Patent application number | Description | Published |
20100067163 | STATIC ELECTRICITY CONTROL PART AND PROCESS FOR MANUFACTURING THE SAME - The static-electricity control part of the present invention contains multiple pairs of backside electrodes ( | 03-18-2010 |
20100188791 | ANTI-STATIC PART AND ITS MANUFACTURING METHOD - A conductive layer containing gold as a main component is formed on the upper surface of an insulating base. A gap is formed on the conductive layer. A plurality of leader electrodes are formed to oppose one another via the gap. An excess voltage protection material layer is formed to cover some parts of the respective leader electrodes and the gap, so as to obtain an anti-static part. This method enables an accurate formation of a narrow gasp. Thus, it is possible to manufacture an anti-static part having a low peak voltage, stable suppression characteristic of electrostatic discharge (ESD), and a high sulfide resistance. | 07-29-2010 |
20100254052 | STATIC ELECTRICITY COUNTERMEASURE COMPONENT AND METHOD FOR MANUFACTURING THE STATIC ELECTRICITY COUNTERMEASURE COMPONENT - An electrostatic discharge (ESD) protector includes a ceramic body having a cavity provided therein, and two discharge electrodes facing each other across the cavity. The discharge electrodes are made of metal containing more than 80 wt. % of tungsten. The discharge electrodes contain not more than 2.0 atomic % of tungsten bonded to oxygen to a total amount of tungsten contained in the discharge electrodes. This ESD protector does not cause a short-circuiting even upon having high-voltage static electricity applied to the discharge electrodes repetitively, thus having high reliability. | 10-07-2010 |
20110026186 | ELECTROSTATIC DISCHARGE PROTECTION COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electrostatic discharge protection component includes an element body, a pair of discharge electrodes, and a pair of terminal electrodes. The element body includes a closed cavity therein. The discharge electrodes are formed in the element body in such a manner as to be exposed to the cavity. The terminal electrodes are connected to the discharge electrodes, respectively, and provided on the element body. There is an oxide of at least one metal selected from zinc, niobium, aluminum, magnesium, calcium, sodium, and potassium attached to the surface of at least one of the discharge electrodes in the cavity. | 02-03-2011 |
20130083440 | OVERVOLTAGE PROTECTION COMPONENT, AND OVERVOLTAGE PROTECTION MATERIAL FOR OVERVOLTAGE PROTECTION COMPONENT - An overvoltage protector includes a first discharging electrode, a second discharging electrode, and an overvoltage protection part provided between the first and second discharging electrodes. The overvoltage protecting part has an insulating property under a normal operation condition, and has a conductive property if an overvoltage is applied between the first and second discharging electrodes. The overvoltage protecting part is made of a mixture of resin having an insulation property, an inorganic compound having an insulating property, and metallic boride compound powder. The metallic boride compound powder has a high melting point therefore it is hardly melted. Under high temperatures causing the powder to melt, the powder is oxidized and loses conductivity, thus providing a high reliability. | 04-04-2013 |
Patent application number | Description | Published |
20090262771 | SEMICONDUCTOR LASER DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor laser device capable of suppressing damage of a waveguide is obtained. This GaN-based semiconductor laser chip (semiconductor laser device) includes an n-type GaN substrate of a nitride-based semiconductor and a semiconductor layer of a nitride-based semiconductor formed on the n-type GaN substrate and provided with a ridge portion constituting a waveguide extending in a direction F. The ridge portion (waveguide) is formed on a region approaching a first side from the center of the semiconductor layer. On a region opposite to the first side of the ridge portion (waveguide), a cleavage introduction step is formed from the side of the semiconductor layer, to extend in a direction intersecting with the extensional direction F of the ridge portion (waveguide). | 10-22-2009 |
20100044731 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - Such a semiconductor light-emitting device ( | 02-25-2010 |
20100189146 | METHOD OF MANUFACTURING SEMICONDUCTOR LASER DEVICE, SEMICONDUCTOR LASER DEVICE AND LIGHT APPARATUS - A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves. | 07-29-2010 |
20110085578 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a blue-violet semiconductor laser device, a pair of side surfaces of a semiconductor device structure composed of a nitride based semiconductor layer is respectively positioned inside a pair of side surfaces of a partial substrate composed of a Ge substrate. This causes the pair of side surfaces of the semiconductor device structure and the pair of side surfaces of the partial substrate to be respectively spaced apart from each other by a predetermined distance in a direction perpendicular to the pair of side surfaces of the semiconductor device structure. On the partial substrate, current blocking layers are formed in a region between the pair of side surfaces of the partial substrate and the pair of side surfaces of the semiconductor device structure. | 04-14-2011 |
