Takubo, Tokyo
Chiaki Takubo, Tokyo JP
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20080265443 | Semiconductor device and method of manufacturing the same - A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin. | 10-30-2008 |
20090007426 | Image forming apparatus and method of manufacturing electronic circuit using the same - An image forming apparatus comprises an exposure unit forming an electrostatic latent image on a photo conductor based on image information, a developing unit developing the electrostatic latent image by toner made of formation material of a circuitry layer, and an electrostatic transferring unit transferring a toner image on the photo conductor onto a substrate. The toner image is transferred so as to cover at least a part of a conductor layer formed on the substrate. At this time, excessive charges caused in the conductor layer accompanying the start of the transfer of the toner image are removed. Alternatively, charges of which polarity is reverse to that of the toner are added to the conductor layer. These allow the circuitry layer to be formed to have a desired pattern favorably and securely on the conductor layer. | 01-08-2009 |
20090096051 | SOLID STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME, AND SOLID STATE IMAGING MODULE - A solid state imaging device includes: an imaging device substrate with an imaging device section formed on a first major surface side thereof; a backside interconnect electrode provided on a second major surface side of the imaging device substrate and electrically connected to the imaging device section, the second major surface being on the opposite side of the first major surface; a circuit substrate provided with a circuit substrate electrode opposed to the second major surface; a connecting portion electrically connecting the backside interconnect electrode to the circuit substrate electrode; and a light shielding layer provided coplanar with the backside interconnect electrode or on the circuit substrate side of the backside interconnect electrode. | 04-16-2009 |
20100000083 | METAL-CONTAINING RESIN PARTICLE, RESIN PARTICLE, ELECTRONIC CIRCUIT SUBSTRATE, AND METHOD OF PRODUCING ELECTRONIC CIRCUIT - According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided. | 01-07-2010 |
20100025860 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - In one aspect of the present invention, a semiconductor device, may include | 02-04-2010 |
20110217795 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD - According to one embodiment, a first substrate and a second substrate are pressed from an opposite surface of a joint surface of the second substrate such that a joint surface of the first substrate and the joint surface of the second substrate are in contact with each other. The second substrate is restrained by a member to provide a gap between the joint surfaces. It is determined, based on a temporal change of a joint interface calculated based on an image imaged from the opposite surface side of the joint surface, whether joining is normally performed. | 09-08-2011 |
20140252588 | SEMICONDUCTOR MODULE - According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate. | 09-11-2014 |
20140252649 | SEMICONDUCTOR MODULE - According to one embodiment, a semiconductor module includes a substrate, which has a first surface and a second surface opposite to the first surface, a controller device and a memory device formed on the first surface, and a metal plate bonded on the second surface. The metal plate is formed at least at a portion of the second surface corresponding to the controller device so that heat generated at the controller device conducts away from the memory device. | 09-11-2014 |
Chisaki Takubo, Tokyo JP
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20130346015 | Semiconductor Physical Quantity Detecting Sensor - A semiconductor physical quantity detection sensor includes (1) a first electrostatic capacitance formed by the movable electrode, and a first fixed electrode formed in a first conductive layer shared with the movable electrode, (2) a second electrostatic capacitance that is formed by the movable electrode, and a second fixed electrode formed in a second conductive layer different in a height from a substrate surface from the movable electrode, and (3) an arithmetic circuit that calculates the physical quantity on the basis of a change in the first and second electrostatic capacitances generated when the physical quantity is applied. In this configuration, an electric signal from the first electrostatic capacitance, and an electric signal from the second electrostatic capacitance are input to the arithmetic circuit. | 12-26-2013 |
20150221845 | THERMOELECTRIC CONVERSION DEVICE - In a thermoelectric conversion device, support substrates ( | 08-06-2015 |
Hiromu Takubo, Tokyo JP
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20090058499 | GATE DRIVING CIRCUIT AND METHOD FOR DRIVING SEMICONDUCTOR DEVICE - A gate driving circuit and method can improve the tradeoff relation between the noise and the loss caused in the turn-OFF switching of semiconductor device. The gate driving circuit includes first and second series circuits. The first series circuit includes first and second MOSFETs connected in series. The gate terminal of the semiconductor device is connected to a negative potential side of the first MOSFET and a positive potential side of the second MOSFET. The emitter of the semiconductor device is connected to the negative potential side of the second MOSFET or a DC power source. The second series circuit includes a capacitor and a third MOSFET connected in series. The second series circuit is connected in parallel with the second MOSFET. The semiconductor device is turned OFF by turning ON the second and third MOSFETs and turning OFF the first MOSFET. | 03-05-2009 |
