Patent application number | Description | Published |
20120160553 | CIRCUIT BOARD PRODUCTION METHOD AND CIRCUIT BOARD | 06-28-2012 |
20140027170 | WIRING SUBSTRATE - A wiring substrate ( | 01-30-2014 |
20140139310 | WIRING BOARD - This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface. | 05-22-2014 |
20140151106 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section. | 06-05-2014 |
20140251659 | CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD - A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole. | 09-11-2014 |
20150235755 | PLANAR COIL AND MANUFACTURING METHOD FOR TRANSFORMER AND PLANAR COIL - A planar coil includes an effective line segment, which extends over at least one turn and is configured such that a current flows therein, and a dummy line segment, which extends over at least one turn and is configured such that a current does not flow therein. | 08-20-2015 |
20150282313 | WIRING BOARD AND WIRING BOARD PRODUCTION METHOD - A wiring board includes a first substrate including a first surface and a second substrate including a first surface. A solder hole is arranged at least in the first surface of the first substrate. A solder hole is arranged at least in the first surface of the second substrate. The second substrate is coupled to the first substrate. The first substrate and the second substrate are electrically connected with each other. The first surface of the first substrate and the first surface of the second substrate are flush with each other and configured such that a part of one surface of a mask is placed on the first surface of the first substrate and another part of the surface of the mask is placed on the first surface of the second substrate. | 10-01-2015 |
20150289371 | SUBSTRATE (As Amended) - A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area. | 10-08-2015 |
20150289375 | MODULE FOR FACILITATING POSITIONING OF ELECTRONIC COMPONENTS - This module includes an insulating substrate having a first surface and a second surface, which are positioned on opposite sides to each other, a first metal layer that is provided on the first surface of the insulating substrate and include a metal plate, a second metal layer provided on the second surface of the insulating substrate, a first circuit board including the insulating substrate, the first metal layer, and the second metal layer, an electronic component joined to the first metal layer, and a positioning portion, which is located on the joint surface between the first metal layer and the electronic component, at which the first metal layer and the electronic component are engaged with each other through a recess-projection relationship. The insulating substrate is located between the second metal layer and a part of the first metal layer where the positioning portion is located. | 10-08-2015 |