Tino Fuchs
Tino Fuchs, Tubingen DE
Patent application number | Description | Published |
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20090278214 | Microelectromechanical Systems Encapsulation Process - An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation. | 11-12-2009 |