Kenichi Takubo, Tokyo JP
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20150277787 | MEMORY CONTROLLER, MEMORY SYSTEM, AND MEMORY CONTROL METHOD - The memory controller comprises a storage unit in which the Registered-System-Max-NOE is registered per logical area and a processor which registers, in the storage unit, the System-Max-NOE (the maximum value of multiple erasures respectively corresponded to multiple physical areas) at the time when allocating a spare physical area in one of the logical areas as the Registered-System-Max-NOE to be associated with the allocation destination logical area. The processor performs a wear leveling processing based on the Registered-System-Max-NOE per logical area. | 10-01-2015 |
Masashi Takubo, Tokyo JP
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20110020027 | IMAGE FORMING APPARATUS AND OPERATION ACCEPTING METHOD - A disclosed image forming apparatus accepts a selecting operation of selecting a button displayed on a touch panel and performs a process corresponding to the selected button. The image forming apparatus includes a moving region display unit displaying a region mark to be selected on the touch panel and moving the region mark as time passes and a button specifying unit specifying one or more buttons based on positional information indicating a position of the region mark and positional information indicating a pressed position of the touch panel. | 01-27-2011 |
20120195619 | IMAGE FORMING APPARATUS AND OPERATION ACCEPTING METHOD - A disclosed image forming apparatus accepts a selecting operation of selecting a button displayed on a touch panel and performs a process corresponding to the selected button. The image forming apparatus includes a moving region display unit displaying a region mark to be selected on the touch panel and moving the region mark as time passes and a button specifying unit specifying one or more buttons based on positional information indicating a position of the region mark and positional information indicating a pressed position of the touch panel. | 08-02-2012 |
Masatoshi Takubo, Tokyo JP
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20130253897 | PROCESS CONTROL SYSTEM - A process control system that controls an industrial process implemented in a plant, may include: a network provided in the plant; a first field device that is connected to the network, the first field device being configured to output one of measurement data, which is obtained by measuring a state quantity in the industrial process, and first simulation data, which simulates the state quantity; a controller that is connected to the network, the controller being configured to perform control in response to one of the measurement data and the first simulation data output from the first field device; and a simulator configured to generate the first simulation data to be output from the first field device. | 09-26-2013 |
Osamu Takubo, Tokyo JP
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20080231391 | DIELECTRIC DEVICE - A dielectric device includes a dielectric substrate and a resonator unit. The resonator unit includes first and second holes. The first hole opens on a first surface of the dielectric substrate and extends toward a second surface opposite to the first surface. A first internal conductor is provided inside the first hole. The second hole opens on a third surface of the dielectric substrate, extends toward a fourth surface opposite to the third surface, and is connected to the first hole. A second internal conductor is provided inside the second hole with one end connected to an external conductor film on the third surface and the other end connected to the first internal conductor. The first hole has a recess opposed to a junction with the second hole. The first internal conductor in the recess is opposed to the external conductor film on the fourth surface across the dielectric substrate. | 09-25-2008 |
Shunji Takubo, Tokyo JP
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20160004552 | COMPUTER SYSTEM AND CONTROL METHOD THEREFOR - The performance of a virtual machine is maintained, by migrating an appropriate target virtual machine for migration to an appropriate destination resource, in response to a load on the virtual machine. | 01-07-2016 |
Yoneharu Takubo, Tokyo JP
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20160091642 | DISPLAY DEVICE - According to one embodiment, a first substrate includes first to fourth pixel electrodes. A color filter layer includes a red filter opposed to the first pixel electrode, a green filter opposed to the second pixel electrode, a first blue filter opposed to the third pixel electrode and having a peak of transmittance at a wavelength shorter than 460 nm, and a second blue filter opposed to the fourth pixel electrode and having a peak of transmittance at a wavelength longer than 960 nm. | 03-31-2016 |
Yousuke Takubo, Tokyo JP
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20100053390 | IMAGE SENSOR AND IMAGING APPARATUS - An image sensor includes a pixel array with a plurality of pixels, wherein each of the plurality of pixels includes: a photoelectric conversion unit; and a waveguide structure in which a side face of a substance that has a higher refractive index than a refractive index of a plurality of insulation films is surrounded by the plurality of insulation films so that light is guided to the photoelectric conversion unit, and wherein an insulation film that surrounds a region where the light is concentrated of the side face of the substance has the lowest refractive index among the plurality of insulation films. | 03-04-2010 |