Patent application number | Description | Published |
20090008373 | Laser Processing Method - A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape | 01-08-2009 |
20090026185 | Laser Processing Method - A laser processing method by which an object to be processed can be cut with a high precision is provided. | 01-29-2009 |
20090081851 | Laser processing method - A laser processing method is provided, which, when cutting an object to be processed comprising a substrate and a multilayer part, formed on a front face of the substrate, including a functional device, can cut the multilayer part with a high precision in particular. | 03-26-2009 |
20090107967 | METHOD FOR CUTTING WORKPIECE - A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the substrate while having a plurality of functional devices into the functional devices along a line to cut in a short time even when the substrate is thick. A substrate | 04-30-2009 |
20090117712 | LASER PROCESSING METHOD - A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions | 05-07-2009 |
20090162994 | LASER PROCESSING METHOD - A laser processing method which can securely prevent particles from attaching to chips obtained by cutting a planar object is provided. When applying a stress to an object to be processed | 06-25-2009 |
20090166808 | LASER PROCESSING METHOD AND SEMICONDUCTOR CHIP - A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision. | 07-02-2009 |
20090212396 | Laser Beam Machining Method And Semiconductor Chip - A laser processing method is provided, which, when cutting a substrate formed with a multilayer part including a plurality of functional devices, makes it possible to cut the multilayer part with a high precision in particular. | 08-27-2009 |
20090250446 | LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - In six rows of molten processed regions | 10-08-2009 |
20100009547 | LASER WORKING METHOD - An object to be processed is restrained from warping at the time of laser processing. A modified region M | 01-14-2010 |
20100012632 | LASER PROCESSING METHOD - While six rows of molten processed regions | 01-21-2010 |
20100136766 | WORKING METHOD FOR CUTTING - An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut. The object formed with the modified region is subjected to an etching process utilizing an etching liquid exhibiting a higher etching rate for the modified region than for an unmodified region, so as to etch the modified region. This can etch the object selectively and rapidly along the line to cut by utilizing a higher etching rate in the modified region. | 06-03-2010 |
20100258539 | MACHINING INFORMATION SUPPLY EQUIPMENT AND SUPPLY SYSTEM - A processing information supply apparatus 10 is prepared for a laser processing apparatus for forming a modified region, which becomes a starting point of cutting, along a line to cut within an object to be processed by irradiating the object with laser light while locating a light-converging point within the object. The processing information supply apparatus | 10-14-2010 |
20110300691 | WORKPIECE CUTTING METHOD - Fractures ( | 12-08-2011 |
20120067857 | LASER PROCESSING METHOD - A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions | 03-22-2012 |
20120119334 | LASER MACHINING METHOD AND CHIP - While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed | 05-17-2012 |
20140015113 | Laser Processing Method and Semiconductor Device - A laser processing method which can reliably form a modified region within an object to be processed along a desirable part in a line to cut is provided. | 01-16-2014 |