Patent application number | Description | Published |
20080271845 | Process for Temporary Fixing of a Polymeric Layer Material on Rough Surfaces - Process for temporary fixing of a polymeric layer material on rough surfaces, wherein the polymer layer material encompasses at least one viscoelastic layer, wherein the process involves laying the layer material on the rough surface, introducing energy in order to lower the viscosity of the at least one viscoelastic layer, in such a way that flow onto the rough surface takes place, and the layer is crosslinked in such a way as to produce a layer which has at least some elastomeric character and which at least to some extent wets the rough surface. | 11-06-2008 |
20080271846 | PRESSURE-SENSITIVE ADHESIVE AND DETACHABLE STRIP FORMED FROM IT - Pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling, the pressure-sensitive adhesive being composed at least of ( | 11-06-2008 |
20090008026 | ADHESIVE TAPE AND ITS USE AS CABLE BANDAGING TAPE - Adhesive tape intended more particularly for wrapping cables, comprising a textile backing and, coated on at least one side thereof, an adhesive comprising at least one vinylaromatic block copolymer and an at least partly hydrogenated tackifier resin. | 01-08-2009 |
20090120576 | ADHESIVE STRIP THAT CAN BE ACTIVATED BY HEAT AND IS BASED ON NITRILE RUBBER AND POLYVINYL BUTYRAL FOR STICKING TOGETHER ELECTRONIC COMPONENTS AND STRIP CONDUCTORS - Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of
| 05-14-2009 |
20090130440 | ADHESIVE STRIP THAT CAN BE ACTIVATED BY HEAT AND IS BASED ON NITRILE RUBBER AND POLYVINYL BUTYRAL FOR STICKING TOGETHER ELECTRONIC COMPONENTS AND STRIP CONDUCTORS - Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of
| 05-21-2009 |
20090163660 | ADHESIVE FOR APOLAR SUBSTRATES - A pressure-sensitive adhesive which develops a high bond strength to substrates of low surface energies, even at low temperatures. The adhesive is composed of a first block copolymer A-B and a second block copolymer which is composed of at least two and not more than eleven connected subunits A-B, A being in each case a polymer block comprising vinylaromatic monomer units and B being in each case a poly(1,3-diene). The first block copolymer is present in the adhesive in a fraction of at least 50% by weight, based on the total mass of the block copolymers in the adhesive. The adhesive additionally contains tackifier resins, of which at least 30% by weight are liquid at room temperature and which are miscible with the polymer blocks B, but not with the polymer blocks A. An adhesive tape with the pressure-sensitive adhesive is also described. | 06-25-2009 |
20090260761 | HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS - Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of
| 10-22-2009 |
20090277561 | PRESSURE-SENSITIVE ADHESIVE TAPES FOR BONDING PRINTING PLATES AND METHODS OF PROVIDING THEM - The invention relates to the use of a pressure-sensitive adhesive comprising at least one resin-polymer blend of at least 50% by weight of one or more block copolymers comprising polymer blocks based on vinylaromatics and comprising polymer blocks based on 1,3-dienes and not more than 50% by weight of at least one tackifier resin for an adhesive tape for bonding flexible printing plates to printing cylinders or printing sleeves. | 11-12-2009 |
20090277562 | PRESSURE-SENSITIVE ADHESIVE TAPES FOR BONDING PRINTING PLATES - Composition for preparing a crosslinked pressure-sensitive adhesive, comprising a pressure-sensitive adhesive comprising a polymer component based on one or more monomers having at least one ethylenically unsaturated bond and for which the glass transition temperatures T | 11-12-2009 |
20090298995 | ADHESIVE FOR REVERSIBLE, UV-STABLE PSA TAPES - Adhesive for a pressure-sensitive adhesive tape, composed of
| 12-03-2009 |
20100000653 | HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS - Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150° C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1. | 01-07-2010 |
