| Patent application number | Description | Published |
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| 20090278239 | Silicon Wafer and Production Method Thereof - In a silicon wafer having an oxygen precipitate layer, a depth of DZ layer ranging from a wafer surface to an oxygen precipitate layer is 2 to 10 μm and an oxygen precipitate concentration of the oxygen precipitate layer is not less than 5×10 | 11-12-2009 |
| 20100009521 | METHOD OF PRODUCING SEMICONDUCTOR WAFER - There is provided a production method in which the beveling step conducted for preventing the cracking or chipping in a raw wafer during the grinding can be omitted when the raw wafer cut out from a crystalline ingot is processed into a double-side mirror-finished semiconductor wafer and a semiconductor wafer can be obtained cheaply by shortening the whole of the production steps for the semiconductor wafer and decreasing the machining allowance of silicon material in the semiconductor wafer to reduce the kerf loss of the semiconductor material as compared with the conventional method. | 01-14-2010 |
| 20100290971 | SILICON WAFER AND METHOD FOR PRODUCING THE SAME - It is possible to provide a silicon wafer that as well as being free of COPs and dislocation clusters, has defects (grown-in defects including silicon oxides), which are not overt in an as-grown state, such as OSF nuclei and oxygen precipitate nuclei existing in the PV region, to be vanished or reduced, by adopting a method for producing a silicon wafer, the method comprising the steps of: growing a single crystal silicon ingot by the Czochralski method; cutting a silicon wafer out of the ingot; subjecting the wafer to an RTP at 1,250° C. or more for 10 seconds or more in an oxidizing atmosphere; and removing a grown-in defect region including silicon oxides in the vicinity of wafer surface layer after the RTP. | 11-18-2010 |
| 20100309461 | METHOD FOR JUDGING WHETHER SEMICONDUCTOR WAFER IS NON-DEFECTIVE WAFER BY USING LASER SCATTERING METHOD - A semiconductor wafer whose number of LPDs per wafer is equal to or smaller than a predetermined number is sorted out, and a judgment as to whether a semiconductor wafer is a non-defective wafer is made visually based on a haze map of the semiconductor wafer subjected to the sorting. Moreover, a semiconductor wafer whose number of LPDs per wafer is equal to or smaller than a predetermined number is sorted out. Then, from the semiconductor wafers subjected to the sorting, a semiconductor wafer whose in-plane standard deviation and in-plane average value of the haze signals in a wafer plane have a specific relationship is sorted out, and this semiconductor wafer is judged to be a non-defective wafer. In this way, a method for judging whether a semiconductor wafer is a non-defective wafer or a defective wafer, the method that can make a judgment more uniform and accurate without dependence on the difference in the S/N ratio between inspection apparatuses using a laser scattering method, is provided. | 12-09-2010 |
| 20120005509 | Method and Apparatus for Performing Energy Management via a Sub-System - Various methods for performing energy management via a sub-system are provided. One example method includes receiving a user input while a main processing system is in a power saving mode and buffering a representation of the user input. The example method further includes, in response to receiving the user input, triggering a wake up of a main processing system from the power saving mode, and causing transmission of the representation of the user input to the main processing system for processing. Similar and related example methods and example apparatuses are also provided. | 01-05-2012 |
| 20120244703 | TRAY FOR CVD AND METHOD FOR FORMING FILM USING SAME - A tray for film formation by a CVD method includes a tray main body ( | 09-27-2012 |
| 20140202364 | METHOD OF WASTE MELTING TREATMENT - A waste-melting method, in which waste is fed into a waste-melting furnace ( | 07-24-2014 |
| Patent application number | Description | Published |
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| 20080238365 | CHARGING APPARATUS - An apparatus capable of charging a battery mounted on a robot while allowing the robot to remain stably still in the state of standing on its legs is provided. Driving a first connector backward while it is connected with a second connector would cause a body of the robot to tilt as if being pulled by the first connector. However, it is possible to prevent the posture of the robot from becoming unstable by utilizing the fact that the connected state of first signal terminals and second signal terminals is maintained in that state. The backward driving of the first connector is restricted when a charge control unit is capable of communicating with a control system via the first signal terminals and the second signal terminals. This prevents the undesirable event that the posture of the robot becomes unstable due to the first connector being driven backward unconditionally. | 10-02-2008 |
