Patent application number | Description | Published |
20080266825 | ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT MOUNTED APPARATUS, METHOD OF INSPECTING BONDING PORTION THEREIN, AND CIRCUIT BOARD - An electronic component package includes: an insulating carrier substrate; a connection wiring that is provided on one side of the carrier substrate; an IC chip that is connected to the connection wiring; an external connection land that is disposed on the other side of the carrier substrate and is connected to the connection wiring via a wiring in the carrier substrate; and a solder ball that is disposed on the external connection land. A region of the external connection land that can be bonded to the solder ball has an outer shape that includes at least one arc portion and at least one straight portion. With this configuration, it is possible to provide an electronic component mounted apparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easily inspected, and a method of inspecting a bonding portion therein. | 10-30-2008 |
20090229879 | PRINTED CIRCUIT BOARD AND MOUNTING STRUCTURE FOR SURFACE MOUNTED DEVICE - The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGApackage as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGApackage is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole. | 09-17-2009 |
20110108997 | MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE COMPONENT - A semiconductor package component ( | 05-12-2011 |
20140120663 | MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE COMPONENT - A semiconductor package component ( | 05-01-2014 |