20100006223 | USE OF AN ADHESIVE SHEET WITH A CARRIER FILM PROVIDED ON ONE SIDE WITH AN ADHESIVE FOR COVERING MICROTITRE PLATES - Use of an adhesive sheet having a carrier film provided with an adhesive on one side for covering microtitre plates, the adhesive being formed from at least one acid- or acid anhydride-modified vinylaromatic block copolymer, at least one tackifier resin and at least one metal chelate. | 01-14-2010 |
20100012271 | HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS - Heat activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composition having at least an acid-modified or acid anhydride-modified vinylaromatic block copolymer, and epoxide compound and a metal chelate | 01-21-2010 |
20100065447 | SOLUTION INTENDED MORE PARTICULARLY FOR PRETREATING A HYDROPHILIC SUBSTRATE FOR THE PURPOSE OF IMPROVING AN ADHESIVE BOND UNDER HUMID AND WET CONDITIONS - Solution for pretreating a hydrophilic surface to impart water repellency, comprising a silane of the formula | 03-18-2010 |
20100068514 | METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT - The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated. | 03-18-2010 |
20100147462 | METHOD FOR BONDING FLEXIBLE PRINTED CONDUCTOR TRACKS WITH AN ADHESIVE STRIP THAT CAN BE ACTIVATED BY HEAT AND IS BASED ON CARBOXYLATED NITRILE RUBBER - Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of
| 06-17-2010 |
20100252192 | ADHESIVE SHEET FOR SEALING VESSELS AND CHANNELS, PRODUCTION AND USE THEREOF - Adhesive sheet particularly for sealing vessels and channels in which chemical, biological or biochemical reactions are conducted, composed of a backing film coated on one side with a pressure-sensitive adhesive, characterized in that the adhesive sheet has a transmittance of at least 89% (in the wavelength range between 450 to 750 nm) and a HAZE value of not more than 3% and the surface of the pressure-sensitive adhesive has a surface roughness R | 10-07-2010 |
20110036623 | METHOD OF ENCAPSULATING AN ELECTRONIC ARRANGEMENT - The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated. | 02-17-2011 |
20110056616 | ADHESIVE TAPE AND ITS USE AS A CABLE BANDAGING TAPE - Adhesive tape intended more particularly for wrapping cables, comprising a textile backing and, coated on at least one side thereof, an adhesive comprising at least one vinylaromatic block copolymer and an at least partly hydrogenated tackifier resin. | 03-10-2011 |
20110120615 | RADIATION-CROSSLINKABLE FOAMED SELF-ADHESIVE BASED ON VINYLAROMATIC BLOCK COPOLYMERS - Self-adhesive consisting of a mixture having at least one tackifier resin, expanded polymeric microbeads and a polymer blend made up of thermoplastic and/or non-thermoplastic elastomers with at least one vinylaromatic block copolymer containing a fraction of more than 30% by weight of 1,2-linked diene in the elastomer block. | 05-26-2011 |
20110121356 | METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT - Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated. | 05-26-2011 |
20110220295 | PRESSURE-SENSITIVE ADHESIVE STRIP FOR MOISTURE-INSENSITIVE PEELABLE ADHESIVE BONDS - The invention relates to a peelable adhesive strip which is coated with a pressure-sensitive adhesive at least one side. Said adhesive strip is constituted of the following layers: a core layer having an elongation at tear of at least 300%, an external carrier layer having an elongation at tear of not more than 120% and at least some sections of which are connected to the core layer in such a manner that it becomes detached from the core layer when the same is stretched, a first adhesive layer at least some sections of which are applied to the side of the external carrier layer and which is opposite the side connected to the core layer. | 09-15-2011 |
20110226415 | Pressure-Sensitive Adhesive Mass - The present invention relates to the use of an adhesive mass at least containing an acid-anhydride-modified vinyl aromatic block copolymer, a metal chelate, and an adhesive resin for bonding optical components, particularly optical films, wherein the adhesive mass has a transmittance greater than 86% and a haze less than 5%. | 09-22-2011 |
20110315048 | Solution, in Particular for Pretreating a Hydrophilic Subsurface in Order to Improve an Adhesive Bond under Humid and Wet Conditions - The invention relates to a solution, in particular for pre-treating a hydrophilic surface for hydrophobization, comprising: I. at least one silane of the formula (1) where R | 12-29-2011 |
