Patent application number | Description | Published |
20080231352 | Adjusting PLL/analog supply to track CPU core supply through a voltage regulator - A processing device includes a Phase Locked Loop (PLL) system with an adjustable power supply designed to track the power supply provided to one or more of the cores in the processor device. The PLL no longer operates at a fixed voltage level that is held constant and independent from the requested core frequency or the core digital voltage, but rather the power supply to the phase locked loop is adjusted along with the main power supply to the processor core. | 09-25-2008 |
20130300475 | LOW POWER, JITTER AND LATENCY CLOCKING WITH COMMON REFERENCE CLOCK SIGNALS FOR ON-PACKAGE INPUT/OUTPUT INTERFACES - Low power, jitter and latency clocking with common reference clock signals for on-package input/output interfaces. A filter phase locked loop circuit in a master device on a first die provides a clock signal having a frequency of 2F. A local phase locked loop circuit in the master device on the first die is coupled with the filter phase locked loop to provide a clock signal to functional components of the master device through a local clock divider circuit to provide a clock signal of F to the functional components. A remote phase locked loop circuit in a slave device on a second die is coupled with the filter phase locked loop to provide a clock signal to one or more functional components of the slave device through a local clock divider circuit to provide a clock signal of F to the functional components. | 11-14-2013 |
20130318266 | ON-PACKAGE INPUT/OUTPUT ARCHITECTURE - An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched. | 11-28-2013 |
20130322556 | ON-PACKAGE INPUT/OUTPUT CLUSTERED INTERFACE HAVING FULL AND HALF-DUPLEX MODES - An apparatus and system for controlling traffic on an on-chip network. Embodiments of the apparatus comprise single-ended transmission circuitry and single-ended receiving circuitry on a first chip for coupling with a second chip, the transmission circuitry having impedance matching and lacking equalization, the receiving circuitry lacking equalization, the transmission circuitry and the receiving circuitry having statically configurable features and organized in clusters, wherein the clusters have the same physical layer circuitry design for different configurations of the configurable features, the configurable features including half-duplex mode and full-duplex mode, wherein the first chip and the second chip are on the same package, and wherein a plurality of conductive lines for coupling the first chip with the second chip are matched. | 12-05-2013 |
20140009195 | MECHANISMS FOR CLOCK GATING - Mechanisms for clock gating. A clock generation circuit provides a clock signal over a clock signal distribution network within an integrated circuit package. Gating elements within the clock signal distribution network disable the clock signal to one or more portions of the clock signal distribution network. A digital locked loop (DLL) maintains settings without tracking when the clock signal is disabled. | 01-09-2014 |
20140089549 | NON-LINEAR TERMINATION FOR AN ON-PACKAGE INPUT/OUTPUT ARCHITECTURE - An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched. | 03-27-2014 |
20140201405 | INTERCONNECTION OF MULTIPLE CHIPS IN A PACKAGE UTILIZING ON-PACKAGE INPUT/OUTPUT INTERFACES - An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched. | 07-17-2014 |
20140204490 | DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR AN ON-PACKAGE INPUT/OUTPUT ARCHITECTURE - An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched. | 07-24-2014 |