Patent application number | Description | Published |
20100259837 | LENS DRIVER UNIT, IMAGING DEVICE, AND HAND-HELD DATA TERMINAL DEVICE - A lens driver unit includes a plurality of lens groups including a first lens group and a second lens group, a first lens frame with first and second engaging portions, a second lens frame with a third engaging portion to engage with the first engaging portion, a lens barrel, a first guide element, a second guide element, at least one third guide element, an engaging element, and a drive unit. In an imaging position in which all of the lens groups including the first and second lens groups are placed on an optical axis, the first lens frame is integrally moved with the second lens frame along the optical axis by engagement of the first and third engaging portions while in a contained position, the first lens frame is rotated in a predetermined direction to retreat the first lens group outside an inner diameter of the lens barrel. | 10-14-2010 |
20110194194 | LENS BARREL AND IMAGING DEVICE AND HAND-HELD DATA TERMINAL DEVICE INCLUDING THE SAME - A lens barrel includes a plurality of lens groups including first and second lens groups positioned closer to an imaging plane than the first lens group, a plurality of lens group frames including first and second lens group frames holding the first and second lens groups, respectively, a rotary cylinder to engage with the first lens group frame via a cam groove, surround the first lens group frame and be rotated around an optical axis to move the first lens group in the optical axis direction, a rotation transmission system to transmit a rotary force of the rotary cylinder, and a second frame driver provided inside of the first lens group frame and engaging with the second lens group frame via a cam groove to move the second lens group in the optical axis direction by the rotary force of the rotary cylinder transmitted via the rotation transmission system. | 08-11-2011 |
20120063014 | LENS BARREL - A lens barrel includes a lens group including a fixed lens including one or more lenses and an adjustment lens including one or more lenses, and a lens frame to hold the lens group, including an adjustment lens frame to hold the adjustment lens and an aligning mechanism to hold the adjustment lens frame movably in a direction orthogonal to an optical axis of the lens group relative to the lens frame. | 03-15-2012 |
20120105712 | LENS BARREL - A lens barrel includes a lens group having at least two lenses, a lens holding frame configured to hold the lens group, a holding cylinder configured to hold the lens holding frame movably in an optical axis direction of the lens group, a forward-backward moving mechanism configured to move the lens holding frame forward and backward with respect to the holding cylinder, first to third guide shafts fixed on the holding cylinder so as to surround the lens holding frame and each extend in the optical axis direction, and a biasing mechanism configured to be held by the lens holding frame between the first guide shaft and the lens holding frame and bias the lens holding frame in a direction so as to separate the lens holding frame from the first guide shaft toward the second and third guide shafts on a plane orthogonal to the optical axis direction. | 05-03-2012 |
Patent application number | Description | Published |
20080237784 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device formed in a semiconductor substrate wherein the semiconductor substrate has a trench for isolating elements from each other, the trench has unevenness at the bottom thereof, and an insulator is buried in the trench. | 10-02-2008 |
20080237812 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes the steps of forming a trench on a semiconductor substrate to define a first and a second element regions; burying a first oxide film in the trench; forming a second oxide film on surfaces of the first and second element regions; performing a first ion doping using a first mask which is exposing a first region containing the first element region and a part of the first oxide; performing a second ion doping using a second mask which is exposing a second region containing the second element region and a part of the first oxide film; and removing the second oxide film formed in the first element region and the second element region by etching, and the first oxide film is selectively thinned using the first or second mask after performing the first or second ion doping. | 10-02-2008 |
20080241973 | METHOD OF CORRECTING A MASK PATTERN AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - The method of manufacturing a semiconductor device has deciding an amount of a correction of a mask pattern for a size of an active region of a semiconductor substrate, correcting the mask pattern on the basis of the decided amount of the correction, and exposing a resist film by using an exposure mask having the corrected mask pattern. | 10-02-2008 |
20090197355 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM - A method for manufacturing a semiconductor device that controls the influence of a thickness of a stopper film even if there is a change in the thickness of the stopper film by measuring the thickness prior to etching to a predetermined thickness. | 08-06-2009 |
