Patent application number | Description | Published |
20080290977 | COMMON MODE CHOKE COIL - A common mode choke coil is provided with first and second coil conductors that are magnetically coupled to each other, a third coil conductor that is electrically connected in series to the first coil conductor and substantially not magnetically coupled to the first coil conductor, a fourth coil conductor that is electrically connected in series to the second coil conductor and substantially not magnetically coupled to the second coil conductor, a first contact conductor for connecting the third coil conductor with the inner end of the first coil conductor, and a second contact conductor for connecting the fourth coil conductor with the inner end of the second coil conductor. The third coil conductor and the fourth coil conductor are substantially not magnetically coupled, and are in a linear symmetrical relationship based on a prescribed center line. | 11-27-2008 |
20080303621 | COMMON MODE CHOKE COIL - A common mode choke coil includes two laminated coil conductors, a first magnetic substrate arranged on one of the coil conductors, and a second magnetic substrate arranged on the other coil conductor. When it is assumed that a distance from a conductor center of the one coil conductor to the surface of the first magnetic substrate is designated as A, a distance from a conductor center of the other coil conductor to the surface of the second magnetic substrate is designated as B, and a distance from the conductor center of the one coil conductor to the conductor center of the other coil conductor is designated as C, C<(A+B)/2 is satisfied. Accordingly, because a difference in the distances between the magnetic substrates and the coil conductors becomes relatively small, a leakage inductance due to the difference in the distance decreases, and the cut-off frequency with respect to a differential mode signal can be increased. | 12-11-2008 |
20090284340 | COMMON MODE FILTER - A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filter | 11-19-2009 |
20110285477 | COMMON MODE NOISE FILTER - A common mode noise filter includes: a common mode filter inserted into a pair of signal lines; and a pair of capacitively coupled coils having one ends connected respectively to the corresponding signal lines and the other ends opened. According to the present invention, common mode noise can be removed by a common mode filter, as well as, differential mode noise in a desired frequency band can be removed by a pair of coils whose other ends are opened. | 11-24-2011 |
20110291790 | COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode. | 12-01-2011 |
20120112869 | COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A coil component | 05-10-2012 |
20120133472 | ELECTRONIC COMPONENT - An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer. | 05-31-2012 |
20130314189 | COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a coil component that includes an insulating layer formed on a substrate, a coil conductor provided between the substrate and the insulting layer, a first electrode connected to one end of the coil conductor, a second electrode connected to the other end of the coil conductor, and a magnetic layer formed on the insulting layer so as to cover a side surface of each of the first and second electrodes without covering a top surface of each of the first and second electrodes. | 11-28-2013 |
20140145796 | COMMON MODE FILTER - A common mode filter | 05-29-2014 |