Patent application number | Description | Published |
20080263028 | Report Search Method, Report Search System, and Reviewing Apparatus - An object of the present invention is to provide a report search method, and a reviewing apparatus by which a measure against abnormalities such as a defect of a sample may be quickly obtained by searching desired information in a report recording past information. | 10-23-2008 |
20080270044 | Defect Review Apparatus and Method of Reviewing Defects - The present invention aims to provide a defect review apparatus capable of suppressing a reduction in throughput with a minimized deviation-amount measurement, and capable of optimizing an FOV of a monitoring image. To this end, the review apparatus for reviewing a specimen by moving the specimen to pre-calculated coordinate includes: a function to measure a deviation amount between the pre-calculated coordinates and coordinates of an actual position of the specimen; a function to optimize a coordinate correcting expression to minimize the measured deviation amount; and a function to determine that the deviation amounts have converged. When the deviation amounts have converged, the measurement for the coordinate-correcting-expression optimization is terminated. Thereby, the reduction in throughput is suppressed to the minimum level, and furthermore a FOV necessary for the specimen to be within the field of view is set according to a convergence value of the calculated deviation amount. | 10-30-2008 |
20080298670 | Method and its apparatus for reviewing defects - As a result of the improvement in throughput of review SEMs, the volume of defect image data which are collected in a semiconductor mass production line becomes larger. In order to achieve efficiency in management (deletion, search, display, and the like) of the image data in response to the above circumstance, a review SEM according to the present invention is configured to judge the importance levels of defect images taken and the like from information such as the classification results of the defect images, the defect feature computed from the defect images, and the imaging states of the defect images and to provide each of the defect images with the importance level and the like as supplementary information so that a large quantity of image data is managed on the basis of the supplementary information. | 12-04-2008 |
20090030867 | REVIEWING APPARATUS, RECIPE SETTING METHOD FOR REVIEWING APPARATUS AND REVIEWING SYSTEM - A recipe setting method and reviewing apparatus which permit even a novice to analyze the contents of existing recipe settings without trial-and-error attempts in the reviewing apparatus for reviewing a sample and to create a new recipe in a short time based on the results of the analysis. By a reviewing apparatus having a function of reviewing a sample under registered review conditions, based on a recipe in which the review conditions are registered. The reviewing apparatus is configured to display a list of the contents of the settings of plural set items regarding plural recipes and to create a new recipe based on the results of analysis of commonality by using the contents of settings having high degrees of commonality as initial settings. | 01-29-2009 |
20090045335 | INSPECTION METHOD FOR SEMICONDUCTOR WAFER FOR REVIEWING DEFECTS - An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction. | 02-19-2009 |
20090121152 | INSPECTION METHOD FOR SEMICONDUCTOR WAFER AND APPARATUS FOR REVIEWING DEFECTS - An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction. | 05-14-2009 |
20090136121 | Defect review method and apparatus - A candidate-defect classification method includes the steps of acquiring a scanning electron microscope (SEM) image of a candidate defect detected in an inspection from a sample including a pattern formed thereon, the inspection being preliminarily performed by an other inspection device; computing a feature value of the candidate defect by processing the SEM image; executing defect classification of the candidate defect as any one of a pattern shape defect and an other defect by using the computed feature value; acquiring positional information contained in design data of the pattern with respect to a candidate defect classified as the pattern shape defect; and extracting a systematic defect from among candidate defects classified as the pattern shape defects by performing a comparison of the positional information contained in the design data of the acquired candidate defect to positional information of a portion that has a high probability of causing a pattern formation failure and that has been obtained from the design data of the pattern, the systematic defect being caused due to a layout shape of the pattern, properties of a processor for forming the pattern, or the like. | 05-28-2009 |
20090206259 | REVIEW METHOD AND REVIEW DEVICE - A defect review method and a defect review device using an electron microscope, reduce the number of user processes necessary to set automatic focal adjustment of an electron beam to provide easier sample observation. | 08-20-2009 |
20090222753 | DEFECT INSPECTION TOOL AND METHOD OF PARAMETER TUNING FOR DEFECT INSPECTION TOOL - Setting of a parameter of a defect inspection tool is based on trial and error in which effects are confirmed one by one and set, and the setting requires a high technique and is significantly inefficient. The present invention is to provide an inspection method and an inspection tool capable of solving such a problem and of setting the parameter (hereinafter, referred to as an inspection parameter) required for detecting the defect easily. | 09-03-2009 |
20100021047 | AUTOMATIC DEFECT REVIEW AND CLASSIFICATION SYSTEM - The invention proposes a system that interrupts a processing associated with an ADC having low priority when an ADC processing cannot catch up with ADR by an ADC alone that is not under execution but uses an ADC for an ADR having high priority. To preferentially execute ADR/ADC having high priority, the invention employs an algorithm for serially selecting ADR/ADC in the order of higher processing capacity (in the order of greater numerical values in the expression by a DPH unit) from among ADR/ADCs that have the lowest priority, no matter whether the ADR/DC is now under execution or not. | 01-28-2010 |