20090317956 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes forming a silicon substrate having first and second surfaces, the silicon substrate including no oxide film or an oxide film having a thickness no greater than 100 nm, forming a first oxide film at least on the second surface of the silicon substrate, forming a first film by covering at least the first surface, forming a mask pattern on the first surface by patterning the first film, forming a device separating region on the first surface by using the mask pattern as a mask, forming a gate insulating film on the first surface, forming a gate electrode on the first surface via the gate insulating film, forming a source and a drain one on each side of the gate electrode, and forming a wiring layer on the silicon substrate while maintaining the first oxide film on the second surface. | 12-24-2009 |
20100144117 | Semiconductor device having device characteristics improved by straining surface of active region and its manufacture method - A trench is formed in a surface layer of a semiconductor substrate, the trench surrounding an active region. A lower insulating film made of insulating material is deposited over the semiconductor device, the lower insulating film filling a lower region of the trench and leaving an empty space in an upper region. An upper insulating film made of insulating material having therein a tensile stress is deposited on the lower insulating film, the upper insulating film filling the empty space left in the upper space. The upper insulating film and the lower insulating film deposited over the semiconductor substrate other than in the trench are removed. | 06-10-2010 |
20120001265 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WHICH A PLURALITY OF TYPES OF TRANSISTORS ARE MOUNTED - A method of manufacturing a semiconductor device includes the steps of forming a trench on a semiconductor substrate to define a first and a second element regions; burying a first oxide film in the trench; forming a second oxide film on surfaces of the first and second element regions; performing a first ion doping using a first mask which is exposing a first region containing the first element region and a part of the first oxide; performing a second ion doping using a second mask which is exposing a second region containing the second element region and a part of the first oxide film; and removing the second oxide film formed in the first element region and the second element region by etching, and the first oxide film is selectively thinned using the first or second mask after performing the first or second ion doping. | 01-05-2012 |
20120009752 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes forming a silicon substrate having first and second surfaces, the silicon substrate including no oxide film or an oxide film having a thickness no greater than 100 nm, forming a first oxide film at least on the second surface of the silicon substrate, forming a first film by covering at least the first surface, forming a mask pattern on the first surface by patterning the first film, forming a device separating region on the first surface by using the mask pattern as a mask, forming a gate insulating film on the first surface, forming a gate electrode on the first surface via the gate insulating film, forming a source and a drain one on each side of the gate electrode, and forming a wiring layer on the silicon substrate while maintaining the first oxide film on the second surface. | 01-12-2012 |
Patent application number | Description | Published |
20130244405 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device disclosed herein includes: mounting a substrate on an electrostatic chuck placed inside a chamber, the electrostatic chuck having a first temperature and the substrate being retained in advance in an atmosphere having a second temperature lower than the first temperature; fixing the substrate onto the electrostatic chuck by applying a voltage to the electrostatic chuck; heating the electrostatic chuck to a third temperature higher than the first temperature and the second temperature after mounting the substrate; and processing the substrate after the heating. | 09-19-2013 |
20140051222 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes forming a first insulating film above a semiconductor substrate, patterning the first insulating film to form a first and a second opening, forming a first sidewall film on side walls of the first and the second openings, etching the semiconductor substrate with the first insulating film and the first sidewall film as a mask to dig down the first opening and the second opening, removing the first sidewall film to form a first offset portion in the first opening and a second offset portion in the second opening, the first and the second offset portion including a part of a surface of the semiconductor substrate, and etching a bottom of the first opening with the first insulating film as a mask. | 02-20-2014 |
20140057421 | SEMICONDUCTOR DEVICE PRODUCTION METHOD - A semiconductor device production method includes: forming a protection film on a semiconductor substrate; forming a first resist pattern on the protection film; implanting a first impurity ion into the semiconductor substrate using the first resist pattern as a mask; removing the first resist pattern; forming on the surface of the semiconductor substrate a chemical reaction layer that takes in surface atoms from the semiconductor substrate through chemical reaction, after the removing of the first resist pattern; removing the chemical reaction layer formed on the semiconductor substrate and removing the surface of the semiconductor substrate, after the forming of the chemical reaction layer; and growing a semiconductor layer epitaxially on the surface of the semiconductor substrate, after the removing of the surface of the semiconductor substrate. | 02-27-2014 |