| 20090121673 | CHARGING SYSTEM FOR WALKING ROBOT AND CHARGING METHOD THEREFOR - A charging system for a walking robot which charges a battery mounted on the walking robot by connecting a power supplying connector provided in a charging station to a power receiving connector in the walking robot, wherein the walking robot is capable of moving without significant restrictions during charging. The charging system includes a lock mechanism for locking the power supplying connector to the power receiving connector. A connector holder holds the power supplying connector detachably, an advancing/retracting mechanism advances and retracts the connector holder in the anteroposterior direction, and a lock operation mechanism performs a lock operation and an unlock operation of the lock mechanism via the connector holder. After an advance of the connector holder, the lock mechanism performs the lock operation to lock the power supplying connector to the power receiving connector. Thereafter, the connector holder is retracted out of the power supplying connector. | 05-14-2009 |
| 20090149993 | ROBOT - A robot, capable of appropriately adjusting position and/or posture on a current spot to execute a designated task involving interaction with a target object. | 06-11-2009 |
| 20090149995 | CHARGING APPARATUS FOR MOBILE ROBOT - A charging apparatus for a mobile robot enabling the mobile robot to move relatively freely even during charging using a wiring member, while preventing occurrence of an inconvenience such as damage to the wiring member, is provided. The charging apparatus includes a charging power source, a control board which controls the charging power source, and a wiring members for use in supplying electric power from the charging power source to a battery mounted on the mobile robot. The wiring member connected to the mobile robot to follow the movement of the robot. The charging apparatus further includes a detector which detects tension applied to the wiring member. When the wiring members is pulled, an appropriate measure to stop the mobile robot or disconnect the wiring member from the robot is taken in accordance with a signal from the tension detector. | 06-11-2009 |
| Patent application number | Description | Published |
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| 20110211053 | SOLID IMAGE PICKUP APPARATUS - A solid image pickup apparatus according to an embodiment includes: a device chip including a first principal surface and a second principal surface, a CMOS device and an electrode portion being formed on the first principal surface; a holding block including a joining surface joined to the second principal surface and an inclined surface inclined inward at a predetermined angle relative to the joining surface; a wiring board including a distal end portion including a connection portion connected to the electrode portion on the first principal surface, an extending portion that is in contact with the inclined surface, the extending portion being joined to the inclined surface via a bonding layer; and a flexure portion flexed at the predetermined angle between the distal end portion and the extending portion. | 09-01-2011 |
| 20110249106 | IMAGE PICKUP APPARATUS, ENDOSCOPE AND MANUFACTURING METHOD FOR IMAGE PICKUP APPARATUS - An image pickup apparatus includes an image pickup device chip having an image pickup device on a front face and an external connection terminal on a rear face through a via interconnect; a wiring board placed within a projection plane of the image pickup device chip and made up of an intermediate portion whose first main face is connected with the external connection terminal, a first flexing portion and a second flexing portion extended from opposite ends of the intermediate portion and bent toward the intermediate portion at a predetermined angle, and a first extension portion and a second extension portion; and a signal cable connected to the first extension portion and the second extension portion. | 10-13-2011 |
| 20140264697 | IMAGE PICKUP MODULE AND IMAGE PICKUP UNIT - An image pickup module includes: a wiring board including a first main surface on which chip electrodes are disposed and a second main surface on which the cable electrodes connected respectively to the chip electrodes via respective through wirings are disposed; an image pickup device chip including external electrodes bonded respectively to the chip electrodes; and a cable including conductive wires bonded respectively to the cable electrodes, in which all of the cable electrodes are disposed in a region not facing a region where the chip electrodes are disposed. | 09-18-2014 |
| 20150228678 | IMAGE PICKUP APPARATUS, ENDOSCOPE, SEMICONDUCTOR APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS - An image pickup apparatus includes: an image pickup device chip that has junction terminals, which is connected with an image pickup unit, on a reverse surface; a cable having lead wires connected with the image pickup unit; and a wiring board that includes junction electrodes joined to the junction terminals, terminal electrodes connected with the lead wires, wirings that connect the junction electrodes formed at a central portion and the terminal electrodes formed at extending portions, and a heat transmission pattern formed in a region where the junction electrodes, the terminal electrodes and the wirings are not formed, the extending portions being bent and thereby the wiring board being arranged within a projected plane of the image pickup device chip. | 08-13-2015 |
