Patent application number | Description | Published |
20100195391 | SEMICONDUCTOR MEMORY DEVICE WITH MEMORY CELLS EACH INCLUDING A CHARGE ACCUMULATION LAYER AND A CONTROL GATE - A semiconductor memory device includes a memory cell unit, word lines, a driver circuit, and first transistors. The word lines are connected to the control gates of 0-th to N-th memory cells. The (N+1) number of first transistors transfer the voltage to the word lines respectively. Above one of the first transistors which transfers the voltage to an i-th (i is a natural number in the range of 0 to N) word line, M (M08-05-2010 | |
20100232225 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device has a sense amplifier. The sense amplifier includes a first lower interconnection; a second interlayer insulation film formed on the first interlayer insulation film and top of the first interconnection; a contact interconnection formed in a direction perpendicular to a substrate plane of the semiconductor substrate so as to pass through the second interlayer insulation film, and connected to the first lower interconnection; a first upper interconnection formed on the second interlayer insulation film and connected to the contact interconnection disposed under the first upper interconnection; a dummy contact interconnection formed in a direction perpendicular to the substrate plane of the semiconductor substrate in the second interlayer insulation film, and adjacent to the contact interconnection; and a second upper interconnection formed on the second interlayer insulation film so as to extend in the first direction, and connected to the dummy contact interconnection disposed under the second upper interconnection. | 09-16-2010 |
20100314771 | SEMICONDUCTOR DEVICE INCLUDING AN IMPROVED LITHOGRAPHIC MARGIN - A semiconductor device includes first to third lines. The second line has a width equal to the first line. The second line is arranged with a space equal to the width from the first line, and partially has a gap. The third line is connected to one end of the first line and to a side of one end of the second line. | 12-16-2010 |
20110013456 | SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REDUCING CHIP SIZE - According to one embodiment, a first well of the first conductivity type which is formed in a substrate. a second well of a second conductivity type which is formed in the first well. The plurality of memory cells, the plurality of first bit line select transistors, and the plurality of second bit line select transistors are formed in the second well, and the plurality of first bit line select transistors and the plurality of second bit line select transistors are arranged on a side of the sense amplifier with respect to the plurality of memory cells of the plurality of bit lines. | 01-20-2011 |
20110019477 | NAND TYPE FLASH MEMORY - According to one embodiment, a NAND type flash memory includes a first transfer transistor disposed between first and second memory planes, the first potential transfer terminal of the first transfer transistor being commonly connected to a first word line in the first NAND block and a second word line in the third NAND block, a second transfer transistor disposed at a first end of the first memory plane, the first potential transfer terminal of the second transfer transistor being connected to a third word line in the second NAND block, and a third transfer transistor disposed at a second end of the second memory plane, the first potential transfer terminal of the third transfer transistor being connected to a fourth word line in the fourth NAND block. | 01-27-2011 |
20110176347 | SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING SEMICONDUCTOR MEMORY - According to one embodiment, a memory cell array includes memory cells arranged at crossing points of bit lines and word lines. The bit lines include first, second, third, and fourth bit lines sequentially arranged. A first sense circuit is arranged on a first end side of the memory cell array, electrically connected to the first and third bit lines. A second sense circuit is arranged on a second end side of the memory cell array, electrically connected to the second and fourth bit lines. A first hookup region is arranged between the memory cell array and the first sense circuit and includes a first transfer transistor connected to the first bit line and the first sense circuit. A second hookup region is arranged between the first hookup region and the first sense circuit and includes a second transfer transistor connected to the third bit line and the first sense circuit. | 07-21-2011 |
20130003461 | SEMICONDUCTOR MEMORY DEVICE CAPABLE OF REDUCING CHIP SIZE - According to one embodiment, a first well of the first conductivity type which is formed in a substrate. a second well of a second conductivity type which is formed in the first well. The plurality of memory cells, the plurality of first bit line select transistors, and the plurality of second bit line select transistors are formed in the second well, and the plurality of first bit line select transistors and the plurality of second bit line select transistors are arranged on a side of the sense amplifier with respect to the plurality of memory cells of the plurality of bit lines. | 01-03-2013 |
20140085977 | SEMICONDUCTOR MEMORY DEVICE WITH MEMORY CELLS EACH INCLUDING A CHARGE ACCUMULATION LAYER AND A CONTROL GATE - A semiconductor memory device includes a memory cell unit, word lines, a driver circuit, and first transistors. The word lines are connected to the control gates of 0-th to N-th memory cells. The (N+1) number of first transistors transfer the voltage to the word lines respectively. Above one of the first transistors which transfers the voltage to an i-th (i is a natural number in the range of 0 to N) word line, M (M03-27-2014 | |