Patent application number | Description | Published |
20090028557 | INSERTABLE EMI SHIELD CLIP FOR USE IN OPTICAL TRANSCEIVER MODULES - The embodiments disclosed herein relate an insertable shield clip for use in controlling electromagnetic interference in an optical transceiver module. The optical transceiver module may include a shell that houses first and second optical subassemblies and an enclosure that cooperates with the shell in defining a covering for the optical transceiver module. The shield clip may comprise a body composed of conductive material. The body may include first and second vertical side members. The body may also include first and second shield members that are each configured to receive a corresponding nosepiece of one of the first and second optical subassemblies. The body may further include a bottom member that interconnects the first and second vertical side members and the first and second shield members. | 01-29-2009 |
20100080518 | PRINTED CIRCUIT BOARD POSITIONING IN AN OPTOELECTRONIC MODULE - Printed circuit board (PCB) positioning in an optoelectronic module. In one example embodiment, a spacer can be use to position top and bottom PCBs that are at least partially enclosed within top and bottom shells of an optoelectronic module. The spacer includes top and bottom surfaces and a plurality of top posts extending from the top surface. The top posts are configured to extend through openings in the top PCB to contact inside surfaces of the top shell. | 04-01-2010 |
20100296817 | ELECTROMAGNETIC RADIATION CONTAINMENT IN AN OPTOELECTRONIC MODULE - Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module. | 11-25-2010 |
20110081114 | COMMUNICATIONS MODULE INTEGRATED BOOT AND RELEASE SLIDE - One embodiment includes an integrated boot and release slide having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is overmolded over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable. | 04-07-2011 |
20110081119 | SIMPLIFIED AND SHORTENED PARALLEL CABLE - One embodiment includes a connector comprising a connector housing, a ferrule, and a crimp ring. The connector housing has inner and outer surfaces extending between forward and rear ends of the connector housing. The inner surfaces defined a passageway extending lengthwise between the forward and rear ends. The connector housing includes at least one protrusion formed on one of the outer surfaces that is configured to engage a corresponding connector engaging structure of an alignment guide to secure the connector housing within the alignment guide. The ferrule is configured to mount upon end portions of a plurality of optical fibers of a multi-fiber communication cable. The ferrule is disposed partially within the passageway. The crimp ring encompasses the rear end of the connector housing and is configured to secure the connector to the multi-fiber communication cable. | 04-07-2011 |
20110228483 | COMMUNICATIONS MODULE WITH A SHELL ASSEMBLY HAVING THERMAL MECHANICAL FEATURES - In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel. | 09-22-2011 |
20120148198 | COMMUNICATIONS MODULE INTEGRATED BOOT AND RELEASE SLIDE - One embodiment includes communications module having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is disposed over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable. | 06-14-2012 |
20130142490 | ELECTROMAGNETIC RADIATION SHIELD FOR AN ELECTRONIC MODULE - An electromagnetic radiation shield for an electronic module. In one example embodiment, an EMR shield for an electronic transceiver module includes a conductive carrier sized and configured to surround a shell of an electronic transceiver module. The conductive carrier defines a plurality of extended elements located on at least one edge of the conductive carrier and an orientation element. Each extended element is configured to bias against the shell in order to create a physical and electrical contact between the conductive carrier and the shell. The orientation element is configured to engage a corresponding structure in the shell in order to correctly orient the conductive carrier with respect to the shell. | 06-06-2013 |
20140044398 | BIASING ASSEMBLY FOR A LATCHING MECHANISM - An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly (“PCBA”) at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism. | 02-13-2014 |
Patent application number | Description | Published |
20080237835 | NON-UNIFORM FEEDTHROUGH AND LEAD CONFIGURATION FOR A TRANSISTOR OUTLINE PACKAGE - A transistor outline package having a feedthrough via and lead configuration that maximizes the amount of usable area on a header of the package is disclosed. In one embodiment, the package includes a header having an interior surface that includes a first and second lead assembly. The first lead assembly includes two vias having a first diameter, with each first via being positioned along a first pin circle imaginarily defined on the interior surface of the header. Each first via also includes first leads received therein. The second lead assembly includes four vias having a second diameter each, with each second via being positioned along a second pin circle that has a diameter greater than that of the first pin circle. Each second via includes second leads received therein. This configuration increases usable area on the header interior surface between the leads, enabling relatively larger submounts to be placed thereon. | 10-02-2008 |
20110267742 | LATCHING MECHANISM FOR AN ELECTRONIC MODULE - Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a slide ramp. The slide ramp is configured to engage the latch arm as the release slide is slid away from the engagement pin, which causes the latch to rotate from the latched position to the unlatched position. | 11-03-2011 |
20130094153 | ELECTROMAGNETIC RADIATION SHIELDING ON A PCI EXPRESS CARD - An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening. | 04-18-2013 |
20130202255 | Single Mode Fiber Array Connector For Opto-Electronic Transceivers - An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array. | 08-08-2013 |