20140138769 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD - A semiconductor device includes a semiconductor substrate including a well having a first conductivity type defined by a device isolation region, a gate insulating film formed on the semiconductor substrate, a gate electrode formed on the gate insulating film and including a first side surface and a second side surface facing the first side surface, and a first side wall insulating film formed on the first side surface and a second side wall insulating film formed on the second side surface. | 05-22-2014 |
Patent application number | Description | Published |
20110194397 | OPTICAL PICKUP DEVICE - An optical pickup device has a DVD/CD laser diode for emitting a DVD/CD laser beam as linear polarized light, and a BD laser diode for emitting a BD laser beam. The optical pickup device has a dichroic mirror that regularly reflects a part of the DVD/CD laser beam, transmits a part of the DVD/CD laser beam, and transmits return light of the BD laser beam. The dichroic mirror is formed so that a product of reflectance of outward light of the DVD/CD laser beam and transmittance of return light of the DVD/CD laser beam becomes 20% or more to 25% or less. A light receiving element receives the return light of the DVD/CD laser beam transmitted through the dichroic mirror or the return light of the BD laser beam transmitted through the dichroic mirror. | 08-11-2011 |
20110242960 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE - A light emitting device includes a base, a light-emitting module, and a shielding case. The light-emitting module is fixed to the base via a curved flexible printed-circuit. The shielding case fixed to the base in such a manner that the light-emitting module is held in a position to resist a restoring force of the flexible printed-circuit which is generated by the curve of the flexible printed-circuit. The light-emitting module includes a heat source, and the shielding case includes a projection. The projection controls movement of the light-emitting module in a direction perpendicular to the direction in which the light-emitting module is held by the shielding case. The projection and the light-emitting module are bonded to each other with silicone. | 10-06-2011 |
20120020095 | ELECTRONIC DEVICE - In an electronic device including a temperature sensor and an electronic component which is a heat generation source, the temperature is measured while the influence of heat from the electronic component is reduced. The electronic device includes: a base formed of a resin material; a board which is disposed at one side of the base, and includes an electronic component and a temperature sensor; and a heat sink which is disposed at the other side of the base for dissipating heat generated by the electronic component. The heat sink includes an extension part extending from the other side of the base toward a position of the board at which the electronic component is provided. | 01-26-2012 |
20120182852 | OBJECTIVE LENS, OPTICAL HEAD, OPTICAL DISK APPARATUS, AND INFORMATION PROCESSING APPARATUS - An objective lens, an optical head, an optical disk apparatus and an information processing apparatus which can suppress deterioration of a focal spot caused by a drop in the diffraction efficiency are provided. An inner circumference area ( | 07-19-2012 |
20120240136 | OPTICAL PICKUP AND DRIVE APPARATUS - An optical pickup includes a lens holder; an objective lens provided on the lens holder and having an effective region for collecting light from a light source and an edge located outer to the effective region; and a lens protector provided on the lens holder. The lens protector protrudes toward an optical disc more than the objective lens. The edge of the objective lens includes a convexed portion protruding toward the optical disc. An apex of the effective region of the objective lens protrudes toward the optical disc more than the convexed portion of the edge. A straight line connecting a part of the edge of the objective lens and a part of the lens protector is closer to the optical disc than the apex of the effective region of the objective lens. | 09-20-2012 |
20130064057 | OBJECTIVE LENS, OPTICAL HEAD, OPTICAL DISK DEVICE, AND INFORMATION PROCESSING DEVICE - A disclosed objective lens includes: a lens having an entrance surface and an emission surface; and an anti-reflection coat formed on the emission surface, wherein a transmittance T | 03-14-2013 |
20140078877 | DETECTION LENS, LENS UNIT, OPTICAL PICKUP DEVICE, OPTICAL DISC DEVICE, COMPUTER, OPTICAL DISC PLAYER AND OPTICAL DISC RECORDER - The present application discloses detection lens provided with lens portion and flange portion including first surface connected to lens portion and second surface opposite to first surface. Flange portion includes base along optical axis of lens portion, and first to fourth projections projecting from base. First and second projections are point-symmetric around optical axis. Third and fourth projections are point-symmetric around optical axis. Flange portion excludes projection extending beyond second surface. First projection includes first intersecting surface which intersects with first axis. Second projection includes second intersecting surface which intersects with first axis. Third projection includes third intersecting surface which intersects with second axis. Fourth projection includes fourth intersecting surface which intersects with second axis. First distance between first and second intersecting surfaces is longer than second distance between third and fourth intersecting surfaces. | 03-20-2014 |
