Tanikella, US
Anand Tanikella, Northborough, MA US
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20140094094 | Modified Microgrinding Process - A method of forming a substrate is performed by grinding a substrate using abrasives so that both major surfaces of the substrate achieve desired flatness, smoothness, or both. In an embodiment, a coarser abrasive is used to grind one major surface, while a finer abrasive is simultaneously used to grind the other major surface. A single grinding step can used to produce a substrate having opposing surfaces of different surface roughnesses. This may help to eliminate a typical second downstream fine polishing step used in the prior art. Embodiments can be used with a wide variety of substrates, including sapphire, silicon carbide and gallium nitride single crystal structures grown by various techniques. | 04-03-2014 |
Brahmanandam V. Tanikella, Northborough, MA US
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20140335308 | SAPPHIRE SUBSTRATE - A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 μm/cm | 11-13-2014 |
Brahmanandam V. Tanikella, Northboro, MA US
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20080318496 | METHODS OF CRYSTALLOGRAPHICALLY REORIENTING SINGLE CRYSTAL BODIES - A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and calculating a misorientation angle between a select crystallographic direction of the single crystal body and a projection of the crystallographic direction along a plane of a first exterior major surface of the single crystal body. The method further includes removing material from at least a portion of the first exterior major surface to change the misorientation angle. | 12-25-2008 |
20120289126 | SAPPHIRE SUBSTRATES AND METHODS OF MAKING SAME - A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 μm/cm | 11-15-2012 |
20140234568 | SAPPHIRE SUBSTRATE - A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 μm/cm | 08-21-2014 |
Rajanikanth Tanikella, Princeton, NJ US
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20080275687 | Integration of fast feedback into systems configuration - A configuration operation set for configuring a system element is tested by simulating execution of the control operation set with simulation sample test data. The configuration operation set is received via a configuration user interface in a configuration view. Simulation sample test data is received via a simulation user interface in a simulation view. The configuration view and the simulation view may be simultaneously viewed on a display. In a single session, a control operation set may be received, simulation sample test data may be received, a simulation may be run, and the results of the simulation may be viewed. If the results of the simulation agree with expected results, the control operation set may be saved, and executed in the system element of interest. If the results of the simulation do not agree with the expected results, the control operation set may be cancelled. | 11-06-2008 |
20100241905 | System and Method for Detecting Security Intrusions and Soft Faults Using Performance Signatures - A method for detecting security intrusions and soft faults in a software system includes receiving a multi-dimensional performance signature built from operating system metrics sampled by a software system monitoring infrastructure, associating a plurality of buckets with each component of the performance signature, comparing a component of the sampled performance signature to an expected value for the performance signature component, where a bucket for the performance signature component is incremented if the sampled performance signature component exceeds the corresponding expected value, and the bucket for the performance signature component is decremented if the sampled performance signature component is less than the corresponding expected value, executing a security alert notification when the bucket for the performance signature component exceeds a first threshold, and executing a soft-fault notification when the bucket for the performance signature component exceeds a second threshold, where the first threshold is less than the second threshold. | 09-23-2010 |
Ravi Tanikella, Phoenix, AZ US
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20090108455 | INTEGRATED CIRCUIT AND PROCESS FOR FABRICATING THEREOF - A process for fabricating an Integrated Circuit (IC) and the IC formed thereby is disclosed. The process comprises providing a substrate. The process further comprises forming a plurality of longitudinal trenches in the substrate and depositing a layer of a first conductive material on at least one longitudinal trench of the plurality of longitudinal trenches. A first layer of a second conductive material is deposited on the layer of the first conductive material. Thereafter, the process includes depositing a second layer of the second conductive material on the first layer of the second conductive material. The second layer of the second conductive material at least partially fills the at least one longitudinal trench. The first conductive material is selected such that a reduction potential of the first conductive material is less than a reduction potential of the second conductive material. | 04-30-2009 |
20110298135 | INTEGRATED CIRCUIT AND PROCESS FOR FABRICATING THEREOF - A process for fabricating an Integrated Circuit (IC) and the IC formed thereby is disclosed. The process comprises providing a substrate. The process further comprises forming a plurality of longitudinal trenches in the substrate and depositing a layer of a first conductive material on at least one longitudinal trench of the plurality of longitudinal trenches. A first layer of a second conductive material is deposited on the layer of the first conductive material. Thereafter, the process includes depositing a second layer of the second conductive material on the first layer of the second conductive material. The second layer of the second conductive material at least partially fills the at least one longitudinal trench. The first conductive material is selected such that a reduction potential of the first conductive material is less than a reduction potential of the second conductive material. | 12-08-2011 |
Ravindra Tanikella, Phoneix, AZ US
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20090196000 | SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING - According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder. | 08-06-2009 |
Ravindra Tanikella, Phoenix, AZ US
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20090192241 | ALIGNED NANOTUBE BEARING COMPOSITE MATERIAL - A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core. | 07-30-2009 |
