Patent application number | Description | Published |
20080237066 | Electrolytic processing unit device, and method for electrolytic processing, washing, and drying - An electrolytic processing unit device includes an electrolytic processor for performing electrolytic processing on a wafer, a washer for washing the processed wafer, and a drier for drying the wafer. The electrolytic processor, the washer, and the drier are placed in one processing chamber to form one module. In this manner, the electrolytic processing procedure, the washing procedure, and the drying procedure for wafers can be continuously carried out in one place. | 10-02-2008 |
20080242197 | Wafer polish monitoring method and device - The present invention aims to provide a wafer polish monitoring method and device for detecting the end point of the polishing of a conductive film with high precision and accuracy by monitoring the variation of the film thickness of the conductive film without adverse influence of slurry or the like after the film thickness of the conductive film decreases to an extremely small film thickness defined by the skin depth. To achieve this objective, the present invention provides a wafer polish monitoring method by which a high-frequency transmission path is formed in a portion facing the conductive film on the surface of the wafer, the polishing removal state of the conductive film is evaluated based at least on the transmitted electromagnetic waves passing through the high-frequency transmission path or the reflected electromagnetic waves that are reflected without passing through the high-frequency transmission path, and the end point of the polishing removal and the point equivalent to the end point of the polishing removal are detected. | 10-02-2008 |
20080248723 | Polishing condition control apparatus and polishing condition control method of CMP apparatus - To eliminate the unevenness of the film thickness of the wafers, and increase the polishing efficiency, reduce the running cost and enhance the production yield. A CMP apparatus | 10-09-2008 |
20080268751 | Polishing condition control apparatus and polishing condition control method of CMP apparatus - To eliminate the unevenness of the remaining film thickness of the wafers, and increase the polishing efficiency, reduce the running cost and enhance the yield. A CMP apparatus | 10-30-2008 |
20080290865 | Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof - An object of the present invention is to provide a method of forecasting and detecting a polishing endpoint and the device thereof and a real time film thickness monitoring method and the device thereof capable of suppressing a Joule heat loss to the minimum due to an eddy current, and precisely forecasting and detecting the polishing endpoint, and moreover, precisely calculating a remaining film amount to be removed and a polishing rate and the like on the spot so as to be able to accurately evaluate whether the predetermined conductive film is appropriately removed. | 11-27-2008 |
20090058409 | Method and device for forecasting polishing end point | 03-05-2009 |
20090061733 | Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thickness - [Problem to be Solved] To provide a method and device for forecasting/detecting a polishing end point and a method and device for monitoring a real-time film thickness to suppress Joule heat loss due to the eddy current to the minimum, to precisely forecast/detect an polishing end point, to precisely calculate the remaining film thickness to be removed, polishing rate and the like on the spot, and to precisely evaluate whether the predetermined conductive film is appropriately removed | 03-05-2009 |
20090221216 | Pad dresser, polishing device, and pad dressing method - Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip part of each element wire of elastic member contacts polishing pad with the tip end cut round and performs dressing of polishing pad. The wire size of the tip part of each element wire of elastic member is made to be fine and the cutting width on polishing pad is made to be narrow, and at the same time, the rigidity of elastic member is made to be enhanced by bundling each element wire of elastic member with pencil band, and a large pressure is made to be pressed to the fine tip part of each element wire. Therefore, the tip part of elastic member can give an effective incision depth to polishing pad. | 09-03-2009 |
20090256558 | Film thickness measuring apparatus and film thickness measuring method - Coil is made to be disposed with gap opposed to the surface of wafer, and wafer stage is made to move in X and Y direction and R and θ direction. When supplying an alternating current to coil with the frequency swept by impedance analyzer, the magnetic field made to be induced in coil will operate on the conductive film of wafer. By changing a parameter (a frequency or an angle) influencing the skin effect of the conductive film and giving the parameter to coil, the state where a magnetic field is not made to penetrate relatively the film of wafer and the state where the magnetic field is made to penetrate relatively the film can be formed. From the variation of various values corresponding to the eddy current induced based on the change of state influenced by the skin effect of the conductive film, the film thickness of wafer can be measured with sufficient accuracy. | 10-15-2009 |
20100120336 | Polishing method and polishing apparatus - An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce scratches due to the polishing by-product, and can suppress consumption of slurry to the minimum to realize cost reduction during running for mass production. | 05-13-2010 |
20140079532 | HYDRAULIC MACHINE AND METHOD OF OPERATING SAME - In one embodiment, a hydraulic machine includes a runner including a plurality of blades arranged in a ring shape, a crown connected to the blades from an upper side and having a lower end surface at a position surrounded by the blades, and a band connected to the blades from a lower side, the runner being configured to convert energy of pressured water into rotational energy. The machine further includes a main shaft configured to transmit the rotational energy of the runner to a generator, and a draft pipe located downstream of the runner, and configured so that the water used to drive the runner flows into the draft pipe. The machine further includes a columnar member disposed on a rotation axis of the main shaft below the crown, and having a diameter smaller than a diameter of the lower end surface of the crown. | 03-20-2014 |
20140261906 | BEARING STEEL AND METHOD FOR PRODUCING SAME - A bearing steel includes, as a metallographic structure, inclusions which contain complex oxysulfides including Rare Earth Metal, Ca, O, S, and Al, TiN, MnS, Al | 09-18-2014 |
20140361718 | VARIABLE SPEED CONTROL APPARATUS AND OPERATION METHOD - According to one embodiment, there is provided a variable speed control apparatus applied to a variable speed system of secondary excitation including a double feed synchronous machine and a frequency converter. The variable speed control apparatus includes a secondary current controller configured to control an output current from the frequency converter, and a secondary current limiter configured to limit an effective component current command and a reactive component current command of a secondary current for the secondary current controller by using a given secondary current limit value and output a limited result to the secondary current controller. | 12-11-2014 |