Patent application number | Description | Published |
20090038288 | Filter Clogging Determination Apparatus for Diesel Engine - A clogging determination apparatus determines clogging of a DPF (Diesel Particulate Filter) such that exhaust pressure is estimated using a sensor deigned for regular control of an engine, without using exhaust pressure sensor. The apparatus includes: the DPF disposed in an exhaust system; an exhaust sensor that measures an air-fuel ratio λ in exhaust gas; and an injector that changes the air-fuel ratio in an cylinder through post-injection. A response time T taken for the exhaust sensor to detect a change in the air-fuel ratio is measured from the time when the post-injection is output from the injector. If this response time T is longer than a clogging determination response time To, the apparatus determines that the DPF is clogged. | 02-12-2009 |
20090061950 | INFORMATION SHARING SYSTEM, INFORMATION SHARING METHOD, TERMINAL DEVICE AND PROGRAM - [Problems] To share information in one of divided screens of a terminal device with members performing PoC communications. | 03-05-2009 |
20100264414 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING SAME - In the current manufacturing process of LSI, or semiconductor integrated circuit device, the step of assembling device (such as resin sealing step) is normally followed by the voltage-application test (high-temperature and high-humidity test) in an environment of high temperature (such as an approximate range from 85 to 130° C.) and high humidity (such as about 80% RH). For that test, the inventors of the present invention found the phenomenon of occurrence of separation of titanium nitride film as the anti-reflection film from upper film and of generation of cracks in the titanium nitride film at an edge part of upper surface of the aluminum-based bonding pad applied with a positive voltage during the high-temperature and high-humidity test caused by an electrochemical reaction due to moisture incoming through the sealing resin and the like to generate oxidation and bulging of the titanium nitride film. An invention of the present application is to remove the titanium nitride film over the pad in a ring or slit shape at peripheral area of the aluminum-based bonding pad. | 10-21-2010 |
20110058015 | PHOTOGRAPHING DEVICE, PORTABLE INFORMATION PROCESSING TERMINAL, MONITOR DISPLAY METHOD FOR PHOTOGRAPHING DEVICE, AND PROGRAM - To provide are a photographing device, a portable information processing terminal, a monitor display method for the photographing device, and a program, which can easily perform a panoramic photographing by simplifying a monitor display figure to support photographing of a panoramic image. Monitor means | 03-10-2011 |
20120105309 | INFORMATION SHARING SYSTEM, INFORMATION SHARING METHOD, TERMINAL DEVICE AND PROGRAM - [PROBLEMS] To share information in one of divided screens of a terminal device with members performing PoC communications. | 05-03-2012 |
20130065330 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING SAME - In manufacturing an LSI, or semiconductor integrated circuit device, the step of assembling device (such as resin sealing step) is normally followed by a voltage-application test in an environment of high temperature (e.g., from 85 to 130° C.) and high humidity (e.g., about 80% RH). It has been found that separation of a titanium nitride anti-reflection film from an upper film and generation of cracks in the titanium nitride film at an upper surface edge part of the aluminum-based bonding pad applied with a positive voltage in the test is caused by an electrochemical reaction due to moisture incoming through the sealing resin and the like to generate oxidation and bulging of the titanium nitride film. These problems are addressed by removing the titanium nitride film over the pad in a ring or slit shape at peripheral area of the aluminum-based bonding pad. | 03-14-2013 |
20130082969 | ELECTRONIC DEVICE USING TOUCH PANEL INPUT AND METHOD FOR RECEIVING OPERATION THEREBY - Provided are a display, which displays a screen, and a touch panel, which is disposed on the display. In accordance with a series of consecutive operations by a user to the touch panel involving touch operation, drag operation, and release operation, the following are accepted: the selection of an action area from among one or more action areas displayed on the basis of a touched area on the touch panel at the time of a user's touch operation, and the execution of an action corresponding to the action area. | 04-04-2013 |
20150194381 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING SAME - In manufacturing an LSI, or semiconductor integrated circuit device, the step of assembling device (such as resin sealing step) is normally followed by a voltage-application test in an environment of high temperature (e.g., from 85 to 130° C.) and high humidity (e.g., about 80% RH). It has been found that separation of a titanium nitride anti-reflection film from an upper film and generation of cracks in the titanium nitride film at an upper surface edge part of the aluminum-based bonding pad applied with a positive voltage in the test is caused by an electrochemical reaction due to moisture incoming through the sealing resin and the like to generate oxidation and bulging of the titanium nitride film. These problems are addressed by removing the titanium nitride film over the pad in a ring or slit shape at peripheral area of the aluminum-based bonding pad. | 07-09-2015 |