20120111494 | Pressure-sensitive adhesive and detachable strip formed from it - Pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling, the pressure-sensitive adhesive being composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), the fraction of liquid resin accounting for at least 40% by weight, based on the total amount of resin. Strips formed from the adhesive and the use of the strips to form redetachable bonds are also disclosed. | 05-10-2012 |
20130245178 | PRESSURE-SENSITIVE ADHESIVE MASS - A method and an adhesive bond optical components, such that a first optical component is bonded to a second optical component with the adhesive, wherein the adhesive comprises at least an acid anhydride-modified vinylaromatic block copolymer, a metal chelate, and a tackifier resin, and the adhesive has a transmittance of greater than 86% and a haze of less than 5%. | 09-19-2013 |
20130269861 | Adhesive Tape and it's Use as a Cable Bandaging Tape - Adhesive tape intended more particularly for wrapping cables, comprising a textile backing and, coated on at least one side thereof, an adhesive comprising at least one vinylaromatic block copolymer and an at least partly hydrogenated tackifier resin. | 10-17-2013 |
20140024756 | Pressure-Sensitive Adhesive for an Adhesive Tape and Use thereof in an Adhesive Tape - The invention relates to a pressure-sensitive adhesive comprising at least 70 wt. % of a mixture of (i) block copolymers comprising a mixture of block copolymers having the structure I and II A′-B′, A-B-A, (A-B) | 01-23-2014 |
20140057091 | FOAMED ADHESIVE TAPE FOR BONDING TO NON-POLAR SURFACES - An adhesive tape, with a carrier material, has an acrylate-based foam layer bearing at least one layer of pressure-sensitive adhesive. The pressure-sensitive adhesive (a) being composed of a mixture of at least two different synthetic rubbers, more particularly based on vinylaromatic block copolymers, (b) comprising a resin which is not soluble in the acrylates forming the foam layer, and (c) being chemically uncrosslinked. | 02-27-2014 |
20140315016 | ADHESIVE SUBSTANCE, IN PARTICULAR FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY - An adhesive and method for encapsulating an electronic arrangement with respect to permeants, wherein the adhesive and method have (a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which, considered as hypothetical homopolymer, has a softening temperature of greater than 40° C., (b) at least one kind of an at least partly hydrogenated tackifier resin, (c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40° C., preferably less than 20° C., and (d) at least one kind of a photoinitiator for initiating cationic curing | 10-23-2014 |
20140322526 | Adhesive Substance, in Particular for Encapsulating an Electronic Assembly - The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which, when regarded as a hypothetical homopolymer, has a softening temperature greater than 40° C.; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one acrylate- or methacrylate-based type of reactive resin with a softening temperature less than 40° C., preferably less than 20° C.; and (d) at least one type of photoinitiator for initiating radical curing. | 10-30-2014 |
20140371376 | Adhesive Paste with Increased Temperature Stability and Use Thereof for an Adhesive Tape - The invention relates to an adhesive paste containing at least • a vinyl aromatic block copolymer • at least one adhesive resin • a second copolymer based on a vinyl aromatic and on an unsaturated anhydride, wherein the vinyl aromatic content is preferably at least 50 mol %. | 12-18-2014 |
20150037559 | PRESSURE-SENSITIVE ADHESIVE - Pressure-sensitive adhesive having high bond strengths to polar substrates as well as to non-polar substrates, comprising:
| 02-05-2015 |
20150064462 | TEMPERATURE-STABLE CROSS-LINKABLE ADHESIVE COMPOUND WITH HARD AND SOFT BLOCKS - Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B) | 03-05-2015 |
20150079389 | CROSS-LINKABLE ADHESIVE COMPOUND WITH HARD AND SOFT BLOCKS AS A PERMEANT BARRIER - Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B) | 03-19-2015 |