20110280266 | SEMICONDUCTOR LASER APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS - This semiconductor laser apparatus includes a semiconductor laser chip and a package sealing the semiconductor laser chip. The package has a base portion mounted with the semiconductor laser chip, a sealing member and a window member. The semiconductor laser chip is sealed with the base portion, the sealing member and the window member. At least two of the base portion, the sealing member and the window member are bonded to each other through a sealant made of an ethylene-polyvinyl alcohol copolymer. | 11-17-2011 |
Patent application number | Description | Published |
20150049362 | IMAGE FORMING APPARATUS, METHOD FOR DISPLAYING SCREEN, AND STORAGE MEDIUM - An image forming apparatus includes a storage section, an operating section, an assignment and management section, a press detecting section, and a display processing section. The storage section stores settings of a plurality of paper feed cassettes accommodating paper. The operating section has a plurality of operation keys to be pressed for inputting operation. The assignment and management section assigns the paper feed cassettes to the different operation keys to manage the respective paper feed cassettes. The press detecting section detects press of any of the operation keys. The display processing section displays, during the time when any of the operation keys is kept pressed, a setting check screen showing the settings of the paper feed cassette assigned to the operation key being pressed. | 02-19-2015 |
20150067610 | IMAGE FORMING APPARATUS AND STORAGE MEDIUM - An image forming apparatus includes a menu management section, a variant-attribute menu management section, and a display processing section. The menu management section manages a tree structure including a plurality of menus hierarchized according to their attributes. The variant-attribute menu management section manages a variant-attribute menu associated with a specified menu as a quasi lower-level menu. The specified menu is classified according to its variant attribute different from corresponding one of the attributes used for the tree structure. The display processing section displays the quasi lower-level menu on a display according to selection of the variant-attribute menu and displays, once the quasi lower-level menu is selected, a next-lower-level menu of the quasi lower-level menu on the display based on path information and the tree structure. The path information shows pathways to be selected to reach the specified menu in the tree structure. | 03-05-2015 |
Patent application number | Description | Published |
20090061206 | FOAMED MEMBER, FOAMED MEMBER LAMINATE, AND ELECTRIC OR ELECTRONIC DEVICE USING FOAMED MEMBER - The present invention provides a foamed member capable of inhibiting or preventing foam breakage at the time when the foam member is peeled from a carrier tape, even when the foamed member has a high expansion ratio. The foamed member has a thermoplastic resin foam layer containing a thermoplastic resin foam formed through a step of impregnating a high-pressure inert gas into a thermoplastic resin and subsequently reducing pressure, and at least one of a thermoplastic polyester-based resin layer and a thermoplastic elastomer resin layer disposed on at least one side of the thermoplastic resin foam layer. | 03-05-2009 |
20090209670 | POLYOLEFIN RESIN FOAM AND THE PROCESS FOR PRODUCING THE SAME - An object of the invention is to provide a polyolefin resin foam which is excellent in flexibility, cushioning property and processability, especially excellent in cutting processability. The present invention relates to a polyolefin resin foam obtained by foaming a polyolefin resin composition using carbon dioxide in a supercritical state, wherein the polyolefin resin composition contains at least: (1) a thermoplastic elastomer composition obtained by subjecting to a dynamically heat treatment a mixture of (A) a rubber, and (B) (B-1) an α-olefin crystalline thermoplastic resin and/or (B-2) an α-olefin amorphous thermoplastic resin, each having a melt tension of less than 3.0 cN at a temperature of 210° C. and at a take-up speed of 2.0 m/min, in the presence of (C) a crosslinking agent; (2) a polyolefin resin; and (3) a nucleant agent having an average particle diameter of from 0.1 μm to less than 2.0 μm. The polyolefin resin foam has a density, for example, of 0.2 g/cm | 08-20-2009 |
20100116807 | DISASSEMBLABLE STRUCTURE, ELECTRIC EQUIPMENT AND NON-ELECTRIC EQUIPMENT HAVING DISASSEMBLABLE STRUCTURE, AND DISASSEMBLING METHOD - The present invention relates to a disassemblable structure including: a double-coated pressure-sensitive adhesive tape or a double-coated pressure sensitive adhesive sheet including a substrate and pressure-sensitive adhesive layers formed on both surfaces of the substrate, at least one of the pressure-sensitive adhesive layers being a thermal foaming agent-containing pressure-sensitive adhesive layer; a heating element which foams the thermal foaming agent-containing pressure-sensitive adhesive layer by heating; and a pair of adherends joined to each other through the pressure-sensitive adhesive tape or sheet and the heating element. | 05-13-2010 |
20120241079 | FOAMED MEMBER, FOAMED MEMBER LAMINATE, and ELECTRIC OR ELECTRONIC DEVICE USING FOAMED MEMBER - The present invention provides a foamed member capable of inhibiting or preventing foam breakage at the time when the foam member is peeled from a carrier tape, even when the foamed member has a high expansion ratio. The foamed member has a thermoplastic resin foam layer containing a thermoplastic resin foam formed through a step of impregnating a high-pressure inert gas into a thermoplastic resin and subsequently reducing pressure, and at least one of a thermoplastic polyester-based resin layer and a thermoplastic elastomer resin layer disposed on at least one side of the thermoplastic resin foam layer. | 09-27-2012 |