Patent application number | Description | Published |
20130005210 | MANUFACTURING METHOD OF LIGHT EMITTING DEVICES - A manufacturing method of light emitting devices, comprises a substrate-forming step of forming a planar-shaped substrate, a frame-forming step of forming a closed frame on the substrate, an element-mounting step of mounting multiple light emitting elements in an inside of the frame, a sealing step of injecting a liquid material that is to be a sealing member to the inside of the frame so as to seal the multiple light emitting elements, and a dividing step of dividing the multiple light emitting elements together with the substrate and the sealing member so as to obtain multiple light emitting devices with the sealing member exposed from a side surface thereof. | 01-03-2013 |
20130017631 | METHOD OF MANUFACTURING LIGHT-EMITTING DEVICEAANM TAKEDA; ShigeoAACI Kiyosu-shiAACO JPAAGP TAKEDA; Shigeo Kiyosu-shi JPAANM ISHIDA; MakotoAACI Kiyosu-shiAACO JPAAGP ISHIDA; Makoto Kiyosu-shi JPAANM TERAKAMI; MitsushiAACI Kiyosu-shiAACO JPAAGP TERAKAMI; Mitsushi Kiyosu-shi JPAANM YAMAMORI; ShotaAACI Kiyosu-shiAACO JPAAGP YAMAMORI; Shota Kiyosu-shi JP - A method of manufacturing a light-emitting device includes providing a plate-shaped substrate, forming a lattice frame on a light-emitting element mounting surface of the plate-shaped substrate, mounting a light-emitting device in an opening of the lattice frame on the light-emitting element mounting surface, sealing the light-emitting element by supplying a sealing material into the opening of the lattice frame, and cutting the lattice frame and the plate-shaped substrate so as to split the lattice flame to obtain a plurality of light-emitting devices with a sidewall. | 01-17-2013 |
20130049061 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes an element mounting substrate, a light-emitting element on the element mounting substrate, a case formed around the light-emitting element and having an opening on a light extraction side of the light-emitting device, and a sealing material filled in the opening of the case to seal the light-emitting element. The element mounting substrate includes an uneven portion configured to firmly attach the element mounting substrate to the case or the sealing material. | 02-28-2013 |
20130154474 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a light-emitting device includes placing a phosphor-containing film on a mold for compression molding, the mold having a concave portion of a predetermined shape and the film being placed along an inner wall of the concave portion, supplying a resin material on the phosphor-containing film in the concave portion, immersing a light-emitting element mounted on a substrate in the resin material in the concave portion, and applying pressure and heat to the resin material and the phosphor-containing film, thereby forming a transparent sealing resin for sealing the light-emitting element and a phosphor-containing layer covering a surface thereof. | 06-20-2013 |
20140084311 | LIGHT-EMITTING DEVICE - The present invention provides a light-emitting device which includes a plurality of LED chips mounted on a chip mount surface of a substrate provided with a wiring pattern. In the light-emitting device, the wiring pattern is provided so as to meet the following conditions (a), (b), and (c). (a) The wiring pattern divides the chip mount surface into at least three divided areas in a radial fashion from a center of the chip mount surface, and includes radial elements and circumferential elements so as to surround divided areas. (b) Of two radial elements and one circumferential element which surround each divided area as viewed from the individual divided area, one or two elements form part of a positive electrode pattern, and the remainder forms part of a negative electrode pattern. (c) There is only one radial element between adjoining ones of the divided areas. | 03-27-2014 |
20150036349 | LIGHT EMITTING DEVICE - A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element. | 02-05-2015 |
20150091025 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device includes a sheet-shaped die bonding material on a substrate including a wiring, and a plurality of light-emitting elements fixed onto the die bonding material. A method of manufacturing the light-emitting device includes applying the die bonding material in a paste form to the substrate such that the die bonding material is shared by the plurality of light-emitting elements, placing the plurality of light-emitting elements on the die bonding material in the paste form, and curing the die bonding material after placing the plurality of light-emitting elements so as to fix the plurality of light-emitting elements onto the bonding material. | 04-02-2015 |