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Takashi Nakayama

Takashi Nakayama, Yamato-Shi JP

Patent application numberDescriptionPublished
20110096799SEMICONDUCTOR LIGHT EMITTING ELEMENT AND TUNABLE WAVELENGTH LASER LIGHT SOURCE - The present invention provides a semiconductor light emitting element that can obtain oscillation at desired wavelengths. The semiconductor light emitting element comprises a semiconductor substrate 04-28-2011

Takashi Nakayama, Tokyo JP

Patent application numberDescriptionPublished
20090278239Silicon Wafer and Production Method Thereof - In a silicon wafer having an oxygen precipitate layer, a depth of DZ layer ranging from a wafer surface to an oxygen precipitate layer is 2 to 10 μm and an oxygen precipitate concentration of the oxygen precipitate layer is not less than 5×1011-12-2009
20100009521METHOD OF PRODUCING SEMICONDUCTOR WAFER - There is provided a production method in which the beveling step conducted for preventing the cracking or chipping in a raw wafer during the grinding can be omitted when the raw wafer cut out from a crystalline ingot is processed into a double-side mirror-finished semiconductor wafer and a semiconductor wafer can be obtained cheaply by shortening the whole of the production steps for the semiconductor wafer and decreasing the machining allowance of silicon material in the semiconductor wafer to reduce the kerf loss of the semiconductor material as compared with the conventional method.01-14-2010
20100290971SILICON WAFER AND METHOD FOR PRODUCING THE SAME - It is possible to provide a silicon wafer that as well as being free of COPs and dislocation clusters, has defects (grown-in defects including silicon oxides), which are not overt in an as-grown state, such as OSF nuclei and oxygen precipitate nuclei existing in the PV region, to be vanished or reduced, by adopting a method for producing a silicon wafer, the method comprising the steps of: growing a single crystal silicon ingot by the Czochralski method; cutting a silicon wafer out of the ingot; subjecting the wafer to an RTP at 1,250° C. or more for 10 seconds or more in an oxidizing atmosphere; and removing a grown-in defect region including silicon oxides in the vicinity of wafer surface layer after the RTP.11-18-2010
20100309461METHOD FOR JUDGING WHETHER SEMICONDUCTOR WAFER IS NON-DEFECTIVE WAFER BY USING LASER SCATTERING METHOD - A semiconductor wafer whose number of LPDs per wafer is equal to or smaller than a predetermined number is sorted out, and a judgment as to whether a semiconductor wafer is a non-defective wafer is made visually based on a haze map of the semiconductor wafer subjected to the sorting. Moreover, a semiconductor wafer whose number of LPDs per wafer is equal to or smaller than a predetermined number is sorted out. Then, from the semiconductor wafers subjected to the sorting, a semiconductor wafer whose in-plane standard deviation and in-plane average value of the haze signals in a wafer plane have a specific relationship is sorted out, and this semiconductor wafer is judged to be a non-defective wafer. In this way, a method for judging whether a semiconductor wafer is a non-defective wafer or a defective wafer, the method that can make a judgment more uniform and accurate without dependence on the difference in the S/N ratio between inspection apparatuses using a laser scattering method, is provided.12-09-2010
20120005509Method and Apparatus for Performing Energy Management via a Sub-System - Various methods for performing energy management via a sub-system are provided. One example method includes receiving a user input while a main processing system is in a power saving mode and buffering a representation of the user input. The example method further includes, in response to receiving the user input, triggering a wake up of a main processing system from the power saving mode, and causing transmission of the representation of the user input to the main processing system for processing. Similar and related example methods and example apparatuses are also provided.01-05-2012
20120244703TRAY FOR CVD AND METHOD FOR FORMING FILM USING SAME - A tray for film formation by a CVD method includes a tray main body (09-27-2012
20140202364METHOD OF WASTE MELTING TREATMENT - A waste-melting method, in which waste is fed into a waste-melting furnace (07-24-2014

Patent applications by Takashi Nakayama, Tokyo JP

Takashi Nakayama, Saitama JP

Patent application numberDescriptionPublished
20100286823ROBOT - Provided is a robot capable of appropriately adjusting a position and the like of a main body in view of executing a specified task involving an interaction with a target object. While the position and posture of the main body (11-11-2010

Takashi Nakayama, Izumisano-Shi JP

Patent application numberDescriptionPublished
20100252411CONTROL METHOD OF PLASMA BY MAGNETIC FIELD IN AN EXHAUST GAS TREATING APPARATUS AND AN EXHAUST GAS TREATING APPARATUS USING THE SAME - [Problem] To present a control method of plasma by magnetic field in an exhaust gas treating apparatus and an exhaust gas treating apparatus using the same, in a simple method and structure, without extremely increasing the consumption of energy, or without lowering the absolute amount of treatment.10-07-2010