Patent application number | Description | Published |
20110112509 | MICRONEEDLE DEVICE, AND METHOD FOR ENHANCING THE EFFICACY OF INFLUENZA VACCINE BY USING MICRONEEDLE DEVICE - The present invention provides a method for enhancing the immunogenicity using a microneedle device capable of enhancing the immunogenicity of an influenza vaccine. According to the method for enhancing the immunogenicity using the present microneedle device, a microneedle device having microneedles made of polylactic acid, coated with an influenza vaccine composed of an antigen having type A strain (H1N1), type A strain (H3N2), and type B strain as active ingredients is brought into direct contact with the skin so as to transcutaneously administer the aforementioned influenza vaccine. After the transcutaneous administration, lauryl alcohol is applied to the site of the skin where the microneedle device has been brought into direct contact. | 05-12-2011 |
20120130306 | MICRONEEDLE DEVICE - Provided is a microneedle device where a coating agent has been applied to microneedles having a biodegradable resin. It has been found that the application of the coating agent to microneedles of a biodegradable resin having a predetermined strength allows the microneedles to have excellent performance. Further, with regard to the coating agent, a predetermined type and amount thereof are also useful to demonstrate performance. Accordingly, when a microneedle device | 05-24-2012 |
20120136312 | MICRONEEDLE ARRAY - Relations between crystallinity and performance of a biodegradable resin, between weight-average molecular weight and strength thereof, and between weight-average molecular weight and performance thereof were clarified. As a result thereof, when a microneedle array was provided with microneedles containing noncrystalline polylactic acid which had a weight-average molecular weight of 40,000 to 100,000, it was possible to obtain a microneedle array which could maintain its functional performance. | 05-31-2012 |
Patent application number | Description | Published |
20110057035 | SELF CHECKOUT TERMINAL AND CONTROL METHOD OF THE SAME - According to one embodiment, a self checkout terminal includes a reading section, a main display, a ticker display and a controller. The reading section reads identification information of a commodity from the commodity. The main display displays information relating to the commodity whose identification information is read by the reading section to an operator. The ticker display displays information in the same direction as the main display and is provided at a position closer to the reading section than the main display. The controller controls the ticker display and causes arbitrary information to be selectively displayed. | 03-10-2011 |
20110057036 | RECEIVING AND DISPENSING UNIT AND SELF-CHECKOUT SYSTEM - A receiving and dispensing unit and a self-checkout system of an embodiment includes a coin receiving and dispensing device which holds received coins in accordance with the denomination and dispenses the held coins, and a bill receiving and dispensing device which holds received bills in accordance with the denomination and dispenses the held bills. The bill receiving and dispensing device is arranged to overlap the coin receiving and dispensing device in the height direction of the coin receiving and dispensing device. | 03-10-2011 |
20110114727 | BAG SUPPORTING TABLE AND APPARATUS WITH BAG SUPPORTING TABLE - According to one embodiment, a bag supporting table includes a pair of hooking sections configured to support a shopping bag and an auxiliary-bag supporting section. The shopping bag has a pair of grips. The pair of hooking sections are spaced apart from and opposed to each other. The pair of hooking sections respectively hook the grips of the shopping bag and support the shopping bag. The auxiliary-bag supporting section is arranged on the outer side of an arrangement area for the shopping bag supported by the pair of hooking sections. | 05-19-2011 |
20110147454 | SELF-CHECKOUT TERMINAL AND CONTROL METHOD THEREFOR - According to one embodiment, a self-checkout terminal includes a reading unit and a light emitting unit. The reading unit reads commodity information from a commodity held over a reading position. The light emitting unit emits light in a first color to illuminate the reading position and emits light in a second color in response to the reading of the commodity information by the reading unit. | 06-23-2011 |
20110192900 | READING APPARATUS - A reading apparatus according to an embodiment includes a placing part, a scanner, and a scanner holding part. The placing part has a placing surface on which an article is placed at the upper surface thereof. The scanner has a front wall provided with a reading window. The scanner reads article identification information positioned at a reading region in front of the reading window. The scanner holding part disposes the scanner above the placing surface. The reading apparatus has a space between the scanner and the placing part. The reading apparatus allows the article to be displaced on the placing part corresponding to a part below the scanner. | 08-11-2011 |