20120270008 | ALIGNED NANOTUBE BEARING COMPOSIT MATERIAL - A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core. | 10-25-2012 |
Ravindra V. Tanikella, Phoenix, AZ US
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20120181687 | MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING - Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening. | 07-19-2012 |
Ravindra V. Tanikella, Chanler, AZ US
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20140312101 | MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING - Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening. | 10-23-2014 |
Ravindra V. Tanikella, Chandler, AZ US
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20150206793 | POLYMER GRAFTING FOR ENHANCED DIELECTRIC AND INTERCONNECT MATERIAL ADHESION - A microelectronic structure may include an interconnect structure, an amine functional reactive polymer layer grafted onto the interconnect structure, and a dielectric layer on the amine functional reactive polymer layer, wherein the dielectric layer is bonded to the polymer layer with an amine bond. In one embodiment, the interconnect structure may be fabricated from a copper containing material. In a further embodiment, the dielectric layer may comprise an oxygen functional reactive dielectric layer, such as an epoxy dielectric layer. In one method of fabricating the microelectronic structure, the amine functional reactive polymer layer may be grafted onto the interconnect structure by an initiated chemical vapor deposition process. | 07-23-2015 |
Sarada Tanikella, Morrisville, NC US
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20090093971 | System and Method for Analyzing Metabolomic Data - The present invention generates a visual display of metabolomic data compiled by a database and associated processor. More particularly, the present invention provides a database for automatically receiving a three-dimensional spectrometry data set for a group of samples. The present invention also provides a processor device for manipulating the data sets to produce plots that are directly comparable to a plurality of characteristic plots corresponding to a plurality of selected metabolites. Furthermore, the processor device may generate a visual display indicating the presence of the selected metabolites across the group of samples. Thus, the present invention enables a user to analyze a series of complex data sets in a visual display that may indicate the presence of the selected metabolites across the group of samples. Furthermore, the visual display generated by embodiments of the present invention also expedites the subjective analysis of the spectrometry data sets. | 04-09-2009 |
20110307180 | SYSTEM AND METHOD FOR ANALYZING METABOLOMIC DATA - The present invention generates a visual display of metabolomic data compiled by a database and associated processor. More particularly, the present invention provides a database for automatically receiving a three-dimensional spectrometry data set for a group of samples. The present invention also provides a processor device for manipulating the data sets to produce plots that are directly comparable to a plurality of characteristic plots corresponding to a plurality of selected metabolites. Furthermore, the processor device may generate a visual display indicating the presence of the selected metabolites across the group of samples. Thus, the present invention enables a user to analyze a series of complex data sets in a visual display that may indicate the presence of the selected metabolites across the group of samples. Furthermore, the visual display generated by embodiments of the present invention also expedites the subjective analysis of the spectrometry data sets. | 12-15-2011 |
Shashi Tanikella, North Brunswick, NJ US
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20160110435 | COPYING DATASETS BETWEEN DATA INTEGRATION SYSTEMS - According to one embodiment, a method of copying a dataset associated with a first extract, transform, and load (ETL) job in a first data integration system to a second data integration system comprises copying executable code associated with the first ETL job from the first to the second system. Operating system software, integration system software, and file system structure are substantially identical between the first and second systems. The method further comprises executing the second ETL job to read the dataset from the first data integration system and write the dataset to the second data integration system. The second ETL job is associated with configuration parameters specifying storage resources in the first system associated with the dataset and destination parameters specifying storage resources in the second system. The method further comprises copying metadata generated by the second ETL job from the first to the second data integration system. | 04-21-2016 |
Srirarama Gautham Tanikella, Henrico, VA US
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20140279307 | SYSTEM AND METHOD FOR COMPREHENSIVE SALES AND SERVICE EVENT PROCESSING AND REPORTING - Example systems and methods provide comprehensive sales and service data processing and reporting. Sales and service events that take place at a front end branch of an enterprise may be input into a front end system and transmitted to a backend system where various modules then use the front end system data to generate various data and reports to determine sales incentive metrics and key performance indicators. | 09-18-2014 |
Venkata Tanikella, San Jose, CA US
Venkata S. Tanikella, San Jose, CA US
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20120254351 | Method and system for publishing digital content for passive consumption on mobile and portable devices - Web content is predominantly text and graphics oriented needing visual attention. The majority of web sites publish their content catering to such interactive consumption model. As an alternative to the interactive consumption, one can think of a minimally interactive passive mode of consumption where the user can listen to text spoken as audio. The proposed invention—is about multi-tier content adaptation and publishing architecture transforming existing content into a form amenable to minimally interactive usage and wider reach. The adaption of content would benefit both the publishers and the consumers. The invention outlines a multi-tier framework that adapts the content through various optional building blocks. The multiple tiers include, content adaption, augmentation and transformation into passive and minimally interactive audio form through a plurality of techniques. A consumer friendly content presentation enables the client to access this information in a seamless manner. | 10-04-2012 |