Patent application number | Description | Published |
20100114849 | Allocating Priorities to Prevent Deadlocks in a Storage System - One embodiment is a server in a cluster storage system. The server includes a Global Lock Manager (GLM) that receives requests for lock priorities for transactions from local lock manager (LLMs) in the cluster storage system. The GLM prevents deadlocks in the cluster storage system by issuing groups of priorities for transactions to the LLMs. | 05-06-2010 |
20100115009 | Managing Counters in a Distributed File System - One embodiment is a method that divides a cluster file system into multiple segments with each segment including one or more local counters. The method then checks for inconsistencies and corrects discovered inconsistencies in each of the local counters while the file system remains online and available for use. | 05-06-2010 |
20100125583 | Tracking Memory Space in a Storage System - One embodiment is a method that uses a hierarchical bitmap tree in a storage system to store where available and unavailable memory space exists. Bitmap blocks are retrieved from the hierarchical bitmap tree to locate the available memory space. | 05-20-2010 |
20140281228 | System and Method for an Accelerator Cache Based on Memory Availability and Usage - The storage processor of a data storage system such as a storage array automatically configures one or more accelerator caches (“AC”) upon detecting the presence of one or more solid-state storage devices (e.g., SSD drives) installed in the data storage system, such as when a storage device is plugged into a designated slot of the data storage system, without requiring any user configuration of the AC or specification by the user of the type(s) of data to be cached in the AC. The AC therefore provides a zero configuration cache that can be used to cache any of various types of data in the data storage system. The AC cache can be used in any of a wide variety of data storage systems including, without limitation, file servers, storage arrays, computers, etc. Multiple ACs may be created to cache different types of data. | 09-18-2014 |
Patent application number | Description | Published |
20080276543 | Alkaline barrier polishing slurry - The aqueous slurry is useful for chemical mechanical polishing a semiconductor substrate having a tantalum-containing barrier layer and copper interconnects. The slurry includes by weight percent, 0 to 5 oxidizing agent, 0.1 to 25 silica particles, 0.001 to 3 polyvinyl pyrrolidone, 0.02 to 5 weight percent imine barrier removal agent selected from at least one of formamidine, formamidine salts, formamidine derivatives, guanidine, guanidine derivatives, guanidine salts and a mixture thereof, 0.02 to 5 weight percent carbonate, 0.01 to 10 inhibitor for decreasing static etch of the copper interconnects, 0.001 to 10 complexing agent and balance water; and the aqueous slurry having a pH of 9 to 11. | 11-13-2008 |
20090215265 | Low-stain polishing composition - The invention is an aqueous composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a copper interconnect metal. The aqueous composition includes an oxidizer, an inhibitor for the copper interconnect metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 complexing agent for the copper interconnect metal, 0 to 15 weight percent phosphorus compound, 0.05 to 20 weight percent of an acid compound that is capable of complexing copper ions, and water; and the solution has an acidic pH. | 08-27-2009 |
20090215266 | Polishing Copper-Containing patterned wafers - An aspect of the invention provides a method for polishing a patterned semiconductor wafer containing a copper interconnect metal with a polishing pad. The method includes the following: a) providing an aqueous polishing solution, the polishing solution containing an benzotriazole (BTA) inhibitor and a copper complexing compound and water; b) polishing the patterned wafer with the aqueous polishing solution and the polishing pad in a manner that dissolves copper into Cu | 08-27-2009 |
20100029079 | Chemical mechanical polishing composition and methods relating thereto - A chemical mechanical polishing composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The chemical mechanical polishing composition comprises an inhibitor for the nonferrous metal; a copolymer of poly(ethylene glycol)methyl ether (meth)acrylate and 1-vinylimidazole; and water. | 02-04-2010 |
20130217230 | Chemical Mechanical Polishing Composition And Methods Relating Thereto - A method for chemical mechanical polishing of a semiconductor wafer containing a nonferrous metal is provided, comprising: providing a chemical mechanical polishing composition comprising 1 to 25 wt % of an oxidizer; 0.01 to 15 wt % of an inhibitor for the nonferrous metal; 0.005 to 5 wt % of a copolymer of poly(ethylene glycol) methyl ether(meth)acrylate and 1-vinylimidazole; and water; wherein the chemical mechanical polishing composition has an acidic pH; providing a chemical mechanical polishing pad; providing a semiconductor wafer containing the nonferrous metal; creating dynamic contact between the chemical mechanical polishing pad and the semiconductor wafer; and, dispensing the polishing solution at or near the interface between the chemical mechanical polishing pad and the semiconductor wafer. | 08-22-2013 |
Patent application number | Description | Published |
20100102115 | METHOD AND SYSTEM FOR MASS PRODUCTION OF VARIABLE SHAPED PRODUCTS - A computerized system, method, and computer-readable media implementing a method for mass producing variable shaped printed products is presented. A set of cutlines defining a shape for the ordered item is associated with each ordered item. A ganging system selects a plurality of ordered items to be simultaneously produced. Individual cutter-ready outline files corresponding to the associated set of outlines for each of the items selected for production are rendered and inserted into a gang template to generate an aggregated cutlines gang file. The gang file and at least one sheet of substrate are submitted to a cutting system. The cutting system cuts the individual finished products from the substrate sheet(s). | 04-29-2010 |
20100104172 | METHOD AND SYSTEM FOR CALCULATING WEIGHT OF VARIABLE SHAPE PRODUCT MANUFACTURED FROM PRODUCT BLANK - A computerized system, method, and computer-readable media implementing a method for determining a weight of a product, and optionally its shipping weight and postage are described. A product having a variable shape in two dimensions wherein the shape is defined in the two dimensions by a set of cutlines is manufactured from a product blank of known weight. The weight of the product is determined from the number of pixels in a scaled image of the cutlines, the image having the same aspect ratio as the product blank. The weight of the product blank and the ratio of the pixels corresponding to product surface area relative to the total number of pixels in the image are used to calculated the actual weight of the product. | 04-29-2010 |
20100162098 | METHOD AND SYSTEM FOR DISPLAYING VARIABLE SHAPED PRODUCTS ON A COMPUTER DISPLAY - A computerized system, method, and computer-readable media implementing a method for defining a variable shaped document for web viewing is presented. Markup language descriptions are defined for cutlines defining a shape of an item to be produced, and for content to be displayed on the item within the boundaries of the cutlines. Markup language rules area defined that prevent display of content in areas on a display screen outside the defined shape of the item to be produced. | 06-24-2010 |
20130016894 | METHOD AND SYSTEM FOR CALCULATING WEIGHT OF VARIABLE SHAPE PRODUCT MANUFACTURED FROM PRODUCT BLANK - A computerized system, method, and computer-readable media implementing a method for determining a weight of a product, and optionally its shipping weight and postage are described. A product having a variable shape in two dimensions wherein the shape is defined in the two dimensions by a set of cutlines is manufactured from a product blank of known weight. The weight of the product is determined from the number of pixels in a scaled image of the cutlines, the image having the same aspect ratio as the product blank. The weight of the product blank and the ratio of the pixels to corresponding to product surface area relative to the total number of pixels in the image are used to calculated the actual weight of the product. | 01-17-2013 |