20100241386 | Method of Correcting Coordinates, and Defect Review Apparatus - The present invention provides a method of correcting coordinates so as to quickly and properly arrange a sample in a field of view in a review apparatus for moving a sample stage onto the specified coordinates to review the sample. A review apparatus according to the present invention, which is a review apparatus for moving a sample stage onto coordinates previously calculated by a checking apparatus to review the sample, has a function of retaining a plurality of coordinate correction tables to correct a deviation between a coordinate value previously calculated by a checking apparatus and an actual sample position detected by the review apparatus. The review apparatus evaluates correction accuracy of the plurality of coordinate correction tables and applies one of the coordinate correction tables with the maximum evaluation value. | 09-23-2010 |
20110029906 | REPORT FORMAT SETTING METHOD AND APPARATUS, AND DEFECT REVIEW SYSTEM - Generated is a template edition screen on which to display components of a report as modules by OSD by use of icons. One of the icons is selected by use of a pointing device including a mouse. By a drag-and-drop operation, the icon is placed at a desired position in an output format setup area formed in the same screen. The icon is set in a desired size by another drag-and-drop operation. Details of a module shown by the icon thus placed can be set up in a detail setup area in the same screen. Information on a format thus set up is retained as a template through a retention function, and accordingly can be used easily by simply calling the information. Moreover, the retained template can be edited as well. This makes it possible not only to create a new template, but also to modify an existing template. | 02-03-2011 |
20110062328 | Defect Review Apparatus and Method of Reviewing Defects - The present invention aims to provide a defect review apparatus capable of suppressing a reduction in throughput with a minimized deviation-amount measurement, and capable of optimizing an FOV of a monitoring image. To this end, the review apparatus for reviewing a specimen by moving the specimen to pre-calculated coordinate includes: a function to measure a deviation amount between the pre-calculated coordinates and coordinates of an actual position of the specimen; a function to optimize a coordinate correcting expression to minimize the measured deviation amount; and a function to determine that the deviation amounts have converged. When the deviation amounts have converged, the measurement for the coordinate-correcting-expression optimization is terminated. Thereby, the reduction in throughput is suppressed to the minimum level, and furthermore a FOV necessary for the specimen to be within the field of view is set according to a convergence value of the calculated deviation amount. | 03-17-2011 |
20110285839 | DEFECT OBSERVATION METHOD AND DEVICE USING SEM - An imaging region of a high-magnification reference image capable of being acquired in a low-magnification field without moving a stage from a position at which a defective region has been imaged at a low magnification is searched for and if the search is successful, an image of the imaging region itself is acquired and the high-magnification reference image is acquired. If the search is unsuccessful, the imaging scheme is switched to that in which the high-magnification reference image is acquired from a chip adjacent to the defective region. | 11-24-2011 |
20120044262 | SURFACE OBSERVATION APPARATUS AND SURFACE OBSERVATION METHOD - A surface observation apparatus is achieved, which enables even a beginner to easily select an optimal evaluation indicator for each of various patterns to be evaluated without a trial and error approach. A plurality of images to be evaluated are input from an image processing unit ( | 02-23-2012 |
20120117010 | DEVICE FOR CLASSIFYING DEFECTS AND METHOD FOR ADJUSTING CLASSIFICATION - Disclosed is a technique wherein an object that requires adjustment in order to increase the reliability of automatic classification can be easily identified. A device ( | 05-10-2012 |
20120131529 | SEMICONDUCTOR DEFECT CLASSIFYING METHOD, SEMICONDUCTOR DEFECT CLASSIFYING APPARATUS, AND SEMICONDUCTOR DEFECT CLASSIFYING PROGRAM - A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified. | 05-24-2012 |
20120257041 | METHOD FOR DEFECT INSPECTION AND APPARATUS FOR DEFECT INSPECTION - Provided is a technique for a wafer inspection conducted by simple operation, which is useful even when the inspection covers a variety of items and the inspection items are changed frequently with time like in a start-up period of a semi-conductor process. According to the technique, inspection images are collected, and then a template is prepared from the inspection images. A plurality of regions are defined on the template, and inspection methods and output indexes are registered in correspondence with the respective regions. In the inspection, by reference to the template images corresponding to the derived inspection images, the inspection is conducted based on the inspection information registered therein and the quantitative output levels are calculated. | 10-11-2012 |
20120305767 | Pattern Inspection Method, Pattern Inspection Program, and Electronic Device Inspection System - It is an object of the present invention to provide a technique capable of accurately inspecting a circuit pattern in which the contrast of an observation image is not clear, like a circuit pattern having a multilayer structure. A pattern inspection method according to the present invention divides a circuit pattern using the brightness of a reflection electron image and associates the region in the reflection electron image belonging to each division with the region in a secondary electron image (see FIG. | 12-06-2012 |
20130070078 | METHOD AND DEVICE FOR TESTING DEFECT USING SEM - In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large. | 03-21-2013 |
20130077850 | METHOD FOR OPTIMIZING OBSERVED IMAGE CLASSIFICATION CRITERION AND IMAGE CLASSIFICATION APPARATUS - A first object is to use both ADC (automatic defect classification) and MDC (manual defect classification) and reduce the amount of MDC operation. A second object is to prevent a DOI (defect of interest) from being missed. | 03-28-2013 |