Takashi Nakayama, Chiba JP

Patent application numberDescriptionPublished
20090274228Communication Apparatus - A communication apparatus includes a radio-frequency transmission-reception processing unit configured to perform radio-frequency processing to a transmitted signal and a received signal; a baseband processing unit configured to perform baseband processing; a signal detecting unit configured to detect a signal from which a signal transmitted from another communication system is detected; and an interference-to-another-communication-system avoiding unit configured to suppress an interfering signal to the other communication system in radio-frequency transmission processing by the radio-frequency transmission-reception processing unit if the signal detecting unit detects a signal.11-05-2009

Patent applications by Takashi Nakayama, Chiba JP

Takashi Nakayama, Iwaki-City JP

Patent application numberDescriptionPublished
20090231293TOUCH PANEL INPUT DEVICE AND PROCESSING EXECUTION METHOD - A touch panel input device and a processing execution method eliminates wasteful operations of a user and increases user convenience. If a state determination unit (multiple key press detection unit) detects that multiple operation keys displayed on a touch panel screen were multiply pressed, an operation control unit (first processing execution control unit) controls execution of processing corresponding to any one of the plural operation keys. A waiting unit sets a state, which causes processing to wait for a user to make a selection instruction to select and execute processing corresponding to the other operation key. If the selection instruction is accepted, the operation control unit (second processing execution control unit) controls execution of processing corresponding to the selection instruction so as to select and execute the processing corresponding to the other operation key, following the multiple key press.09-17-2009

Takashi Nakayama, Wako-Shi JP

Patent application numberDescriptionPublished
20080238365CHARGING APPARATUS - An apparatus capable of charging a battery mounted on a robot while allowing the robot to remain stably still in the state of standing on its legs is provided. Driving a first connector backward while it is connected with a second connector would cause a body of the robot to tilt as if being pulled by the first connector. However, it is possible to prevent the posture of the robot from becoming unstable by utilizing the fact that the connected state of first signal terminals and second signal terminals is maintained in that state. The backward driving of the first connector is restricted when a charge control unit is capable of communicating with a control system via the first signal terminals and the second signal terminals. This prevents the undesirable event that the posture of the robot becomes unstable due to the first connector being driven backward unconditionally.10-02-2008
20090121673CHARGING SYSTEM FOR WALKING ROBOT AND CHARGING METHOD THEREFOR - A charging system for a walking robot which charges a battery mounted on the walking robot by connecting a power supplying connector provided in a charging station to a power receiving connector in the walking robot, wherein the walking robot is capable of moving without significant restrictions during charging. The charging system includes a lock mechanism for locking the power supplying connector to the power receiving connector. A connector holder holds the power supplying connector detachably, an advancing/retracting mechanism advances and retracts the connector holder in the anteroposterior direction, and a lock operation mechanism performs a lock operation and an unlock operation of the lock mechanism via the connector holder. After an advance of the connector holder, the lock mechanism performs the lock operation to lock the power supplying connector to the power receiving connector. Thereafter, the connector holder is retracted out of the power supplying connector.05-14-2009
20090149993ROBOT - A robot, capable of appropriately adjusting position and/or posture on a current spot to execute a designated task involving interaction with a target object.06-11-2009
20090149995CHARGING APPARATUS FOR MOBILE ROBOT - A charging apparatus for a mobile robot enabling the mobile robot to move relatively freely even during charging using a wiring member, while preventing occurrence of an inconvenience such as damage to the wiring member, is provided. The charging apparatus includes a charging power source, a control board which controls the charging power source, and a wiring members for use in supplying electric power from the charging power source to a battery mounted on the mobile robot. The wiring member connected to the mobile robot to follow the movement of the robot. The charging apparatus further includes a detector which detects tension applied to the wiring member. When the wiring members is pulled, an appropriate measure to stop the mobile robot or disconnect the wiring member from the robot is taken in accordance with a signal from the tension detector.06-11-2009

Patent applications by Takashi Nakayama, Wako-Shi JP

Takashi Nakayama, Ibaraki-City JP

Patent application numberDescriptionPublished
20080288111METHOD AND APPARATUS FOR DETERMINATION OF COAGULANT INJECTION RATE IN WATER TREATMENT PROCESS - Provided are a method and an apparatus that enable rapid and automatic determination of the coagulant injection rate in a process of water treatment through coagulation and sedimentation. Using a coagulation analyzer comprising sample tanks 11-20-2008
20110266227APPARATUS FOR DETERMINING COAGULANT AMOUNT - Provided are a method and an apparatus that enable rapid and automatic determination of the coagulant injection rate in a process of water treatment through coagulation and sedimentation. Using a coagulation analyzer comprising sample tanks 11-03-2011

Takashi Nakayama, Kanagawa JP

Patent application numberDescriptionPublished
20110210457CONTACTOR - [Technical Problem] A contactor is provided which is capable of making fluids of two phases contact each other under a good dispersion state and which can be easily multi-staged.09-01-2011
20120228763SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device including a pillar formed in a highly reliable manner and a method of manufacturing the semiconductor device are disclosed. The semiconductor device includes a semiconductor chip including an internal circuit area and an I/O area disposed outside the internal circuit area, a package substrate coupled in a flip-chip manner to the semiconductor chip, and an electrically conductive pillar disposed between the semiconductor chip and the package substrate such that the electrically conductive pillar is located over two or more wirings in an uppermost wiring layer of the semiconductor chip and such that the two or more wirings are coupled together via the electrically conductive pillar.09-13-2012

