Patent application number | Description | Published |
20090018452 | PROBE ADAPTED TO MEASURE BIOLOGICAL SIGNAL - A probe is adapted to emit light having at least one wavelength as irradiation light with respect to a measured portion on a biological body in order to measure a biological signal. A light emitting element is configured to emit the light having the at least one wavelength. A light guiding member is provided with: a first end face, being light-reflective and having a first part opposing the light emitting element and a second part surrounding the first part; a second end face, being light-reflective and intersecting the first end face; and a third end face, being light-permeable, opposing the first end face and intersecting the second end face. The light guiding member is configured such that at least part of the light emitted from the light emitting element is reflected by at least one of the first end face and the second end face, and emitted from the third end face as the irradiation light. A light receiving element is configured to receive light reflected by the measured portion. A section shape of the first end face in a direction along an optical axis of the light emitting element is such a shape that at least the second part is coincident with a circumference of an ellipse intersecting a minor axis of the ellipse, and the optical axis of the light emitting element is coincident with the minor axis of the ellipse. | 01-15-2009 |
20100089980 | BONDING APPARATUS AND BONDING METHOD - A bonding apparatus ( | 04-15-2010 |
20100093131 | BONDING APPARATUS AND BONDING METHOD - A bonding apparatus ( | 04-15-2010 |
20100294435 | BONDING APPARATUS AND WIRE BONDING METHOD - A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed. | 11-25-2010 |
20110114708 | METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK - Metal nanoink ( | 05-19-2011 |
20110230066 | CONNECTOR, CARD EDGE CONNECTOR, AND SENSOR USING THE SAME - A connector includes: a card edge connector; a first cable drawn out from the card edge connector in a first direction; a first terminal disposed in the card edge connector and connected to the first cable; a receptacle into and from which the card edge connector is inserted and extracted; a second cable drawn out from the receptacle in a second direction; and a second terminal disposed in the receptacle and connected to the second cable. Insertion/extraction directions of the card edge connector are substantially perpendicular to at least one of the first direction and the second direction. The card edge connector includes a first end face which is substantially parallel to the insertion/extraction directions, and the receptacle includes a first wall face which is substantially parallel to the insertion/extraction directions. In a state where the card edge connector and the receptacle are coupled to each other, the first end face and the first wall face are in contact with each other. | 09-22-2011 |
20120238847 | PROBE - A probe includes: light emitting and receiving sections; an attachment band including a first surface facing the living tissue and a second surface opposite to the first surface, a part of the first surface in which one of a hook portion and a loop portion is provided, a part of the second surface in which the other is provided, the attachment band to be wrapped around the living tissue to engage the hook and loop portions with each other; and a compressible member attached to the first surface, being in contact with the living tissue when the attachment band is attached to the living tissue, the compressible member which is larger in width than the attachment band and ends of which extend beyond ends of the attachment band. | 09-20-2012 |
20120280618 | PLASMA IGNITION SYSTEM, PLASMA IGNITION METHOD, AND PLASMA GENERATING APPARATUS - Provided is a plasma ignition technique allowing easy and reliable ignition and reignition of plasma without monitoring or manual handling. A plasma ignition system according to this technique is provided with a radio-frequency power supply configured to supply a predetermined high frequency signal to an applied electrode for generating plasma; a matching device configured to match impedance on a side of the radio-frequency power supply and impedance on a side of the applied electrode; a forward wave/reflected wave detector configured to detect a forward wave and a reflected wave of the high frequency signal; a high-voltage generator configured to generate a predetermined high voltage; and a controller configured to superimpose the high voltage on the high frequency signal when a ratio of the reflected wave to the forward wave is greater than a first threshold value. | 11-08-2012 |
20130001280 | METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK - Metal nanoink for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent in the form of oxygen nanobubbles or oxygen bubbles either before or after metal nanoparticles whose surfaces are coated with a dispersant are mixed into the organic solvent. Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized. | 01-03-2013 |
20140034712 | BONDING APPARATUS AND BONDING TOOL CLEANING METHOD - In wire bonding in which a bonding tool is cleaned through plasma irradiation, the plasma application to a wire and therefore the formation of an unexpectedly large-sized ball in the following bonding operation is prevented. The cleaning of the bonding tool through plasma irradiation is followed by dummy bonding, the bonding tool is cleaned with a ball formed thereon, or a prohibition period is provided during which ball forming is prohibited until the energy of plasma attenuates after the bonding tool is cleaned to prevent the plasma irradiation from having an impact on the bonding operation so that the ball cannot have an increased diameter. | 02-06-2014 |
20140311590 | ANTIOXIDANT GAS SUPPLY UNIT - Provided is an antioxidant gas supply unit including: a base body ( | 10-23-2014 |
20140332583 | WIRE BONDING APPARATUS - Provided is a wire bonding apparatus including: a base ( | 11-13-2014 |