Patent application number | Description | Published |
20080290977 | COMMON MODE CHOKE COIL - A common mode choke coil is provided with first and second coil conductors that are magnetically coupled to each other, a third coil conductor that is electrically connected in series to the first coil conductor and substantially not magnetically coupled to the first coil conductor, a fourth coil conductor that is electrically connected in series to the second coil conductor and substantially not magnetically coupled to the second coil conductor, a first contact conductor for connecting the third coil conductor with the inner end of the first coil conductor, and a second contact conductor for connecting the fourth coil conductor with the inner end of the second coil conductor. The third coil conductor and the fourth coil conductor are substantially not magnetically coupled, and are in a linear symmetrical relationship based on a prescribed center line. | 11-27-2008 |
20080303621 | COMMON MODE CHOKE COIL - A common mode choke coil includes two laminated coil conductors, a first magnetic substrate arranged on one of the coil conductors, and a second magnetic substrate arranged on the other coil conductor. When it is assumed that a distance from a conductor center of the one coil conductor to the surface of the first magnetic substrate is designated as A, a distance from a conductor center of the other coil conductor to the surface of the second magnetic substrate is designated as B, and a distance from the conductor center of the one coil conductor to the conductor center of the other coil conductor is designated as C, C<(A+B)/2 is satisfied. Accordingly, because a difference in the distances between the magnetic substrates and the coil conductors becomes relatively small, a leakage inductance due to the difference in the distance decreases, and the cut-off frequency with respect to a differential mode signal can be increased. | 12-11-2008 |
20090066462 | COMMON MODE CHOKE COIL AND MANUFACTURING METHOD THEREOF - A common mode choke coil includes two extraction conductors formed on a resin insulating layer, and a concave portion is formed in the resin insulating layer in an area between a first portion covered with one of the extraction conductors and a second portion covered with the other extraction conductor. An upper resin insulating layer is embedded inside the concave portion. Accordingly, because the resin insulating layer is not flat in the portion where the extraction conductors are formed, a distance between the extraction conductors along the surface of the resin insulating layer increases. Therefore, a current path generated due to ion migration along the surface of the insulating layer is hardly formed, thereby enabling to obtain high withstand voltage, even if the distance between the extraction conductors is short. | 03-12-2009 |
20090284340 | COMMON MODE FILTER - A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filter | 11-19-2009 |
20100182724 | COMPOSITE ELECTRONIC DEVICE AND DIGITAL TRANSMISSION CIRCUIT USING THEREOF - A composite electronic device includes first and second magnetic substrates, and a functional layer sandwiched between these magnetic substrates, and the functional layer is configured by a common-mode filter layer and a ESD protection element layer. An electrostatic capacitance of the ESD protection elements is equal to or lower than 0.35 pF. The common-mode filter layer includes a first spiral conductor formed on an insulation layer, and a second spiral conductor formed on an insulation layer. DC resistance of a common mode filter is equal to or higher than 0.5Ω and equal to or lower than 5Ω, and an electrostatic capacitance of the ESD protection elements is equal to or lower than 0.35 pF. A width W and a length L of the first and second spiral conductors satisfy a relational equation expressed by √(L/W)<(7.6651−fc)/0.1385. | 07-22-2010 |
20110002075 | COMPOSITE ELECTRONIC DEVICE - The present invention is provided with a composite electronic device comprising an inductor element and an ESD protection element formed between two magnetic substrates, wherein the inductor element includes insulation layers made of a resin, and spiral conductors formed on the insulation layers, the ESD protection element includes a base insulation layer, a pair of gap electrodes arranged via gap formed therebetween on the base insulation layer, and an ESD absorbing layer arranged at least between the gap electrodes, and the ESD absorbing layer includes a composite material having an insulation inorganic material and a conductive inorganic material discontinuously dispersed in a matrix of the insulation inorganic material. The gap of the ESD protection element is provided at exterior of the spiral conductor so as not to be overlapped with the spiral conductor in view of a laminating direction. | 01-06-2011 |
20110007438 | COMPOSITE ELECTRONIC DEVICE, MANUFACTURING METHOD THEREOF, AND CONNECTION STRUCTURE OF COMPOSITE ELECTRONIC DEVICE - The present invention is provided with a composite electronic device comprising an inductor element and an ESD protection element formed between two magnetic substrates, wherein the inductor element includes insulation layers made of a resin, and conductor patterns formed on the insulation layers, the ESD protection element includes a base insulation layer, a pair of electrodes arranged via gap formed therebetween on the base insulation layer, and an ESD absorbing layer arranged at least between the electrodes, and the ESD absorbing layer includes a composite material having an insulation inorganic material and a conductive inorganic material discontinuously dispersed in a matrix of the insulation inorganic material. | 01-13-2011 |
20110007439 | COMPOSITE ELECTRONIC DEVICE - The present invention is provided with a composite electronic device comprising an inductor element and an ESD protection element formed between two magnetic substrates, wherein the inductor element includes insulation layers made of a resin, and spiral conductors formed on the insulation layers, the ESD protection element includes a base insulation layer, a pair of gap electrodes arranged via gap formed therebetween on the base insulation layer, and an ESD absorbing layer arranged at least between the gap electrodes, and a gap protection layer provided on at least one of the upper side and lower side of the gap, the ESD absorbing layer includes a composite material having an insulation inorganic material and a conductive inorganic material discontinuously dispersed in a matrix of the insulation inorganic material. The gap protection layer is made of resin including magnetic powder and carbon. | 01-13-2011 |
20110291790 | COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode. | 12-01-2011 |
20120112869 | COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A coil component | 05-10-2012 |
20120133472 | ELECTRONIC COMPONENT - An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer. | 05-31-2012 |
20130222101 | COIL COMPONENT AND METHOD FOR PRODUCING SAME - A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores. | 08-29-2013 |
20130249662 | PLANAR COIL ELEMENT - In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. | 09-26-2013 |
20130249664 | PLANAR COIL ELEMENT AND METHOD FOR PRODUCING THE SAME - In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 μm) smaller than that (32 μm) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element. | 09-26-2013 |
20130314189 | COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a coil component that includes an insulating layer formed on a substrate, a coil conductor provided between the substrate and the insulting layer, a first electrode connected to one end of the coil conductor, a second electrode connected to the other end of the coil conductor, and a magnetic layer formed on the insulting layer so as to cover a side surface of each of the first and second electrodes without covering a top surface of each of the first and second electrodes. | 11-28-2013 |
20140009254 | COIL COMPONENT - A coil component | 01-09-2014 |
20140077914 | COIL COMPONENT AND MAGNETIC METAL POWDER CONTAINING RESIN USED THEREFOR - A coil component | 03-20-2014 |