable functional group and a carbon-carbon double bond other than the curable functional group to a hydrosilylation reaction. | 10-14-2010 |
20110144279 | EPOXY GROUP-CONTAINING COPOLYMER, EPOXY (METH)ACRYLATE COPOLYMER USING THE SAME AND THEIR PRODUCTION PROCESSES - According to the present invention, a novel epoxy group-containing copolymer, including a production process thereof, and an epoxy (meth)acrylate copolymer starting from the epoxy group-containing copolymer, including a production process thereof are provided. The epoxy group-containing copolymer of the present invention contains a specific epoxy group-containing repeating unit and an olefin-based repeating unit. A novel epoxy (meth)acrylate copolymer of the present invention is produced by reacting the epoxy group-containing copolymer with (meth)acrylic acid. | 06-16-2011 |
20130334557 | COMPOSITION CONTAINING QUANTUM DOT FLUORESCENT BODY, MOLDED BODY OF QUANTUM DOT FLUORESCENT BODY DISPERSION RESIN, STRUCTURE CONTAINING QUANTUM DOT FLUORESCENT BODY, LIGHT-EMITTING DEVICE, ELECTRONIC APPARATUS, MECHANICAL DEVICE, AND METHOD FOR PRODUCING MOLDED BODY OF QUANTUM DOT FLUORESCENT BODY DISPERSION RESIN - Provided are a composition that contains a quantum dot fluorescent body and that is able to suppress quenching of the quantum dot fluorescent body, a molded body of a quantum dot fluorescent body dispersion resin, a structure containing a quantum dot fluorescent body, a light-emitting device, an electronic apparatus, or a mechanical device, and a method for producing the molded body of a quantum dot fluorescent body dispersion resin. | 12-19-2013 |