Takashi Nakayama, Ina-Shi JP

Patent application numberDescriptionPublished
20110211053SOLID IMAGE PICKUP APPARATUS - A solid image pickup apparatus according to an embodiment includes: a device chip including a first principal surface and a second principal surface, a CMOS device and an electrode portion being formed on the first principal surface; a holding block including a joining surface joined to the second principal surface and an inclined surface inclined inward at a predetermined angle relative to the joining surface; a wiring board including a distal end portion including a connection portion connected to the electrode portion on the first principal surface, an extending portion that is in contact with the inclined surface, the extending portion being joined to the inclined surface via a bonding layer; and a flexure portion flexed at the predetermined angle between the distal end portion and the extending portion.09-01-2011
20110249106IMAGE PICKUP APPARATUS, ENDOSCOPE AND MANUFACTURING METHOD FOR IMAGE PICKUP APPARATUS - An image pickup apparatus includes an image pickup device chip having an image pickup device on a front face and an external connection terminal on a rear face through a via interconnect; a wiring board placed within a projection plane of the image pickup device chip and made up of an intermediate portion whose first main face is connected with the external connection terminal, a first flexing portion and a second flexing portion extended from opposite ends of the intermediate portion and bent toward the intermediate portion at a predetermined angle, and a first extension portion and a second extension portion; and a signal cable connected to the first extension portion and the second extension portion.10-13-2011
20140264697IMAGE PICKUP MODULE AND IMAGE PICKUP UNIT - An image pickup module includes: a wiring board including a first main surface on which chip electrodes are disposed and a second main surface on which the cable electrodes connected respectively to the chip electrodes via respective through wirings are disposed; an image pickup device chip including external electrodes bonded respectively to the chip electrodes; and a cable including conductive wires bonded respectively to the cable electrodes, in which all of the cable electrodes are disposed in a region not facing a region where the chip electrodes are disposed.09-18-2014
20150228678IMAGE PICKUP APPARATUS, ENDOSCOPE, SEMICONDUCTOR APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS - An image pickup apparatus includes: an image pickup device chip that has junction terminals, which is connected with an image pickup unit, on a reverse surface; a cable having lead wires connected with the image pickup unit; and a wiring board that includes junction electrodes joined to the junction terminals, terminal electrodes connected with the lead wires, wirings that connect the junction electrodes formed at a central portion and the terminal electrodes formed at extending portions, and a heat transmission pattern formed in a region where the junction electrodes, the terminal electrodes and the wirings are not formed, the extending portions being bent and thereby the wiring board being arranged within a projected plane of the image pickup device chip.08-13-2015

Patent applications by Takashi Nakayama, Ina-Shi JP

Takashi Nakayama, Kawasaki JP

Patent application numberDescriptionPublished
20120089822INFORMATION PROCESSING DEVICE AND EMULATION PROCESSING PROGRAM AND METHOD - An emulation processing method causing a computer including a first and a second processor to execute emulation processing, the emulation processing method includes: calculate a next instruction address next to a received instruction address, and transmit, to the second processor, the calculated instruction address and instruction information read out on the basis of the calculated instruction address, transmit, to the first processor, a first instruction address that is an instruction address included in an execution result of executed processing, and execute processing based on the instruction information received from the first processor, when a second instruction address that is the instruction address received from the first processor is identical to the first instruction address, and read out instruction information on the basis of the first instruction address and execute processing based on the instruction information read out, when the second instruction address is not identical to the first instruction address.04-12-2012

Takashi Nakayama, Minamisaitama-Gun JP

Patent application numberDescriptionPublished
20120267979ROTARY ELECTRIC MACHINE AND METHOD OF MANUFACTURING SAME - A rotary electric machine includes a plurality of lead end holding grooves defined in insulators at an outer circumferential surface of a stator core, for guiding respective ends of coil leads therein. The lead end holding grooves are defined by ledges of the insulators. The ledges have respective lands which are convex in widthwise directions of the lead end holding groove.10-25-2012

Takashi Nakayama, Tenshin-Shi JP

Patent application numberDescriptionPublished
20140003877DRILL01-02-2014

Takashi Nakayama, Kawasaki-Shi JP

Patent application numberDescriptionPublished
20150270210Semiconductor Device - A semiconductor device includes a first semiconductor and second semiconductor chips mounted over a package substrate. The first semiconductor chip includes a plurality of first bonding pads which are arranged along one side of the first semiconductor chip. The second semiconductor chip includes a plurality of second bonding pads and at least one third bonding pad. The second bonding pads are arranged along one side of the second semiconductor chip and for coupling respectively to the first bonding pads by wire-bonding coupling. The at least one third bonding pad is for enabling relay coupling of a corresponding second bonding pad to at least one predetermined first bonding pad which is arranged along the second bonding pads and included in the first bonding pads without crossing another wire in the wire-bonding coupling.09-24-2015
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