20130108147 | INSPECTION METHOD AND DEVICE THEREFOR | 05-02-2013 |
20130112872 | INSPECTION METHOD FOR SEMICONDUCTOR WAFER AND APPARATUS FOR REVIEWING DEFECTS - An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction. | 05-09-2013 |
20130112893 | CHARGED PARTICLE BEAM DEVICE, DEFECT OBSERVATION DEVICE, AND MANAGEMENT SERVER - Provided is a charged particle beam device that prevents the increase in processing trouble caused by deterioration in the reviewing performance (e.g., overlooking of defects) by detecting an operation abnormality affecting the performance of the device or a possibility of such an abnormality in the middle of a processing sequence of a sample and giving a feedback in real time. In each processing step of the charged particle beam device, monitoring items representing the operating status of the device (control status of the electron beam, an offset amount at the time of wafer positioning, a defect coordinate error offset amount, etc.) are monitored during the processing sequence of a sample and stored as history information. In the middle of the processing sequence, a comparative judgment between the value of each monitoring item and the past history information corresponding to the monitoring item is made according to preset judgment criteria. When the width of fluctuation from the past history information deviates from a reference range, an alert is issued. | 05-09-2013 |
20130140457 | DEFECT OBSERVATION METHOD AND DEFECT OBSERVATION DEVICE - A defect observation device supplied with a taught defect and an ideal output obtained by conducting image processing on the taught defect as its input and capable of conducting work of setting image processing parameters required to classify defect kinds easily and fast is provided. | 06-06-2013 |
20130222574 | DEFECT CLASSIFICATION SYSTEM AND DEFECT CLASSIFICATION DEVICE AND IMAGING DEVICE - In a defect classification system using plural types of observation devices that acquire images having different characteristics, classification performance and operability of the system are improved. The a defect classification system includes plural imaging part that acquire images of an inspection target, a defect classification device that classifies the acquired images acquired by the plural imaging part, and a communication part that transmits data between the plural imaging devices and the defect classification device, in which the defect classification device includes an image storage part that stores the acquired image data acquired by the plural imaging part, an information storage part that stores associated information about the input image data, and a part for changing a processing method or a display method depending on the associated information. | 08-29-2013 |
20130228685 | INSPECTION METHOD FOR SEMICONDUCTOR WAFER AND APPARATUS FOR REVIEWING DEFECTS - An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction. | 09-05-2013 |
20130235182 | DEFECT INSPECTION METHOD AND DEVICE THEREFOR - In imaging a sample using an electron microscope, in order to reduce a time for focusing, a scanning range of a Z coordinate is reduced to complete focusing by obtaining SEM images such that: for a first predetermined number of portions, focal positions of an electron beam in obtaining each SEM image are moved in a predetermined range; then, a curved surface shape of the surface of the sample is estimated by using information relating to the focal positions of the electron beam in the first predetermined number of portions; after the images are taken, the range in which the focal positions of the electron beam are moved for scanning the electron beam on the surface of the sample is made to be narrower than the predetermined range by using the curved surface information estimated, thereby performing scanning to take the images of the sample. | 09-12-2013 |
20130294680 | IMAGE CLASSIFICATION METHOD AND IMAGE CLASSIFICATION APPARATUS - In an apparatus for automatically classifying an image picked up of a defect on a semiconductor wafer according to user defined class, when images picked up by a plurality of different observation apparatuses are inputted in a mixed manner, the defect image classification accuracy rate decreases due to image property differences corresponding to differences in the observation apparatuses. In an automatic image classification apparatus supplied with defect images picked up by a plurality of observation apparatuses, when preparing a recipe, image process parameters are adjusted and a classification discriminating surface is prepared for each observation apparatus. When classifying an image, the observation apparatus that picked up a defect image is identified based on accompanying information or the like of the image, and an image process and a classification process are performed by using the image process parameters and the classification discriminating surface corresponding to the observation apparatus that picked up the image. In order to efficiently adjust the image process parameters for each observation apparatus, appropriate image process parameters are automatically adjusted on the basis of an exemplified defect area. The image process parameters adjusted in a given observation apparatus may be used for setting the image process parameters for another observation apparatus. | 11-07-2013 |
20140037188 | DEFECT REVIEW METHOD AND APPARATUS - A candidate-defect classification method, including acquiring a scanning electron microscope image of a candidate defect detected on a sample including a pattern; computing a feature value of the candidate defect by processing the image; executing defect classification of the candidate defect as a pattern shape defect or another defect, by using the computed feature value; acquiring positional information contained in design data of the pattern regarding the candidate defect; and extracting a systematic defect from candidate defects classified as pattern shape defects, by comparing the positional information contained in the design data of the acquired candidate defect to positional information of a portion having a high probability of causing pattern formation failure, and that has been obtained from the design data of the pattern, or a systematic defect caused due to a layout shape of the pattern, or properties of a processor for forming the pattern. | 02-06-2014 |