Patent application number | Description | Published |
20090031707 | Exhaust gas purification apparatus for internal combustion engine - In an exhaust gas purification apparatus for an internal combustion engine, a technique is provided which makes it possible to recover an exhaust gas purification ability more efficiently than ever. In the exhaust gas purification apparatus for an internal combustion engine which recovers an exhaust gas purification ability of a filter by supplying fuel to the filter that is arranged on an exhaust passage of the internal combustion engine for purifying an exhaust gas, in case where the exhaust gas purification ability of the filter is to be recovered, the supply of fuel is executed so as to make the degree of fuel atomization relatively low, as shown in (b), when the temperature of an exhaust gas flowing into the filter is in a first predetermined range, and when the temperature of the filter is in a second predetermined range, whereas the supply of fuel is executed so as to make the degree of fuel atomization relatively high, as shown in (a), when the temperature of the exhaust gas flowing into the filter is lower than a lower limit temperature of the first predetermined range, or when the temperature of the filter is higher than an upper limit temperature of the second predetermined range. | 02-05-2009 |
20090165443 | Control System for Internal Combustion Engine, and Control Method for Internal Combustion Engine - In an exhaust passage, a pressure detection means is provided on the upstream side of a filter, and an exhaust throttle valve is provided on the downstream side of the filter. And, when the operational state of the internal combustion engine is a steady operational state (in a step S | 07-02-2009 |
Patent application number | Description | Published |
20100220366 | IMAGE READING DEVICE AND IMAGE PROCESSING METHOD UTILIZING THE SAME - An image processing apparatus provided with a reader for reading an original image, a connection unit for connection with a network to which plural computers are connected, and a transfer unit for transferring the image data, read by the reader, to a computer through the connection unit, the apparatus comprising a specifying unit for specifying a desired one among the computers connected through the connection unit, and a designation unit for designating image reading by the reader, wherein the transfer unit is adapted to transfer the image data, read by the reader in response to the designation by the designation unit, to a computer specified by the specifying unit. | 09-02-2010 |
20130201530 | IMAGE READING DEVICE AND IMAGE PROCESSING METHOD UTILIZING THE SAME - There is disclosed an image processing apparatus provided with a reader for reading an original image, a connection unit for connection with a network to which plural computers are connected, and a transfer units for transferring the image data, read by the reader, to a computer through the connection unit, the apparatus comprises a specifying unit for specifying desired one among the computers connected through the connection unit, and a designation unit for designating image reading by the reader, wherein the transfer unit is adapted to transfer the image data, read by the reader in response to the designation by the designation unit, to a computer specified by the specifying unit. | 08-08-2013 |
Patent application number | Description | Published |
20090041990 | METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDERED ELECTRONIC CIRCUIT BOARD - A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, and supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder. A method for the production of a soldered electronic circuit board, includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part; supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder, and thermally fusing the attached solder powder, thereby forming a circuit. A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness to the metallic surface to form a tacky part, supplying the tacky part with a solder powder slurry suspended in a liquid, thereby inducing attachment of the solder powder and, on the occurrence of a part devoid of attachment of solder powder in the consequently formed electronic circuit board, supplying the part with a solder powder slurry, thereby inducing attachment of solder powder thereto. | 02-12-2009 |
20090056977 | PRODUCTION METHOD OF SOLDER CIRCUIT BOARD - A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area. | 03-05-2009 |
20090261148 | PRODUCTION METHOD OF SOLDER CIRCUIT BOARD - A method for producing a solder circuit board includes the steps of imparting tackiness to a surface of an electrically conductive circuit electrode on a printed-wiring board to form a tacky part, causing only one solder particle to adhere to the tacky part, and heating the printed-wiring board, thereby melting the solder particle to form a bump part which corresponds to the tacky part and to which an electronic part is to be connected and forming a solder circuit. | 10-22-2009 |
20100065615 | METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD - A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder. | 03-18-2010 |