Patent application number | Description | Published |
20090027702 | IMAGE FORMING APPARATUS - Disclosed is an image forming apparatus in which a visualized background pattern image data in which a latent image is visualized is generated, the generated visualized background pattern image data and an image data of a job are synthesized to generate a visualized background pattern synthesizing image data, and a visualized background pattern synthesizing image in which the latent image is visualized is formed based on the generated visualized background pattern synthesizing image data, to output the visualized background pattern synthesizing image on a printing sheet, at the time of a confirmation printing. Thus, a user can easily confirm the state of an invisible background pattern synthesizing image after reproduction with eyes, before the outputting of the set number of copies to be output. | 01-29-2009 |
20100123162 | OPTICAL SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME - An optical semiconductor apparatus can be configured by mounting an optical semiconductor element on a package substrate using a solder paste. The optical semiconductor apparatus can include a package substrate and a metal die pad formed on the substrate, and an optical semiconductor element bonded to the die pad with a solder material. The substrate can be made of a ceramic base material. A plurality of through holes can be formed in the substrate so that the through holes penetrate both the substrate base material and the die pad. Each of the through holes can have an inner surface where the ceramic base material is exposed. Each through hole can have an opening diameter greater than or equal to 40 μm and less than or equal to 100 μm. The plurality of through holes can be formed such that the total area of the openings of the through holes is 50% or less of the bonded area between the optical semiconductor element and the die pad including the through holes covered with the solder material. The through holes can be covered with the solder material at the upper end thereof where the optical semiconductor element and the die pad are bonded to each other. | 05-20-2010 |
20100321941 | METHOD FOR MANUFACTURING LIGHT EMITTING APPARATUS, LIGHT EMITTING APPARATUS, AND MOUNTING BASE THEREOF - The present invention provides a method for manufacturing a light emitting apparatus which can be separated by splitting, even though a mounting plate made of metal is employed. A metal plate is prepared, on which at least one joint slit made up of a joint and an opening is formed in a predetermined direction for integrating multiple mounting plates of the light emitting apparatuses. Multiple light emitting elements set in array are mounted on the metal plate. An aperture is provided at a position corresponding to a position for mounting the light emitting element on the metal plate, and a plate-like reflector made of resin, on which a first reflector splitting groove is formed at a position coinciding with the joint slit of the metal plate, is mounted and fixed on the metal plate in such a manner as superimposed thereon. The metal plate and the plate-like reflector being superimposed and fixed one on another are broken along the joint slit of the metal plate and the first reflector splitting groove of the plate-like reflector. The metal plate and the resinous reflector are superimposed one on another and broken together, whereby the metal plate can be split successfully. | 12-23-2010 |
20110116271 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed. | 05-19-2011 |
20120188772 | LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING THE SAME, AND ILLUMINATING DEVICE - A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer. | 07-26-2012 |
20120242216 | LIGHT-EMITTING DEVICE - A light-emitting device that suppresses color unevenness can be provided. A transparent member can be disposed on a fluorescence-containing resin layer. Part of excitation light can be emitted upward from an edge surface of the fluorescence-containing resin layer directly and without passing through the transparent member. Thus, fluorescent light emitted in large quantities from a place near an edge surface of the transparent member can be mixed with the excitation light emitted from the edge surface of the fluorescence-containing resin layer directly without passing through the transparent member, thereby suppressing color unevenness at a location near the edge surface of the transparent member. | 09-27-2012 |
20140004634 | METHOD FOR MANUFACTURING LIGHT EMITTING APPARATUS, LIGHT EMITTING APPARATUS, AND MOUNTING BASE THEREOF | 01-02-2014 |
20150108523 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A reliable semiconductor light-emitting device can include a mounting board, at least one semiconductor light-emitting chip mounted on the mounting board, a wavelength converting layer having a side surface covering the light-emitting chip, and a seal member having an opening contacting the side surface of the wavelength converting layer and covering chip electrodes. The light-emitting device can also include a transparent layer disposed into the opening of the sealing member so as to be located over the light-emitting chip and within a top surface of the light-emitting chip, and can be configured to emit various mixture lights having a high uniformity by using lights emitted from the light-emitting chip and the wavelength converting layer. Thus, the disclosed subject matter can provide the reliable light-emitting device, which can emit the mixture lights including a substantially white color light from a small light-emitting surface as a light source for a headlight, etc. | 04-23-2015 |